WU Shuangcheng*,CHU Rongbang.Mechanism of Additives for Hexavalent Chromium Plating[J].Plating & Finishing,2020,(2):26-32.[doi:10.3969/j.issn.1001-3849.2020.02.006]
六价铬镀铬添加剂作用原理
- Title:
- Mechanism of Additives for Hexavalent Chromium Plating
- 文献标志码:
- A
- 摘要:
- 根据硫酸与铬酸反应生成硫酸铬酰的理论,解释了电流密度、镀液温度等影响镀铬电流效率的因素。对各镀铬添加剂的作用原理,如有机磺酸和硒酸,卤化物及卤酸盐,羧酸类、同多酸和杂多酸,稀土类、羟基羧酸等进行了详细介绍。
- Abstract:
- According to the theory that sulfuric acid reacting with chromic acid to form chromium sulfate acyl, the factors influencing the efficiency of chrome-plating current, such as current density and bath temperature, were explained. And the action mechanisms of various chromium plating additives, such as organic sulfonic acid and selenic acid, halide and halate, carboxylic acid, homopoly acid and heteropoly acid, rare earth, hydroxyl carboxylic acid, were described in detail.
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相似文献/References:
[1]吴双成*,储荣邦.六价铬镀铬理论发展概况[J].电镀与精饰,2020,(3):28.[doi:10.3969/j.issn.1001-3849.2020.03.006]
WU Shuangcheng*,CHU Rongbang.Development of Hexavalent Chromium Plating Theory[J].Plating & Finishing,2020,(2):28.[doi:10.3969/j.issn.1001-3849.2020.03.006]
备注/Memo
收稿日期: 2019-04-08;修回日期: 2019-11-23
通信作者: 吴双成,email: wu-shuangcheng@163.com