PDF下载 分享
[1]张清龙,毛海娜*,赵长忠,等.不同工艺方法制备镍球阳极的组织及电化学溶解性能比较[J].电镀与精饰,2024,(10):9-15.
 Bai Chenxing,Guo Yongnian,Wang Guiping.Comparison of organization and electrochemical dissolution properties of nickel ball anodes prepared by different process methods Zhang Qinglong, Mao Haina*, Zhao Changzhong, Liu Jiandong, Zhao Yihang,[J].Plating & Finishing,2024,(10):9-15.
点击复制

不同工艺方法制备镍球阳极的组织及电化学溶解性能比较

参考文献/References:

[1].邓志强, 张春江, 陈绪蕾, 等. 阳极材料对镍铜合金电镀工艺及镀层性能的影响[J]. 电镀与精饰, 2023, 45(6): 9-15.
[2].石玉臣, 赵中伟, 陈爱良, 等. 金川镍阳极液硫化除铜的研究[J]. 有色金属: 冶炼部分, 2010(2): 9-12.
[3].朱艳芳, 闫康平, 王伟. 电镀中镍阳极残渣形成机理研究[J]. 广州化工, 2010, 38 (1): 139-140, 150.
[4].黄章崎, 石海明, 朱惠文, 等. 可溶性镍阳极对电镀镍性能的影响[J]. 电镀与精饰, 2020, 42(6): 1-7.
[5].刘涛, 朱增伟, 任建华, 等. 不溶性阳极电铸中镍离子浓度变化及其对电铸镍的影响[J]. 电镀与环保, 2016, 36(5): 1-6.
[6].王垣芳, 毕爱文. 浅谈电镀槽中的阳极排布[J]. 电镀与精饰, 1999(6): 27-28.
[7].王守泽. 电铸低应力镍工艺研究及其工程应用[D]. 哈尔滨: 哈尔滨工业大学, 2024.
[8].《电镀手册》编写组. 电镀手册(上册)[M]. 北京: 国防工业出版社, 1977: 56-79.
[9].王春霞, 曹鑫帅, 谭小生, 等. 活化剂硫对镍阳极溶解行为及其残渣率的影响[J]. 材料保护, 2021, 54(11): 15-21.
[10].石玉臣. 镍阳极液中铜等杂质的深度去除研究[D]. 长沙: 中南大学, 2010.
[11].卢建波, 解雁冰, 韩漫漫, 等. 镍阳极中S元素对电化学溶解性能的影响[J]. 电镀与精饰, 2022, 44(10): 31-37.
[12].Seon-Mi Y, Won M C, Hionsuck B, et al. Synthesis of multilayer graphene balls by carbon segregation from nickel nanoparticles[J]. ACS Nano, 2012, 6(8): 6803-6811.
[13].Hamar-Thibault S, Ajao J, Lebaili S. Segregation in some nickel-based hard-facing alloys prepared by melt-spinning[J]. Surface & Interface Analysis, 1992, 19(1-12): 623-626.
[14].周路云, 刘书宏, 符明海. 金属阀门密封面镍基合金晶间腐蚀敏感度的研究[J]. 化工装备技术, 2018, 39(1): 15-17.
[15].Gill S K, Sure J, Wang Y, et al. Investigating corrosion behavior of Ni and Ni-20Cr in molten ZnCl2[J]. Corrosion Science, 2020, 179: 109105.
[16].Wang S Y, Wang J Q. Effect of grain orientation on the corrosion behavior of polycrystalline alloy 690[J]. Corrosion Science, 2014, 85: 183-192.
[17].李荻. 电化学原理[M]. 北京: 北京航空航天大学出版社, 2008: 31-67.
[18].刘道新. 材料的腐蚀与防护[M]. 西安:西北工业大学出版社, 2005: 15-30.
[19].石海明, 黄章崎, 王春霞, 等. 镍阳极溶解的工艺优化与性能调控[J]. 电镀与精饰, 2021, 43(3): 15-20.
[20].黄章崎. 电解镍的电化学溶解行为及溶解控制技术的研究[D]. 南昌: 南昌航空大学, 2020.

相似文献/References:

[1]李彭瑞*,任春江,章军云,等.电镀参数对电镀镍层性能的影响[J].电镀与精饰,2022,(2):26.[doi:10.3969/j.issn.1001-3849.2022.02.006]
 LI Pengrui *,REN Chunjiang,ZHANG Junyun,et al.Effect of Electroplating Parameters on the Performance of Electroplating Nickel Layer[J].Plating & Finishing,2022,(10):26.[doi:10.3969/j.issn.1001-3849.2022.02.006]
[2]李 强,雷 程*,梁 庭,等.碳化硅表面电镀厚镍工艺研究[J].电镀与精饰,2022,(2):51.[doi:10.3969/j.issn.1001-3849.2022.02.011]
 LI Qiang,LEI Cheng *,LIANG Ting,et al.Study on Plating Thick Nickel on Silicon Carbide Surface[J].Plating & Finishing,2022,(10):51.[doi:10.3969/j.issn.1001-3849.2022.02.011]
[3]张立平*,刘庆然,何小兵,等.封孔-成膜工艺对电镀薄镍层耐蚀性能的影响[J].电镀与精饰,2022,(2):56.[doi:10.3969/j.issn.1001-3849.2022.02.012]
 ZHANG Liping*,LIU Qingran,HE Xiaobing,et al.Effect of Hole Sealing-Film Forming Process on Corrosion Resistance of Electroplated Thin Nickel Layer?/html>[J].Plating & Finishing,2022,(10):56.[doi:10.3969/j.issn.1001-3849.2022.02.012]
[4]高吉成,李大玉,靳惠明*. 工程教育专业认证背景下电镀镍教学探索 [J].电镀与精饰,2023,(3):110.[doi:doi: 10.3969/j.issn.1001-3849.2023.03.016]
 Gao Jicheng,Li Dayu,Jin Huiming*.Teaching exploration of the electroplating Ni in the context of engineering education accreditation system[J].Plating & Finishing,2023,(10):110.[doi:doi: 10.3969/j.issn.1001-3849.2023.03.016]
[5]李培仪,王 瑞,雷 程*,等.碳化硅表面镀镍速率研究[J].电镀与精饰,2023,(12):71.[doi:doi : 10.3969/j.issn.1001-3849.2023.12.010]
 Li Peiyi,Wang Rui,Lei Cheng*,et al.Research on nickel plating rate on silicon carbide surface[J].Plating & Finishing,2023,(10):71.[doi:doi : 10.3969/j.issn.1001-3849.2023.12.010]
[6]刘士琳,王 凯,雷 程*,等.doi: 10.3969/j.issn.1001-3849.2025.02.002种子层厚度对电镀厚镍速率及形貌影响的研究[J].电镀与精饰,2025,(02):9.
 Li Bo,Guo Jinzhu,Liang Ting.Effect of seed layer thickness on the rate and morphology of thick nickel plating Liu Shilin1, Wang Kai2, Lei Cheng1*, Yu Jiangang1, Wang Taolong1, Lu Jing1,[J].Plating & Finishing,2025,(10):9.

更新日期/Last Update: 2024-10-16