PDF下载 分享
[1]吴双成*,储荣邦.六价铬镀铬添加剂作用原理[J].电镀与精饰,2020,(2):26-32.[doi:10.3969/j.issn.1001-3849.2020.02.006]
 WU Shuangcheng*,CHU Rongbang.Mechanism of Additives for Hexavalent Chromium Plating[J].Plating & Finishing,2020,(2):26-32.[doi:10.3969/j.issn.1001-3849.2020.02.006]
点击复制

六价铬镀铬添加剂作用原理

参考文献/References:

[1] 方景礼.电镀配合物理论与应用[M]. 北京:化学工业出版社, 2008.
[2] 严钦元. 现代电镀与表面精饰添加剂[M]. 北京:科学技术出版社, 1994.
[3] Perakh M, Ginsburg H, Salomon E, et al. Chromium plating[P]. US 4234396, 1980.
[4] Kennady C. The effect of KIO3 on the electrodeposition of chromium[J]. Bulletin of Electrochemistry, 1996, 12(5):284.
[5] Norifumi H, Akihiko H, Kazuyuki O, et al. Process for forming colorless chromate coating film on bright aluminum wheel[P]. US 5259937, 1993.
[6] 方景礼.电镀添加剂理论与应用[M]. 北京:国防工业出版社, 2006.
[7] Edgar J S, Norwood U P, Hyman C, et al. Process and composition for electrodeposition chromium[P]. US 3505183, 1970.
[8] 何生龙.低浓度镀铬工艺[J]. 电镀与环保, 1992, 12(2):1-4.
[9] Hyman C, Kenneth R, Berkeley H. Chromium plating bath for producing non-iridescent, adherent, bright chromium deposits at high efficiencies and substantially free of cathodic low current density etching[P]. US 4588481A, 1986.
[10] 汪小兰. 有机化学[M]. 北京:人民教育出版社, 1983.
[11] Hyman C. Novel low concentration decorative chromium plating baths and method[P]. US 4206019, 1980.
[12] Nicholas M M. High-performance electrodeposited chromium layers formed at high current efficiencies[P]. US 4927506, 1990.
[13] Hyman C. Bright chromium plating baths and process[P]. US 4472249, 1984.
[14] Anthony D B. Hard chromium plating from hexavalent plating bath[P]. US 4406756, 1983.
[15] 王桂香, 张晓红.电镀添加剂与电镀工艺[M]. 北京:化学工业出版社, 2011.
[16] 周琦, 史敬伟, 程秀莲. 电镀铬添加剂的对比研究[J]. 电镀与精饰, 2006, 28(2):37-39.
[17] Romanowski E A, Brown H. Chromium plating[P]. US 3334033, 1967.
[18] 沈品华, 钱宝梁.电镀铬新工艺[J]. 腐蚀与防护, 2002, 23(7):308-311.
[19] 吴双成.材料表面的电现象及应用[J]. 电镀与环保, 1997, 17(6):24-26.
[20] Davizs G R. Hard chromium plating[J]. Transactions of the Institute of Metal Finishing, 1993, 51(3): 47.

相似文献/References:

[1]吴双成*,储荣邦.六价铬镀铬理论发展概况[J].电镀与精饰,2020,(3):28.[doi:10.3969/j.issn.1001-3849.2020.03.006]
 WU Shuangcheng*,CHU Rongbang.Development of Hexavalent Chromium Plating Theory[J].Plating & Finishing,2020,(2):28.[doi:10.3969/j.issn.1001-3849.2020.03.006]

备注/Memo

收稿日期: 2019-04-08;修回日期: 2019-11-23
通信作者: 吴双成,email: wu-shuangcheng@163.com

更新日期/Last Update: 2020-02-10