[1]顿福胜*,李岩峰,周吉林,等.无氨化学镍工艺及其应用[J].电镀与精饰,2021,(2):51-54.[doi:10.3969/j.issn.1001-3849.2021.02.0110]
　DUN Fusheng*,LI Yanfeng,ZHOU Jilin,et al.顿福胜1*，李岩峰1，周吉林2，洪铁军3，孙国庆4[J].Plating & Finishing,2021,(2):51-54.[doi:10.3969/j.issn.1001-3849.2021.02.0110]
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无氨化学镍工艺及其应用()

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2021年2
页码:
51-54
栏目:
出版日期:
2021-02-01

文章信息/Info

Title:
顿福胜1*，李岩峰1，周吉林2，洪铁军3，孙国庆4
作者:
顿福胜1*; 李岩峰1; 周吉林2; 洪铁军3; 孙国庆4
1.安美特（中国）化学有限公司天津静海分公司，天津 300160； 2.大连市表面工程协会，辽宁大连 116021； 3.丹东市鸭绿江技术表面处理中心，辽宁 丹东 118001； 4.中国表面工程协会，北京 100011
Author(s):
DUN Fusheng1*;  LI Yanfeng1;  ZHOU Jilin2;  HONG Tiejun3;  SUN Guoqing4
1.Atotech （China） Chemicals Ltd.， Tianjin Jinghai Branch， Tianjin 300160， China；　2.Dalian Surface Engineering Association， Dalian 116021， China；　3.Dandong Yalu River Technology Surface Treatment Center， Dandong 118001， China； 4.China Surface Engineering A
关键词:
无氨化学镍; 塑料电镀; 工艺
Keywords:
ammonia-free electroless nickel plastic electroplating process
DOI:
10.3969/j.issn.1001-3849.2021.02.0110
文献标志码:
A
摘要:
介绍了用于塑料电镀的无氨化学镍的特点、组成及操作参数，并对实际生产中出现的问题进行了分析，提出相应的解决方法。与传统化学镍相比，该无氨化学镍增加了无铅稳定剂、pH调整剂和抗菌剂，综合成本相当，可替代传统化学镍工艺，用于大规模生产。
Abstract:
The characteristics, composition and operating parameters of ammonia-free electroless nickel used for plastic electroplating were introduced. The problems in actual production were analyzed and the corresponding solutions were put forward. Compared with the traditional electroless nickel, the lead-free stabilizer, pH regulator and antimicrobial agent were added into the ammonia-free electroless nickel process, and the comprehensive cost was comparable, so it can replace the traditional electroless nickel process and be used in mass production.

参考文献/References:

[1] 陈月华, 刘永永, 江德凤, 等. 化学镀镍施镀过程稳定性分析[J]. 表面技术, 2013, 42(2): 74-76.
Chen Y H, Liu Y Y, Jiang D F, et al. Evaluation on plating stability in electroless nickel deposition [J]. Surface Technology, 2013, 42(2): 74-76 (in Chinese).
[2] 王丽丽. 化学镀镍工艺[J]. 电镀与精饰, 2002, 24(3):41-43.
Wang L L. Process of nickel electroless plating [J]. Plating & Finishing, 2002, 24(3): 41-43 (in Chinese).
[3] 罗守福, 胡文彬. 实用化学镀镍的发现、发展、现状和前景[J]. 电镀与精饰, 1996, 18(5): 31-32.
Luo S F, Hu W B. Discovery, development, present situation and prospect of practical electroless nickel plating [J]. Plating & Finishing, 1996, 18(5): 31-32 (in Chinese).
[4] 刘明举, 程纪华. 化学镀镍镀层质量影响因素的分析[J]. 电镀与精饰, 2020, 42(12): 1-4.
Liu M J, Cheng J H. Research on the factors affecting the quality of electroless nickel plating [J]. Plating & Finishing, 2020, 42(12): 1-4 (in Chinese).
[5] 钟发平, 邹超, 李新兴, 等. 一种碱性无氨化学镍溶液及其化学镀镍的方法[P]. 中国专利: 201811477986.6, 2019-01-25.
[6] 阎治孝, 朱利群, 刘盛东, 等. 中、俄双方表面处理工艺对比分析手册[M]. 北京: 北京航空航天大学出版社,2001.

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备注/Memo

备注/Memo:
收稿日期：2020-09-25；修回日期：2020-10-30
通信作者：顿福胜，email：fulton.dun@atotech.com
更新日期/Last Update: 2021-02-10