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[1]彭雪嵩,由宏伟,李兰晨,等.粗化工艺对电解铜箔抗剥离强度和劣化率的影响[J].电镀与精饰,2024,(3):95-101.[doi:10.3969/j.issn.1001-3849.2024.03.014]
　Peng Xuesong,You Hongwei,Li Lanchen,et al.The influence of coarsening process on the anti-peeling strength and degradation rate of electrolytic copper foil?/html>[J].Plating & Finishing,2024,(3):95-101.[doi:10.3969/j.issn.1001-3849.2024.03.014]
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粗化工艺对电解铜箔抗剥离强度和劣化率的影响

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG] 卷: 期数: 2024年3 页码: 95-101 栏目: 出版日期: 2024-03-15
Title:
The influence of coarsening process on the anti-peeling strength and degradation rate of electrolytic copper foil?/html>
作者:
（哈尔滨工业大学 化工与化学学院，黑龙江 哈尔滨 150000）
Author(s):
（School of Chemical Engineering and Chemistry， Harbin Institute of Technology， Harbin 150000， China）
关键词:
电解铜箔; 粗化工艺; 抗剥离强度; 劣化率; 粗糙度
Keywords:
electrolytic copper foil ;  coarsening process ;  anti-peeling strength ;  degradation rate ;  roughness
分类号:
TQ153.1
DOI:
10.3969/j.issn.1001-3849.2024.03.014
文献标志码:
A
摘要:
铜箔粗化工艺与固化工艺是铜箔表面后处理中最关键的两个环节，粗化与固化工艺的好坏直接决定铜箔的性能。根据铜箔粗化与固化工艺过程，本文研究了 Cu 2+ 浓度、电流密度、镀液温度等因素对铜箔表面形貌和抗剥离性能以及劣化率的影响，在优化后的工艺条件下制备出了抗剥离强度为 1.29 N/mm ，劣化率为 3.01% 且无侧蚀的粗化电解铜箔。
Abstract:
： The coarsening and curing processes of copper foil are the two most crucial steps in the surface post-treatment of copper foil ， and the quality of the coarsening and curing processes directly determines the performance of copper foil. Based on the coarsening and solidification process of copper foil ， this article studied the effects of Cu 2+ concentration ， current density and bath temperature on the surface morphology ， anti-peeling strength and degradation rate of copper foil were studied. Under optimized process conditions ， a coarsening electrolytic copper foil with a anti-peeling strength of 1.29 N/mm ， a degradation rate of 3.01% ， and no side corrosion was prepared.

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备注/Memo

收稿日期： 2023-07-21 修回日期： 2023-08-07 作者简介： 彭雪嵩（ 1997 —），男，博士研究生， email ： pengxuesonghit@163.com 通信作者： 安茂忠， email ： mzan@hit.edu.cn 基金项目： 国家重点研发项目（ 2021YFB3400801 ）?/html>

更新日期/Last Update: 2024-02-27