[1]严 森,李 爽,洪 明.doi: 10.3969/j.issn.1001-3849.2026.02.008烯丙基磺酸钠对VLP铜箔表面电镀镍层性能的影响[J].电镀与精饰,2026,(02):69-74.
　YAN Sen,LI Shuang,HONG Ming.Effects of sodium allylsulfonate on performance of nickel-plating layer on VLP copper foil surface[J].Plating & Finishing,2026,(02):69-74.
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doi: 10.3969/j.issn.1001-3849.2026.02.008烯丙基磺酸钠对VLP铜箔表面电镀镍层性能的影响()

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2026年02
页码:
69-74
栏目:
出版日期:
2026-02-28

文章信息/Info

Title:
Effects of sodium allylsulfonate on performance of nickel-plating layer on VLP copper foil surface
作者:
严 森1; 2; 李 爽1; 2; 洪 明1; 2
(1. 江西铜业集团有限公司,江西 南昌 330096 ;2. 江西铜业技术研究院有限公司,江西 南昌 330096)
Author(s):
YAN Sen1; 2;  LI Shuang1; 2;  HONG Ming1; 2
(1. Jiangxi Copper Corporation Co., Ltd., Nanchang 330096, China; 2. Jiangxi Copper Technology Research Institute Co., Ltd., Nanchang 330096, China)
关键词:
烯丙基磺酸钠; 电镀; 镍; 镀层性能
Keywords:
sodium allylsulfonate;  plating;  nickel;  coating performance
分类号:
TQ153
文献标志码:
A
摘要:
结合SEM、XRD、电化学阻抗谱(EIS)和结合力测试分析了烯丙基磺酸钠(SAS)对超低轮廓(VLP)铜箔镀镍层的微观形貌、晶粒取向、耐蚀性及结合力的影响机理。结果表明：在镀镍过程中，SAS主要对Ni2+的沉积有一定的抑制作用。当SAS添加量为0.6 g/L时，VLP铜箔镀镍层具有较好耐蚀性和结合力，其膜层电阻可达986.6 Ω?cm2，结合力能提高至5B级。适量添加SAS有助于提高VLP铜箔镀镍层的综合性能，其主要归因于SAS可一定程度地降低镍晶粒的形成速率，从而达到细化镍晶粒，提升镀层均匀性的效果。
Abstract:
The specific influence mechanism of sodium allylsulfonic (SAS) on the micro-morphology, grain orientation, corrosion resistance and adhesion of nickel-plating layer on very low profile (VLP) copper foil were analyzed by SEM, XRD, electrochemical impedance spectroscopy (EIS) and adhesion test. The results show that during the nickel plating process, SAS mainly has a certain inhibitory effect on the deposition of Ni 2+. When the addition amount of SAS is 0.6 g/L, the nickel plating layer of VLP copper foil has better corrosion resistance and adhesion. The film resistance can reach 986.6 Ω?cm2, and the adhesion can be improved to grade 5B. Adding an appropriate amount of SAS helps to improve the overall performance of the VLP copper foil nickel plating layer. This is mainly attributed to the fact that SAS can to some extent reduce the formation rate of nickel grains, thereby achieving the effect of refining the nickel grains and enhancing the uniformity of the plating layer

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更新日期/Last Update: 2026-02-09