参考文献/References:
[1] 张允诚 , 胡如南 , 向荣 . 电镀手册 [M]. 北京 : 国防工业出版社 , 2007.
[2] 刘明星 , 欧忠文 , 胡国辉 , 等 . 无氰镀银新工艺的研究 [J]. 电镀与精饰 , 2017, 39(3): 13-18.
[3] Bomparola R, Caporali S, Lavacchi A, et al. Silver electrodeposition from air and water-stable ionic liquid: An environmentally friendly alternative to cyanide baths[J]. Surface and Coatings Technology, 2007, 201(24): 9485-9490.
[4] Chen J S, Fang Y M, Qiu Q Y, et al. Electrodeposition of bright gold: A green path using hypoxanthine as a complexing agent [J]. Green Chemsitry, 2011, 13: 2339-2343.
[5] Su Y T, Cheng D H, Li K J, et al. Study on the thiosulfate cyanide-free silver pulse plating process[J]. Plat Finish, 2005, 27(2): 14-18.
[6] 卢俊峰 , 安茂忠 , 郑环宇 , 等 . 5,5- 二甲基乙内酰脲无氰镀银工艺的研究 [J]. 电镀与环保 , 2007, 27(1): 9-11.
[7] Nobel F I, Brasch W R , Drago A J. Cyanide-Free Plating Solutions for Monovalent Metals: US, 5302278[P].1994-04-12.
[8] Hernandez M M, Gonzalez I. Effect of potential on the early stages of nucleation and growth during silver electrocrystallization in ammonium medium on vitreous carbon[J]. Journal of Electrochemical Society, 2004, 151: C220-C228.
[9] 殷立涛 , 任凤章 , 赵冬梅 , 等 . 硫代硫酸盐无氰镀银工艺 [J]. 材料保护 , 2010, 43(7): 32-35, 77-78.
[10] Polk B J, Bernard M, Kasianowicz J J, et al. Microelectroplating silver on sharp edges toward the fabrication of solid-state nanopores[J]. Journal of Electrochemical Society, 2004, 151: C559-C566.
[11] Pardave M P, R amirez M T, González I. Silver electrocrystallization on vitreous carbon from ammonium hydroxide solutions[J]. Jounal of Electrochemical Society, 1996, 143: 1551-1558.
[12] 宋振兴 , 姚素薇 , 王宏智 , 等 . 电镀 Ni-Co 合金镀层耐腐蚀性能研究 [J]. 电镀与精饰 , 2014(36): 1-3.
[13] 宋振兴 , 马树元 , 姚素薇 , 等 . 电镀镍 - 锡合金耐腐蚀性能研究 [J]. 电镀与精饰 , 2013(34): 1-5.
相似文献/References:
[1]王晓丽,顾 海,周昭昌,等.铜镀层工艺参数优化的正交实验研究[J].电镀与精饰,2018,(12):19.[doi:10.3969/j.issn.1001?3849.2018.12.005]
WANG Xiaoli,GU Hai,ZHOU Zhaochang,et al.Orthogonal Experimental Research on Optimization of Process Parameters of Copper Electroplating[J].Plating & Finishing,2018,(12):19.[doi:10.3969/j.issn.1001?3849.2018.12.005]
[2]王 秀.电镀智能监控系统设计[J].电镀与精饰,2018,(12):30.[doi:10.3969/j.issn.1001?3849.2018.12.007]
WANG Xiu.Design of Intelligent Electroplating Monitoring System[J].Plating & Finishing,2018,(12):30.[doi:10.3969/j.issn.1001?3849.2018.12.007]
[3]王明亮,杨海燕,李 明,等.电镀硬金的研究现状[J].电镀与精饰,2019,(11):26.[doi:10.3969/j.issn.1001-3849.2019.11.007]
WANG Mingliang,YANG Haiyan,LI Ming,et al.Research Progress on Hard Gold Electrodeposition[J].Plating & Finishing,2019,(12):26.[doi:10.3969/j.issn.1001-3849.2019.11.007]
[4]刘 光*,文 桦,徐启杰.基于TIA和PLC的全自动ABS塑料电镀控制系统设计[J].电镀与精饰,2020,(2):33.[doi:10.3969/j.issn.1001-3849.2020.02.007]
LIU Guang*,WEN Hua,XU Qijie.Design of Automatic Control System for ABS Plastics Electroplating Line Based on TIA and PLC[J].Plating & Finishing,2020,(12):33.[doi:10.3969/j.issn.1001-3849.2020.02.007]
[5]宋青员,何荣祥,陈朝会,等.高度梯度微纳结构的自动化电镀制备方法[J].电镀与精饰,2020,(7):23.[doi:10.3969/j.issn.1001-3849.2020.07.0050]
SONG Qingyuan,HE Rongxiang,CHEN Chaohui,et al.Automated Electroplating for Gradient Height Micro-nano Structures Fabricating[J].Plating & Finishing,2020,(12):23.[doi:10.3969/j.issn.1001-3849.2020.07.0050]
[6]雷翔霄?,徐立娟,唐春霞.基于神经网络PID算法的镀液温度控制系统[J].电镀与精饰,2020,(8):39.[doi:10.3969/j.issn.1001-3849.2020.08.0080]
LEI Xiangxiao,XU Lijuan,et al.Bath Temperature Control System Based on Neural Network PID[J].Plating & Finishing,2020,(12):39.[doi:10.3969/j.issn.1001-3849.2020.08.0080]
[7]范文俊,崔红兵,王 萌,等.从三价铬溶液电沉积非晶Cr-C镀层及其性能研究[J].电镀与精饰,2020,(12):37.[doi:10.3969/j.issn.1001-3849.2020.12.0080]
FAN Wenjun,CUI Hongbing,WANG Meng,et al.Preparation and Performance Study of Amorphous Cr-C Coating Electrodeposited from Trivalent Chromium Solution[J].Plating & Finishing,2020,(12):37.[doi:10.3969/j.issn.1001-3849.2020.12.0080]
[8]薛迪杰*,陈 军,陈景召.基于ZigBee的电镀生产线温度集中监控系统[J].电镀与精饰,2021,(1):31.[doi:10.3969/j.issn.1001-3849.2021.01.0060]
XUE Dijie*,CHEN Jun,CHEN Jingzhao,et al.Temperature Centralized Monitoring System of Electroplating Production Line Based on ZigBee[J].Plating & Finishing,2021,(12):31.[doi:10.3969/j.issn.1001-3849.2021.01.0060]
[9]王昱开*.不锈钢工具电镀金刚石工艺研究[J].电镀与精饰,2021,(3):6.[doi:10.3969/j.issn.1001-3849.2021.03.002]
WANG Yukai*.王昱开*[J].Plating & Finishing,2021,(12):6.[doi:10.3969/j.issn.1001-3849.2021.03.002]
[10]杨航城,田海燕.工艺参数对电镀镍钴合金及其性能的影响[J].电镀与精饰,2021,(4):5.[doi:10.3969/j.issn.1001-3849.2021.04.002]
YANG Hangcheng,TIAN Haiyan.Effect of Process Parameters on Electrodepositing Ni-Co Alloy and Its Properties[J].Plating & Finishing,2021,(12):5.[doi:10.3969/j.issn.1001-3849.2021.04.002]