Wang Qingfu,Wang Xujun,Fan Binfeng,et al.Study on optimization of copper foil process parameters by response surface method[J].Plating & Finishing,2024,(4):81-89.[doi:10.3969/j.issn.1001-3849.2024.04.012]
响应面法优化铜箔工艺参数的研究
- Title:
- Study on optimization of copper foil process parameters by response surface method
- Keywords:
- copper foil ; tensile strength ; elongation ; process parameters ; response surface method
- 分类号:
- TQ153.1
- 文献标志码:
- A
- 摘要:
- 通过单因素及响应面试验优化铜箔生产工艺参数对铜箔抗拉强度及延伸率的影响。结果发现，响应面优化最佳工艺条件为温度 60 ℃ ，电流密度 65 A/dm 2 ，上液流量为 55 m 3 /h ，且各因素对抗拉强度的影响大小为电流密度 > 温度 > 上液流量，对延伸率的影响大小为温度 > 电流密度 > 上液流量，其中温度和电流密度对铜箔抗拉强度的交互作用显著，最优工艺条件下制备的铜箔（ 111 ）晶面的衍射强度最大，织构系数为 46.9% ，具有明显的择优取向。
- Abstract:
- ： The effects of copper foil production process parameters on tensile strength and elongation of copper foil were optimized by single factor and response surface test. The results show that the optimal process conditions for the optimization of the response surface are temperature of 60 °C ， current density of 65 A/dm 2 ， liquid flow of 55 m 3 /h ， and the influence of each factor on tensile strength is current density> temperature > liquid flow ， and the influence on elongation is temperature> current density > liquid flow ， in which the interaction between temperature and current density on the tensile strength of copper foil is significant. In addition ， the crystal face of copper foil （ 111 ） prepared under optimal process conditions has the largest diffraction intensity and a texture coefficient of 46.9% ， which has an obvious preference orientation.
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备注/Memo
收稿日期： 2023-09-17 修回日期： 2023-10-12 作者简介： 王庆福（ 1987 —），男，工程师， email ： wangqf@londianwason.com * 通信作者： 李谋翠（ 1995 —），女，硕士， email ： lmc201885@163.com?/html>