Tang Fangyu Zhan Yanji Wang Chunxia * Liu Hui.Effect of stabilizers on the properties of electroless nickel plating[J].Plating & Finishing,2024,(8):30-35.[doi:10.3969/j.issn.1001-3849.2024.08.005]
稳定剂对化学镀镍性能的影响
- Title:
- Effect of stabilizers on the properties of electroless nickel plating
- Keywords:
- stabilizer ; corrosion resistance ; Ni-P alloy
- 分类号:
- TG174.453
- 文献标志码:
- A
- 摘要:
- 为了研究稳定剂对化学镀镍液稳定性及镀层性能的影响,在基础化学镀镍液中分别加入了碘化钾、柠檬酸铈和硫脲 3 种稳定剂,制备了化学镀镍液和化学镀镍层。利用氯化钯溶液测试镀液稳定性,采用 XF-P1M 镀层测厚及材料分析仪、显微硬度计、金相显微镜、电化学工作站以及粗糙度测量仪对镀层的厚度、磷含量、硬度、微观形貌、耐蚀性以及粗糙度进行了表征。结果表明:以碘化钾作为稳定剂的镀液效果最好,镀液分解时间由 198 s 提高至 375 s ;镀速降低最少,为 5.60 μ m/h ;镀层硬度由 271 HV 提高至 307 HV ;磷含量基本无变化;镀层结晶更加致密且均匀,孔隙率降低;测得镀层的自腐蚀电位为 - 0.348 V ,化学镀镍层的自腐蚀电流密度为 2.924×10 - 7 A/cm 2 ,镀层的耐蚀性能最佳;粗糙度最低,为 0.659 μ m 。
- Abstract:
- : To investigate the effect of stabilizers on the stability and coating performance of the electroless nickel solution , three stabilizers containing potassium iodide , cerium citrate and thiourea were added to the electroless nickel solution to prepare the electroless nickel coatings. Palladium chloride solution was used to test the stability of plating solution. The thickness , phosphorus content , hardness , microstructure , corrosion resistance , and roughness of the coating were characterized using XF-P1M coating thickness measurement and material analyzer , microhardness tester , metallographic microscope , electrochemical workstation , and roughness measuring instrument. The results showed that the stabilizer containing potassium iodide had the best effect , and the decomposition time of the plating solution increased from 198 s to 375 s , the minimum reduction in coating rate was 5.60 μ m/h , the hardness increased from 271 HV to 307 HV , the phosphorus content remained substantially unchanged , the crystallization of the coating was much denser and more uniform , and the porosity was reduced. The measured self-corrosion potential of the coating is - 0.348 V , and the self-corrosion current density of the coating is 2.924×10 - 7 A·cm - 2 , which shows the best corrosion resistance. The lowest roughness is 0.659 μ m.
参考文献/References:
[1] 刘海萍 , 李宁 , 毕四富 . 稳定剂对化学镀镍液及镀层性能的影响 [J]. 电镀与环保 , 2006, 26(2): 20-23.
[2] 李雨 . 镀槽材质对化学镀镍溶液稳定性的影响研究 [D]. 贵阳 : 贵州大学 , 2015.
[3] 董坤 , 李德良 , 吴赣红 . 无铅化学镀镍稳定剂研究 [J]. 表面技术 , 2008(3): 12-13, 29.
[4] 丁学谊 , 吕龙云 , 朱立群 , 等 . 高稳定性化学镀镍磷合金工艺研究 [J]. 表面技术 , 2000(1): 6-8, 49.
[5] 武慧慧 , 郝利峰 , 韩生 . 化学镀镍的研究进展 [J]. 电镀与精饰 , 2014, 36(3): 18-21.
[6] Lee J Y, Kim J W, Chang B Y, et al. Effects of ethoxylated α -naphtholsulfonic acid on tin electroplating at iron electrodes[J]. Journal of the Electrochemical Society, 2004, 151(5): 333-341.
[7] 刘志坚 . Ni-P 合金化学镀溶液的稳定性研究 [D]. 昆明 : 昆明理工大学 , 2002.
[8] 刘霄 , 安艳玲 , 刘定富 , 等 . 镀槽材质对化学镀镍溶液寿命的影响 [J]. 电镀与精饰 , 2015, 37(9): 38-41.
[9] Hajdu J, Zabrocky S. The future of electroless nickel[J].Metal Finishing, 2000, 98(5):42-46.
[10] Das S K, Sahoo P. Optimization of electroless Ni-B coatings based on multiple roughness characteristics[C]//Proceedings of the International Conference on Mechanical Engineering. Bangladesh, 2009, 26-28.
[11] 周海晖 , 呼延鑫 , 刘剑峰 , 等 . 化学镀镍溶液稳定剂的研究 [J]. 电镀与环保 , 1999, 19(1): 22-24.
[12] 胡海娇 , 武晓阳 , 刘定富 . 化学镀镍稳定剂的研究 [J]. 电镀与环保 , 2015, 35(2): 20-23.
[13] 张伟鸿 . 化学镀镍稳定剂对镀层组成和性能的影响及工程应用 [D]. 哈尔滨 : 哈尔滨工业大学 , 2021.
[14] 仵亚婷 , 汤义武 , 沈彬 , 等 . 化学镀镍溶液稳定剂及其作用机理 [J]. 机械工程材料 , 2004, 28(11): 1-3, 9.
[15] 吴宜勇 , 戴长松 , 张永忠 . 高含磷量化学镀镍工艺 [J]. 电镀与环保 , 1997, 17(2): 14-17.
[16] 王明明 , 徐子轩 , 王守豪 , 等 . 电化学镀镍层的润湿性能研究 [J]. 电镀与精饰 , 2023, 45(7): 26-32.
[17] 谢洪波 , 江冰 , 陈华三 , 等 . 化学镀镍规律及机理探讨 [J]. 电镀与精饰 , 2012, 34(2): 26-30, 46.
[18] 夏日辉 , 王春霞 , 田礼熙 . 杂质铜离子对电镀镍层组织形貌及耐蚀性的影响 [J]. 表面技术 , 2022, 51(10): 276-283, 343.
[19] 刘明举 , 程纪华 . 化学镀镍镀层质量影响因素的分析 [J]. 电镀与精饰 , 2020, 42(12): 1-4.
[20] 谢洪波 , 江冰 , 陈华三 , 等 . 化学镀镍规律及机理探讨 [J]. 电镀与精饰 , 2012, 34(2): 26-30, 36.
[21] 杜亚梦 , 徐小兵 , 管朕风 . 化学镀镍机理及规律的现状分析 [J]. 世界有色金属 , 2016, 19: 65-66.
[22] Ma?ecki A, Micek-Ilnicka A. Electroless nickel plating from acid bath[J]. Surface and Coatings Technology, 2000, 123(1): 72-77.
[23] 王超男 . 镀镍工艺和镀锡稳定剂的研究 [D]. 吉林 : 吉林大学 , 2018.
[24] 姚俊合 . PCB 铜电路表面无钯活化及化学镀镍的研究 [D]. 广州 : 广东工业大学 , 2019.
[25] 仵亚婷 , 汤义武 , 胡文彬 , 等 . 化学镀镍液稳定性测试评估方法 [J]. 电镀与环保 , 2004, 24(2): 27-29.
[26] Parker K. Formulation of electroless nickel-phosphorus plating baths[J].Plating and Surface Finishing, 1987, 74(2):60-65.
[27] 李宁 . 化学镀镍基合金理论与技术 [M]. 哈尔滨 : 哈尔滨工业大学出版社 , 2000: 26-54.
[28] 李宁 . 化学镀实用技术 [M]. 北京 : 化学工业出版社 , 2004: 63-87.
[29] Baskaran I, Narayanan T, Stephen A. Effect of accelerators and stabilizers on the formation and characteristics of electroless Ni-P deposits[J]. Materials Chemistry & Physics, 2006, 99(1): 117-126.
[30] 张祖训 , 汪尔康 . 电化学原理和方法 [M]. 北京 : 科学出版社 , 2000: 45-58.
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备注/Memo
收稿日期: 2023-09-12 修回日期: 2023-12-19 作者简介: 唐方宇( 1990 ―),男,本科,高级工程师,研究方向为 X 射线荧光应用, email : tangfangyu@cfantek.com * 通信作者: 王春霞,女,硕士,高级工程师,研究方向:电镀、阳极氧化等, email : wcx95@163.com