[1]咸士凯,余效峰,廖文华,等.doi: 10.3969/j.issn.1001-3849.2026.02.015无氰金电镀液络合体系浓度波动对镀层性能影响[J].电镀与精饰,2026,(02):129-134.
　XIAN Shikai,YU Xiaofeng,LIAO Wenhua,et al.Influence of concentration fluctuations in complexing system of cyanide-free gold electroplating solution on coating performance[J].Plating & Finishing,2026,(02):129-134.
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doi: 10.3969/j.issn.1001-3849.2026.02.015无氰金电镀液络合体系浓度波动对镀层性能影响()

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2026年02
页码:
129-134
栏目:
出版日期:
2026-02-28

文章信息/Info

Title:
Influence of concentration fluctuations in complexing system of cyanide-free gold electroplating solution on coating performance
作者:
咸士凯1; 余效峰1; 廖文华1; 叶绍明1; 肖定军1; 詹东平2; 刘彬云1
(1. 广东光华科技股份有限公司,广东 广州 510280 ;2. 厦门大学 固体表面物理化学国家重点实验室,福建 厦门 361005)
Author(s):
XIAN Shikai1;  YU Xiaofeng1;  LIAO Wenhua1;  YE Shaoming1;  XIAO Dingjun1;  ZHAN Dongping2;  LIU Binyun1
(1. Guangdong Guanghua Sci-Tech Co., Ltd., Guangzhou 510280, China; 2. State Key Laboratory for Physical Chemistry of Solid Surfaces, Xiamen University, Xiamen 361005, China)
关键词:
无氰金电镀液; 稳定性; 亚硫酸根; 粗糙度; 硬度
Keywords:
cyanide-free gold electroplating bath;  stability;  sulfite;  roughness;  hardness
分类号:
TQ153
文献标志码:
A
摘要:
在半导体电镀领域，亚硫酸盐体系无氰金电镀液因毒性低、镀层结晶细腻等优点被广泛应用。然而，电镀液中SO32–(亚硫酸根)浓度受亚硫酸金盐补充量和空气中的氧气氧化作用影响而波动，显著影响镀液稳定性和镀层质量。研究了SO32–浓度变化对镀层硬度、晶粒尺寸及粗糙度的影响。结果表明：SO32–浓度过低会导致金析出；随着SO32–积累，镀层晶粒尺寸减小，硬度增加；但当SO32–浓度过高时，镀层晶粒尺寸增大，硬度下降，粗糙度上升。结果表明：SO32–浓度过高不仅恶化镀层质量，还降低可操作电流密度上限，增加镀层烧焦或金析出风险。实际生产中需合理调节氮气流量以稳定SO32–浓度，确保镀液和镀层质量的稳定。
Abstract:
In the field of semiconductor electroplating, the sulfite-based cyanide-free gold plating solution is widely used due to its low toxicity, fine-grained deposits, and other advantages. However, the concentration of sulfite ions (SO32–) in the plating solution fluctuates significantly due to the continuous replenishment of gold sulfite salts and oxidation by air or anode, which affects the stability of the solution and the quality of the plating layer. The effects of SO32– concentration variations on the hardness, grain size and roughness of the plating layer were investigated. The results show that low SO 32– concentrations lead to gold precipitation, while an increase in SO 32– concentration initially reduces grain size and increases hardness. However, when the SO 32– concentration exceeds a certain threshold, the grain size increases, hardness decreases, and roughness rises. Experiments confirm that excessively high SO 32– concentrations not only degrade plating quality but also reduce the operable current density limit, risk increasing of layer burning or gold precipitation. In practical production, regulating nitrogen flow is essential to maintain stable SO 32– concentrations, ensuring consistent plating solution stability and deposit quality.

参考文献/References:

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更新日期/Last Update: 2026-02-09