MA Yongchun,JIA Shuyong,?,et al.Optimization Process for Electroless Composite Plating of Ni-P-Cu-PTFE by Orthogonal Test[J].Plating & Finishing,2020,(12):15-19.[doi:10.3969/j.issn.1001-3849.2020.12.0040]
正交试验法优化Ni-P-Cu-PTFE复合化学镀工艺
- Title:
- Optimization Process for Electroless Composite Plating of Ni-P-Cu-PTFE by Orthogonal Test
- 关键词:
- 复合化学镀; Ni-P-Cu-PTFE; 正交试验; 工艺优化
- 分类号:
- TQ153.12
- 文献标志码:
- A
- 摘要:
- 以Q235碳钢为基体采用化学镀方法制备了Ni-P-Cu-PTFE复合镀层，以沉积速率为考察指标采用正交试验法优化了Ni-P-Cu-PTFE配方及工艺条件，并研究了镀层的形貌、硬度、耐蚀性等。结果表明，最佳的镀液配方及工艺条件为硫酸镍 30.0 g/L、硫酸铜 0.8 g/L、氟化氢铵 14.0 g/L、次亚磷酸钠 30.0 g/L、十二烷基硫酸钠 0.04 g/L、硫脲 0.004 g/L、柠檬酸三钠 12.0 g/L、聚四氟乙烯12.0 mL/L，镀液pH值为4.5，化学镀温度80 ℃，施镀时间2 h。在该条件下，镀层沉积速率可达178.64 g/（m2·h），镀层硬度可达207.93 HV，获得的镀层表面致密平整，孔隙率较小，具有较好的耐蚀性。
- Abstract:
- The Ni-P-Cu-PTFE composite coating was prepared by electroless plating on the Q235 carbon steel substrate, the formula and process conditions were optimized by orthogonal experiment with the deposition rate as the indicator, in addition, the morphology, hardness and corrosion resistance of the Ni-P-Cu-PTFE coating were studied. The results showed that the optimum formulation and process conditions were required as follows: the concentration of NiSO4·6H2O, CuSO4·5H2O, NaH2PO2·H2O, NH4HF2, Na3C6H5O7·2H2O, C12H25NaO4S, CN2H4S, polytetrafluoroethylene were 30.0 g/L, 0.8 g/L, 30.0 g/L, 14.0 g/L, 12.0 g/L, 0.04 g/L , 0.004 g/L, 12.0 mL/L respectively, the bath pH value of 4.5, the temperature of 80 ℃, and the plating time of 2 h. Under this condition, the deposition rate of the coating could reach 178.64 g/（m2·h）, and the hardness could reach 207.93 HV. The obtained coating had a compact and flat surface, small porosity, and strong corrosion resistance.
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备注/Memo
收稿日期： 2020-08-14；修回日期： 2020-10-28
作者简介： 马永纯（1971-），男，吉林人，博士，副教授，Email：398388538@qq.com
通讯作者： 贾树永（1974-），男，吉林人，博士，E-mail：S.jia@liteon.com；曾宪光（1979-），男，湖南人，博士，副教授，从事材料表面工程研究，E-mail：zengxianguang1979@163.com
基金项目：四川省青年科技创新研究团队项目（2016TD0024）