Wu Dingyu*,Qi Yanjie,Yi Liangcheng,et al.Study on palladium-free activation of electroless nickel plating on diamond[J].Plating & Finishing,2025,(01):42-46.
doi: 10.3969/j.issn.1001-3849.2025.01.007 金刚石无钯活化化学镀镍工艺研究
- Title:
- Study on palladium-free activation of electroless nickel plating on diamond
- 分类号:
- TQ163
- 文献标志码:
- A
- 摘要:
- 研究了一种金刚石无钯活化工艺。将金刚石放入NiSO4和NaH2PO2的混合溶液中进行浸润，通过高温处理实现无钯活化。通过正交试验，确定了活化的最佳工艺条件：NiSO4 20 g/L，NaH2PO2 40 g/L，活化液30 mL，活化时间5 min，活化温度190 ℃。此时金刚石镀层完整率接近100%。通过扫描电子显微镜进行形貌表征，通过能谱仪进行成分分析。结果显示经过高温活化后，金刚石表面附着一层100～500 nm的镍磷合金颗粒。化学施镀后，镀层镍磷合金分布均匀致密，导电性能满足电镀镍工艺要求。
- Abstract:
- A palladium-free activation process for diamond was studied. The diamond was put into a mixed solution of NiSO4 and NaH 2PO2 for infiltration, and the palladium-free activation was realized by high temperature treatment. Through orthogonal test, the optimal process conditions for activation were determined: NiSO 4 20 g/L, NaH2PO2 40 g/L, activation solution 30 mL, activation time 5min, activation temperature 190 ℃. At this time, the integrity rate of diamond coating was close to 100%. The morphology was characterized by scanning electron microscope and the composition was analyzed by energy spectrometer. The results showed that after high temperature activation, a layer of 100~500 nm nickel-phosphorus alloy particles were attached to the diamond surface. After chemical plating, the distribution of nickel-phosphorus alloy was uniform and dense, and the conductivity of the plated layer meeted the requirements of nickel electroplating process
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