XIONG Lishuang,LIU Yang,HU Yaofang,et al.Electroless Nickel Deposition on Ultrathin Poly(methylacrylic acid) Film for Through Silicon via Application[J].Plating & Finishing,2020,(3):34-38.[doi:10.3969/j.issn.1001-3849.2020.03.007]
适用于硅通孔的超薄聚甲基丙烯酸薄膜表面化学镀镍研究
- Title:
- Electroless Nickel Deposition on Ultrathin Poly(methylacrylic acid) Film for Through Silicon via Application
- Keywords:
- ultrathin polymer film; electroless nickel plating; poly(methylacrylic acid); surface functionalization; aniline
- 文献标志码:
- A
- 摘要:
- 为适应微电子技术的快速发展和微电子器件尺寸的不断减小，以硅通孔为核心的三维电子封装中采用超薄有机聚合物作为绝缘层成为发展趋势。因此研究出一种适用于硅通孔的超薄聚合物绝缘层表面金属化的方法具有重要意义。但由于超薄聚合物薄膜表面能和表面粗糙度极低，通过化学镀的方法在其表面沉积致密的金属层具有很大的挑战。通过在聚合物薄膜表面引入苯胺官能团提高对钯离子的吸附力，在超薄聚甲基丙烯酸薄膜表面通过化学镀的方法沉积上了一层均匀且致密的镍磷金属层。采用湿法化学接枝硝基苯有机层的方法对超薄聚丙烯酸甲酯薄膜进行表面功能化，再经过还原处理将硝基苯部分还原为苯胺官能团。苯胺官能团中的氮原子能提供孤对电子，从而与活化剂钯离子形成稳定络合物。这一方法可推广应用于大多数聚合物薄膜和非导电材料的金属化。
- Abstract:
- To meet the rapid development in microelectronic technology and the continuous minimizing devices, using ultrathin polymer films as insulating layers in three-dimensional electronic packaging base on through silicon via is the new tendency. Hence, it is of great significance to explore a method for metallization of ultrathin polymer films suitable for through silicon via. However, because of the extremely low surface energy and roughness of ultra-thin polymer films, deposition of dense metal layer on the surface by electroless plating is of great challenge. Herein, by introducing aniline functional groups to increase the adsorption of palladium ions, a uniform and dense nickel-phosphorus metal layer is deposited on the surface of the ultra-thin poly(methacrylic acid) film by electroless plating. Chemical copolymerization grafting method is applied to functionalize the surface of poly(methylacrylic acid) film with nitrobenzene groups. Then, nitrobenzene groups are reduced to aniline functional groups. The electron lone pair donating nitrogen-containing aniline functional groups can form stable complex with palladium catalyst. This approach can be extended as a general method for metallization of most polymer films and non-conductive materials.
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备注/Memo
收稿日期： 2019-09-19；修回日期： 2019-10-12
通信作者：杭弢，hangtao@sjtu.edu.cn
基金项目： 国家自然科学基金项目（21972091）；国家重点基础研究发展计划(973)项目(2015CB057200)