Peng Xuesong,You Hongwei,Li Lanchen,et al.The influence of coarsening process on the anti-peeling strength and degradation rate of electrolytic copper foil?/html>[J].Plating & Finishing,2024,(3):95-101.[doi:10.3969/j.issn.1001-3849.2024.03.014]
粗化工艺对电解铜箔抗剥离强度和劣化率的影响
- Title:
- The influence of coarsening process on the anti-peeling strength and degradation rate of electrolytic copper foil?/html>
- Keywords:
- electrolytic copper foil ; coarsening process ; anti-peeling strength ; degradation rate ; roughness
- 分类号:
- TQ153.1
- 文献标志码:
- A
- 摘要:
- 铜箔粗化工艺与固化工艺是铜箔表面后处理中最关键的两个环节，粗化与固化工艺的好坏直接决定铜箔的性能。根据铜箔粗化与固化工艺过程，本文研究了 Cu 2+ 浓度、电流密度、镀液温度等因素对铜箔表面形貌和抗剥离性能以及劣化率的影响，在优化后的工艺条件下制备出了抗剥离强度为 1.29 N/mm ，劣化率为 3.01% 且无侧蚀的粗化电解铜箔。
- Abstract:
- ： The coarsening and curing processes of copper foil are the two most crucial steps in the surface post-treatment of copper foil ， and the quality of the coarsening and curing processes directly determines the performance of copper foil. Based on the coarsening and solidification process of copper foil ， this article studied the effects of Cu 2+ concentration ， current density and bath temperature on the surface morphology ， anti-peeling strength and degradation rate of copper foil were studied. Under optimized process conditions ， a coarsening electrolytic copper foil with a anti-peeling strength of 1.29 N/mm ， a degradation rate of 3.01% ， and no side corrosion was prepared.
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备注/Memo
收稿日期： 2023-07-21 修回日期： 2023-08-07 作者简介： 彭雪嵩（ 1997 —），男，博士研究生， email ： pengxuesonghit@163.com 通信作者： 安茂忠， email ： mzan@hit.edu.cn 基金项目： 国家重点研发项目（ 2021YFB3400801 ）?/html>