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[1]于 洁,白忠波,孟建龙,等. 不同厂家高频高速铜箔指标对抗剥离强度的影响 [J].电镀与精饰,2024,(6):1-7.[doi:10.3969/j.issn.1001-3849.2024.06.001]
 Yu Jie?sup>,Bai Zhongbo,Meng Jianlong?,et al.The influence of high-frequency and high-speed copper foil indicators of different manufacturers on the resistance to peel strength[J].Plating & Finishing,2024,(6):1-7.[doi:10.3969/j.issn.1001-3849.2024.06.001]



[1] Uno T, Okuno Y, Tsuruta T, et al. Surface-treated copper foil and copper-clad laminate and printed wiring board using same: US, 20200029444A1[P]. 2020-01-23.

[2] 中国有色金属工业协会 . GBT5230 — 2020 印制板用电解铜箔 [S]. 北京 : 中国标准出版社 , 2020.

[3] 魏新启 , 王玉 , 王峰 , 等 . 5G 通讯对 PCB 及高速覆铜板技术要求 [C]// 中国电子材料行业协会覆铜板材料分会、中国电子电路行业协会覆铜板分会 . 第二十二届中国覆铜板技术研讨会论文集 . 2021: 331-344.

[4] 于鹏鹏 , 周国云 , 洪延 , 等 . 印制电路板超薄铜箔表面粗化铜牙结构及制作技术 [J]. 印制电路信息 , 2023, 31(S1): 50-56.

[5] 樊小伟 . 超薄电解铜箔组织结构与力学性能调控及其表面处理技术研究 [D]. 赣州 : 江西理工大学 , 2021.

[6] 师慧娟 , 陆冰沪 , 樊小伟 , 等 . 电解铜箔表面处理技术及添加剂研究进展 [J]. 中国有色金属学报 , 2021, 31(5): 1270-1284.

[7] Yamamoto T, Kataoka T, Hirasawa Y, et al. Surface treated copper foil, electrodeposited copper foil with carrier, manufacture method for the electrodeposited copper foil with carrier and copper clad laminate: US, 20030148136 [P]. 2003-08-07.

[8] Woo T G, Park I S, Seol K W. Effect of additives on the elongation and surface properties of copper foils[J]. Electronic Materials Letters, 2013, 9(3): 341-345.

[9] Dong Z, Fei X, Gong B, et al. Effects of deep cryogenic treatment on the microstructure and properties of rolled Cu foil[J]. Materials, 2021, 14(19): 54-98.

[10] Kumar R, Wong T K S, Singh N. Dielectric bottom anti-reflective coatings for copper dual damascene interconnects[J]. Microelectronic Engineering, 2004, 71(2): 125-132.

[11] Wang H, Wang Q, Zhang Q, et al. High thermal conductive composite with low dielectric constant and dielectric loss accomplished through flower-like Al 2 O 3 coated BNNs for advanced circuit substrate applications[J]. Composites Science and Technology, 2021, 216(10): 37-56.

[12] Reckinger N, Tang X, Joucken F, et al. Oxidation-assisted graphene heteroepitaxy on copper foil[J]. Nanoscale, 2016, 8(44): 18751-18759.

[13] Pablo A? P, Guillaume S. TREK for high-speed and high-frequency conduction through the axon[J]. Neuron, 2019, 104(5): 831-833.

[14] Ye C, Yang J, Liang X, et al. Design and research of a high-speed and high-frequency pulsed alternator[J]. IEEE Transactions on Plasma Science, 2017, 45(7): 1512-1518.

[15] Xiong S, Sun J, Zeng Y, Xu Y, et al. Effects of corrosion inhibitors on lubrication performance of rolling oil for copper foil[J]. China Petroleum Processing & Petrochemical Technology, 2014, 16(2): 1-56.

[16] Wang W, Peng Q, Dai Y, et al. Distinctive nanofriction of graphene coated copper foil[J]. Computational Materials Science, 2016, 117: 406-411.

[17] Khoele K, Ama O M, Ray S S, et al. Tribo-corrosion behavior of bare and nano-coated foils used on high-speed air foil bearings[J]. The International Journal of Advanced Manufacturing Technology, 2022, 120: 3225-3235.

[18] Moriyama M, Matsunaga K, Morita T, et al. The effect of strain distribution on abnormal grain growth in Cu thin films[J]. Materials Transactions, 2004, 45(10): 3033-3038.

[19] Haifeng Y, Fei X, Yan W, et al. Manufacturing profile-free copper foil using laser shock flattening[J]. International Journal of Machine Tools and Manufacture, 2020, 152: 103542.

[20] Ma L, Zhao J, Zhang M, et al. Study on the tribological behaviour of nanolubricants during micro rolling of copper foils[J]. Materials, 2022, 15(7): 2600.

[21] Zander F, Marynowski T, Loehle S. High-speed imaging of high-frequency effects of a CO 2 plasma flow[J]. Journal of Thermophysics and Heat Transfer, 2017, 31(2): 1-12.

[22] Shin H W, Lee H S, Jung S B. Analysis of peel strength of consisting of an aluminum sheet, anodic aluminum oxide and a copper foil laminate composite[J]. Metals & Materials International, 2017, 23(1): 207-213.


收稿日期: 2023-08-18 修回日期: 2023-10-13 作者简介: 于洁( 1999 —),女,硕士研究生, email : 1515081085@qq.com * 通信作者: 刘二勇( 1982 —), email : liueryong@xust.edu.cn 基金项目: 陕西省重点研发计划项目( 2021SF-469 );国家自然科学基金项目( 52175184 )

更新日期/Last Update: 2024-06-04