[1]包志华,郭艳红,田志斌,等.一种镍基底上连续镀铜层电解退镀剂的开发[J].电镀与精饰,2020,(4):28-31.[doi:10.3969/j.issn.1001-3849.2020.04.0060]
BAO Zhihua,GUO Yanhong,TIAN Zhibin,et al.Development of an Electrolytic Stripping Agent for Continuous Copper Plating on Nickel Substrate[J].Plating & Finishing,2020,(4):28-31.[doi:10.3969/j.issn.1001-3849.2020.04.0060]
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BAO Zhihua,GUO Yanhong,TIAN Zhibin,et al.Development of an Electrolytic Stripping Agent for Continuous Copper Plating on Nickel Substrate[J].Plating & Finishing,2020,(4):28-31.[doi:10.3969/j.issn.1001-3849.2020.04.0060]
一种镍基底上连续镀铜层电解退镀剂的开发
《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]
卷:
期数:
2020年4
页码:
28-31
栏目:
出版日期:
2020-04-15
- Title:
- Development of an Electrolytic Stripping Agent for Continuous Copper Plating on Nickel Substrate
- 文献标志码:
- A
- 摘要:
- 研制开发了一种镍基底上连续镀铜层的电解退镀剂，通过正交实验得到最优复配方案为：络合剂A 80 g/L、络合剂B 25 g/L、络合剂C 40 g/L、导电盐60 g/L、缓蚀剂2 g/L、抑雾剂0.2 g/L。此工艺用于镍基底上连续镀铜层的阳极电解退除，退镀速度可达1 μm/min，且不腐蚀镍基底，可保持镍层的光亮度。
- Abstract:
- An electrolytic stripping agent for continuous copper plating on nickel substrate was developed, the optimal compound scheme was obtained through orthogonal experiment with the complexing agent A concentration of 80 g/L, complexing agent B 25 g/L, complexing agent C 40 g/L, conductive salt 60 g/L, corrosion inhibitor 2 g/L and antifogging agent 0.2 g/L. The stripping agent was used for electrolytic stripping of copper coating on nickel substrate, the stripping speed could reach 1 μm/min. In addition, the nickel substrate could avoid corrosion and maintain the brightness.
参考文献/References:
[1] 胡光军.常用退镀方法.电镀与精饰, 1996, 18(1):37-38.
[2] 郑瑞庭.电镀层退除工艺（Ⅰ）.电镀与精饰, 2005, 27(4):49-51.
[3] 张贺林.电解退镀新工艺.电镀与环保, 1996, 16(6):31-31.
[4] 文斯雄.电化学退铜工艺的改进.材料保护, 1998, 31(3):38-39.
[5] 吴双成.钢铁件铜镀层的退除.材料保护, 1997, 30(5):36-37.
[6] 曾祥德.高效低成本电解退镀工艺.电镀与环保, 1998, 8(2):14-16.
[7] 郑瑞庭.电镀层退除工艺（Ⅱ）.电镀与精饰,2005, 27(5):48-52.
[8] 饶厚曾, 李国华, 张猛.电解法退除钢基Ni-P镀层.表面技术, 1996, 25(6):34-37.
备注/Memo
收稿日期： 2019-03-15；修回日期： 2019-04-01
通讯作者： 包志华，男，学士，中级工程师，研究方向为铝合金电镀及连续镀，Email：84117234@qq.com
更新日期/Last Update:
2020-04-10