Yang Kaizhi *,??ong Yan,Wu Kefan.Study on surface Ni-W-P coating and properties of copper alloy for soft decoration design[J].Plating & Finishing,2024,(5):65-71.[doi:10.3969/j.issn.1001-3849.2024.05.009]
软装设计用铜合金的表面Ni-W-P镀层与性能研究
- Title:
- Study on surface Ni-W-P coating and properties of copper alloy for soft decoration design
- 关键词:
- 铜合金; Na 2 WO 4 浓度; Ni-W-P 镀层; 显微形貌; 耐腐蚀性能
- Keywords:
- copper alloy ; Na 2 WO 4 concentration ; Ni-W-P coating ; microscopic morphology ; corrosion resistance
- 分类号:
- TG174.4
- 文献标志码:
- A
- 摘要:
-
针对软装设计用铜合金复杂服役环境的使用需求,为解决铜合金表面硬度低、耐腐蚀性能差等问题,采用化学镀的方法在软装设计用铜合金表面制备了 Ni-W-P 镀层。研究了 Na 2 WO 4 浓度对化学镀层沉积速率、表面形貌、物相组成、硬度和耐腐蚀性能的影响。结果表明:随着 Na 2 WO 4 浓度从 15 g/L 增加至 65 g/L ,铜合金表面镀层的沉积速率先增后减,在 Na 2 WO 4 浓度为 35 g/L 时取得最大值。镀层中 P 元素含量逐渐减小, W 元素含量先增加后减小。不同 Na 2 WO 4 浓度的镀层中都可见 Ni 和 Ni 5 P 4 衍射峰,镀层硬度高于未添加 Na 2 WO 4 的镀层。且随着 Na 2 WO 4 浓度增加,镀层硬度先增后减,在 Na 2 WO 4 浓度为 35 g/L 时取得最大值。随着 Na 2 WO 4 浓度从 15 g/L 上升至 65 g/L ,铜合金表面镀层的腐蚀电位先正向移动后负向移动,腐蚀电流密度先减小后增大。在 Na 2 WO 4 浓度为 35 g/L 时,取得腐蚀电流密度最小值和电荷转移电阻最大值。电化学阻抗谱与极化曲线测试结果相吻合, Na 2 WO 4 浓度为 35 g/L 时具有最佳的耐腐蚀性能。
- Abstract:
-
In response to the complex service environment requirements of copper alloys used in soft decoration design , in order to solve the problems of low surface hardness and poor corrosion resistance of copper alloys , a Ni-W-P coating was prepared on the surface of copper alloy for soft decoration design using chemical plating method. The effects of Na 2 WO 4 concentration on the deposition rate , surface morphology , phase composition , hardness , and corrosion resistance of the chemical coating were studied. The results show that as the concentration of Na 2 WO 4 increases from 15 g/L to 65 g/L , the deposition rate of the copper alloy surface coating first increases and then decreases , the maximum value is achieved at a Na 2 WO 4 concentration of 35 g/L. The P element content in the coating gradually decreases , while the W element content first increases and then decreases. Ni and Ni 5 P 4 diffraction peaks can be observed in coatings with different concentrations of Na 2 WO 4 . The hardness of the coating is higher than that of the coating without Na 2 WO 4 added. As the concentration of Na 2 WO 4 increases , the hardness of the coating first increases and then decreases , reaching its maximum value at a Na 2 WO 4 concentration of 35 g/L. As the concentration of Na 2 WO 4 increases from 15g /L to 65 g/L , the corrosion potential of the copper alloy surface coating first moves forward and then moves negative , and the corrosion current density first decreases and then increases.When the concentration of Na 2 WO 4 is 35 g/L , the minimum corrosion current density and the maximum charge transfer resistance are obtained. The electrochemical impedance spectrum and polarization curve test results are consistent , indicating that Na 2 WO 4 has the best corrosion resistance when the concentration is 35 g/L.
参考文献/References:
[1] 高铭余 , 谢宏斌 , 方攸同 , 等 . 铜及铜合金表面处理技术进展 [J]. 中国有色金属学报 , 2021, 31(5): 1121-1133.
[2] 王荣城 , 王文宇 , 殷凤仕 , 等 . 铜及其合金表面涂层技术与增材制造技术研究进展 [J]. 材料导报 , 2021, 35(19): 19142-19152.
[3] 李海丰 . 铜及其合金无铬钝化研究现状与展望 [J]. 电镀与精饰 , 2022, 44(7): 55-60.
[4] 慧洁 , 侯瑶 , 吴克凡 . 建筑装饰用铜合金的表面钝化工艺与性能研究 [J]. 真空科学与技术学报 , 2021, 41(6): 539-545.
[5] 孔丹 , 罗志强 , 金胜然 . 铜合金的表面化学镀层制备与摩擦学性能研究 [J]. 电镀与精饰 , 2022, 44(8): 23-30.
[6] 许文灿 . 建筑装饰用铜合金表面 Ni-P 化学镀层的制备与性能研究 [J]. 材料保护 , 2022, 55(4): 104-110.
[7] Valova E, Armyanov S, Delplancke J, et al. Interface with substrates of high‐phosphorus electroless NiP and NiCuP deposited from nonammonia alkaline solutions[J]. Journal of the Electrochemical Society, 2019, 143(9): 2804-2815.
[8] 娄金钢 , 李梦娜 , 张桂书 , 等 . 铜合金酸盐活化工艺性能研究 [J]. 电镀与精饰 , 2020, 42(12): 32-36.
[9] 邓志强 , 张春江 , 陈绪蕾 , 等 . 阳极材料对镍铜合金电镀工艺及镀层性能的影响 [J]. 电镀与精饰 , 2023, 45(6): 9-15.
[10] Meng M, Leech A, Le H. Mechanical properties and tribological behaviour of electroless Ni-P-Cu coatings on corrosion-resistant alloys under ultrahigh contact stress with sprayed nanoparticles[J]. Tribology International, 2019(139): 59-66.
[11] 孙杰 , 明庭云 , 钱慧璇 , 等 . BMIC 离子液体中铜锡合金的电沉积及耐蚀性研究 [J]. 稀有金属 , 2020, 44(3): 328-332.
[12] 张春江 , 胡豪 , 杨亮 , 等 . 制氟电解槽镍铜合金电镀工艺及其性能研究 [J]. 山东化工 , 2022, 51(7): 14-18.
[13] 朱宏喜 , 田保红 , 张毅 , 等 . C194 铜合金表面热浸镀 SnAgCu 镀层的组织与性能 [J]. 材料热处理学报 , 2019, 40(4): 114-120.
[14] 杨凱智 , 侯瑶 , 吴克凡 . 预镀镍时间对装饰铜合金化学镀镍基合金的影响 [J]. 电镀与涂饰 , 2022, 41(11): 784-790.
[15] Agafonkina M O, Grafov O Y, Andreeva N P, et al. Modifying copper and copper alloy surface with depocolin and 5-chloro-1,2,3-benzotriazole from a neutral aqueous solution[J]. Russian Journal of Physical Chemistry A, 2021, 95(11): 2295-2303.
[16] Marina F ,Mark K ,Irina B, et al. Effect of surface modification of a titanium alloy by copper ions on the structure and properties of the substrate-coating composition[J]. Metals, 2020,10(12): 1591-1598.
[17] 李剑斌 , 郭兴红 . 水合氯醛对光亮镍镀层性能的影响 [J]. 电镀与涂饰 , 2022, 41(21): 1505-1509.
[18] 贺素姣 , 刘海龙 , 张予新 . 衬套基材电沉积镍 - 钨 - 硼合金镀层的研究 [J]. 电镀与环保 , 2020, 40(1): 7-9.
[19] 邹燕 , 曹大富 , 甘树昆 , 等 . 表面改性对建筑装饰用 Cu-6Zn 合金耐蚀性的影响 [J]. 腐蚀与防护 , 2021, 42(1): 13-16.
[20] Li T, Leng Z J, Wang X T, et al. Microstructure and electrical conductivity of electroless copper plating layer on magnesium alloy micro-arc oxidation coating[J]. Transactions of Nonferrous Metals Society of China, 2022, 32(12): 3950-3962.
相似文献/References:
[1]孔丹*,罗志强,金胜然. 铜合金的表面化学镀层制备与摩擦学性能研究 [J].电镀与精饰,2022,(8):23.[doi:doi : 10.3969/j.issn.1001-3849.2022.08.005]
KONG Dan*,LUO Zhiqiang,JIN Shengran.Preparation and Tribological Properties of Electroless Plating on Copper Alloy[J].Plating & Finishing,2022,(5):23.[doi:doi : 10.3969/j.issn.1001-3849.2022.08.005]
备注/Memo
收稿日期: 2023-09-16 修回日期: 2023-12-11 通信作者: 杨凱智( 1987 —),女,硕士,副教授, email : showutheway@126.com 基金项目: 吉林省自然科学基金( 20170101252JC ) ; 2023 年度吉林省高教科研课题( JGJX2023D725 )?/html>