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[1]许昕莹,肖树城,张路路,等.新型整平剂对电镀铜填通孔的影响及机制探究[J].电镀与精饰,2024,(5):92-100.[doi:10.3969/j.issn.1001-3849.2024.05.013]
 Xu Xinying,Xiao Shucheng,Zhang Lulu,et al.Influence and mechanism of new leveler on through hole filling by copper electroplating[J].Plating & Finishing,2024,(5):92-100.[doi:10.3969/j.issn.1001-3849.2024.05.013]
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新型整平剂对电镀铜填通孔的影响及机制探究

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备注/Memo

收稿日期: 2023-10-07 修回日期: 2023-12-14 作者简介: 许昕莹( 1997 —),女,硕士研究生, email : 2021200172@mail.buct.edu.cn * 通信作者: 肖宁, email : xiaoning@mail.buct.edu.cn 基金项目 : 国家自然科学基金青年基金( 21902010 )?/html>

更新日期/Last Update: 2024-05-05