Guo Chongwu*,Zhan Xinggang,Wang Daming,et al.Boundary conditions for the cyanide-free potassium chloride cadmium plating[J].Plating & Finishing,2024,(12):114-119.
氯化钾无氰镀镉工艺的边界条件
- Title:
- Boundary conditions for the cyanide-free potassium chloride cadmium plating
- Keywords:
- cyanide-free cadmium plating; cadmium chloride; potassium chloride; complexing agent; brightener; adjuvant; boundary conditions; corrosion resistance of coating
- 分类号:
- TQ153
- 文献标志码:
- A
- 摘要:
- 介绍了氯化钾无氰镀镉工艺的研究开发过程,依据实验室试验与生产实践制定了工艺边界条件。氯化镉 25 g/L~35 g/L,氯化钾80 g/L~140 g/L,PULIZIER NCC-617 AC络合剂100 g/L~140 g/L,PULIZIER NCC-617 Base辅助剂25 mL/L~30 mL/L,PULIZIER NCC-617 Bri光亮剂1.5 mL/L~2.5 mL/L,PULIZIER NCC-617 HCD高区光亮剂5 mL/L~10 mL/L,镀槽温度20 ℃~35 ℃,pH值7~9,阴极电流密度0.5 A/dm2~1.5 A/dm2(可放宽至0.5 A/dm2~2.0 A/dm2),阴极移动2 m/min~4 m/min,阳极采用镉的质量分数≥99.97%的镉板。在实验室制备钢铁表面无氰镀镉及六价铬彩色钝化样件,进行中性盐雾试验20 064 h样件表面无白锈。本工艺在镀层耐蚀性方面取得了重大进步,具有良好的应用前景。
- Abstract:
- The research and development process of cyanide-free potassium chloride cadmium plating was introduced. The boundary conditions of the process were established according to laboratory experiment and production practice. Cadmium chloride is 25 g/L-35 g/L, potassium chloride 8 g/L- 140 g/L, PULIZIER NCC-617 AC complexing agent 100-140 g/L, PULIZIER NCC-617 Base adjuvant 25 mL/L-30 mL/L, PULIZIER NCC-617 Bri brightener 1.5 -2.5 mL/L, PULIZIER NCC-617 HCD high zone brightener 5 mL/L-10 mL/L, plating bath temperature is 20 ℃-35 ℃, range of pH is 7-9, the cathode current density 0.5 A/dm2-1.5 A/dm2 (can be relaxed to 0.5 A/dm 2-2.0 A/dm2), the cathode moves 2-4 m/min, and the anode adopts cadmium plate with cadmium mass fraction ≥ 99.97%. The samples of cyanide-free cadmium plating and chromium-hexavalent color passivation on the surface of steel were prepared in the laboratory, and no white rust was found on the surface of the samples after the neutral salt spray test 20064 h. This process has made great progress in the corrosion resistance of the coating and has a good application prospect
参考文献/References:
[1].郭崇武. 新型酸性无氰镀镉工艺的开发研究[J]. 电镀与涂饰, 2016, 35(5): 250-255.
[2].陈建瑞, 郭崇武. 无氰酸性镀镉在航空航天零部件上的应用[J]. 电镀与精饰, 2017, 39(3): 23-24, 28.
[3].代朋民, 唐亓. 新型无氰镀镉工艺的研究与应用[J]. 电镀与精饰, 2017, 39(2): 35-38.
[4].王大铭, 郭崇武. 氯化钾无氰镀镉工艺的维护[J]. 电镀与涂饰, 2018, 37(23): 1099-1101.
[5].广州超邦化工有限公司. 氯化钾无氰镀镉溶液中羧酸类配位剂的分析方法[P]. 中国专利]: 201710507952.6, 2020-03-24.
[6].郭崇武, 王小琴. 分析氯化钾无氰镀镉溶液中氯化镉的新方法[J]. 电镀与涂饰, 2017, 36(19): 1064-1066.
[7].王小琴, 郭崇武. 返滴定法测定氯化钾无氰镀镉溶液中氯化镉[J]. 电镀与精饰, 2018, 40(3): 44-46.
[8].陈媚, 郭崇武, 黎小阳. 氯化钾无氰镀镉溶液中铜杂质的分析[J]. 电镀与涂饰, 2017, 36(3): 169-170.
[9].罗小平, 郭崇武, 冼翠玲. 原子吸收光谱法测定无氰镀镉溶液中的铅杂质[J]. 电镀与涂饰, 2017, 36(5): 265-266.
[10].郭崇武, 陈建锐, 李小花. 钛铁试剂分光光度法测定氯化钾无氰镀镉溶液中的铁杂质[J]. 电镀与涂饰, 2017, 36(24): 1325-1326.
[11].陈康, 郭崇武, 代朋民. 氯化钾无氰镀镉故障的处理措施[J]. 电镀与涂饰, 2017, 36(5): 257-259.
[12].郭崇武, 王小东. 氯化钾无氰镀镉故障分析与处理[J]. 电镀与涂饰, 2017, 36(23): 1271-1272.
[13].王大铭, 郭崇武. 锡杂质引起的氯化钾无氰镀镉故障及其排除方法[J]. 电镀与涂饰, 2019, 38(9): 435-436.
[14].郭崇武, 代朋民. 螯合沉淀法去除氯化钾无氰镀镉废水中的镉离子[J]. 电镀与涂饰, 2018, 37(4): 190-192.
[15].黎小阳, 郭崇武. 氯化钾无氰镀镉和钝化混合废水的处理工艺[J]. 电镀与涂饰, 2020, 39(9): 570-572.
[16].郭崇武, 陈康. 用亚铁离子和钙离子协同沉淀柠檬酸盐镀镍废水中的配位剂[J]. 电镀与涂饰, 2017, 36(23): 225-228.
[17].Guo C W, Lai H W. Method for integrated treatment of electroplating wastewater[P]. 美国专利: 11136254 B2, 2021-10-05.
[18].Guo C W, Lai H W. Method for treatment of mixed electroplating wastewater without cyanide and phosphorus-containing reduction: US 11685681 B2[P]. 2027-06-27.
[19].赖奂汶, 郭崇武, 陈媚, 等. 超高耐蚀性氯化钾镀镉防护层的制备[J]. 电镀与涂饰, 2021, 40(3): 1762-1766.
[20].广州超邦化工有限公司. 酸性无氰镀镉添加剂、镀液制备及电镀工艺[P]. 中国专利: 201610785483.X, 2018-06-28.
[21].广州超邦化工有限公司. 一种酸性无氰镀镉溶液中氯化镉的分析方法[P].: 中国专利: 201710507952.6, 2018-07-10.
[22].广州超邦化工有限公司. 一种不含EDTA的酸性无氰镀镉废水中镉离子的处理方法[P]. 中国专利: 201610710696.6, 2019-08-13.
[23].广州超邦化工有限公司. 一种适用于海洋强腐蚀环境下的金属表面镀层结构的制备方法[P] 中国专利: 201711464894.X, 2019-07-12.
[24].广州超邦化工有限公司. 处理氯化钾无氰镀镉废水的方法[P] 中国专利: 201810226367.3, 2021-12-24.
[25].广州超邦化工有限公司. 氯化钾无氰镀镉和钝化混合废水的处理方法[P]. 中国专利: 201810872068.7, 2022-02-01.
[26].广州超邦化工有限公司. 由锡杂质导致的氯化钾无氰镀镉故障的排除方法[P]. 中国专利: 201910117799.5, 2020-08-25.
[27].广州超邦化工有限公司. 一种铝合金基体上无氰镀镉镀层结构的制备方法[P]. 中国专利: 201810163069.4, 2023-12-29.
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