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[1]文明立,赵 超,杨义华,等.工艺条件对线路板化学镀钯的影响[J].电镀与精饰,2020,(12):20-25.[doi:10.3969/j.issn.1001-3849.2020.12.0050]
　WEN Mingli,ZHAO Chao,YANG Yihua,et al.Effect of Process Conditions on Electroless Palladium Plating on Circuit Boards[J].Plating & Finishing,2020,(12):20-25.[doi:10.3969/j.issn.1001-3849.2020.12.0050]
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工艺条件对线路板化学镀钯的影响

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG] 卷: 期数: 2020年12 页码: 20-25 栏目: 出版日期: 2020-12-10
Title:
Effect of Process Conditions on Electroless Palladium Plating on Circuit Boards
作者:
文明立1; 2; 赵 超3; 杨义华1; 2; 陈 伟1; 2; 彭小英1; 2; 刘光明3*
1. 吉安宏达秋科技有限公司，江西 吉安 343900； 2. 深圳宏达秋科技有限公司，广东 深圳 518104； 3. 南昌航空大学 材料科学与工程学院， 江西 南昌 330063
Author(s):
WEN Mingli1; 2;  ZHAO Chao3;  YANG Yihua1; 2;  CHEN Wei1; 2;  PENG Xiaoying1; 2;  LIU Guangming3*
1. Ji’an HongDaQiu Technology Co.，Ltd.， Ji’an 343900， China；　2. Shenzhen HongDaQiu Technology Co.， Ltd.， Shenzhen 518104，China；　3. School of Materials Science and Engineering， Nanchang Hangkong University， Nanchang 330063， China
关键词:
镍钯金镀层; 温度; pH值; 化学镀钯
Keywords:
nickel-palladium-gold coating temperature pH electroless palladium plating
分类号:
TQ153.19
DOI:
10.3969/j.issn.1001-3849.2020.12.0050
文献标志码:
A
摘要:
线路板镍层上传统化学镀金过程中存在镍层腐蚀问题，本文针对本公司开发的线路板化学镀镍钯金工艺的化学镀钯配方，研究了化学镀钯温度和pH对沉积速率、钯层形貌和镀金后镍腐蚀的影响。结果表明，在45 ℃ ~ 60 ℃区间化学镀钯沉积速度随温度呈近线性增加；在pH为6.0~8.0之间镀钯沉积速率随pH值增加也缓慢增加。在50 ℃，pH=7.2时化学镀钯沉积速率稳定，镀层结晶细致，能够有效减少镀金时产生的镍腐蚀，得到的镍钯金镀层平均断裂拉力为2.0 g，断裂模式均为模式A-3焊点肩部断裂，具有良好的金线邦定性能。
Abstract:
For circuit board, corrosion of the nickel layer occurs during the traditional electroless gold plating on the nickel layer. Our company developed a process for electroless nickel palladium plating on circuit boards. The effects of electroless palladium plating temperature and pH on the deposition rate, palladium plating layer morphology and nickel layer corrosion during gold plating were studied. The results show that the deposition rate of electroless palladium plating in the temperature range of 45~60 ℃ increases nearly linearly with temperature. The deposition rate of palladium plating in the pH range of 6.0 and 8.0 also increase slowly with the increase of pH value. When the temperature is 50 ℃ and the pH value is 7.2, the deposition rate of electroless palladium plating is stable, and the crystallization of the coating is fine, which can effectively reduce the nickel corrosion during gold plating. The average breaking force of the nickel palladium coating is 2.0 g. The fracture mode is determined to be mode A-3 solder joint fracture. The fracture mode was determined to be A-3 solder joint fracture. The obtained nickel-palladium gold coating showed good gold wire bonding performance.

参考文献/References:

[1] 田民波. 高密度封装进展之四——印制线路板制造技术的发展趋势[J]. 印制电路信息, 2004（1）: 4-11.
Tian M B. Printed wiring board manufacturing technology trends[J]. Printed Circuit Information, 2004（1）: 4-11 （in Chinese）.
[2] Goyal D, Lane T, Kinzie P, et al. Failure mechanism of brittle solder joint fracture in the presence of electroless nickel immersion gold （ENIG） interface[C]. Electronic Components & Technology IEEE, 2002, 732-739.
[3] 杨维生. 化学镀镍金在印制电路板制造中的应用[J]. 化工新型材料, 2002, 30（2）: 24-26.
Yang W S. Application of electroless nickel and immersion gold in the manufacturing of the printed circuit board[J]. New Chemical Materials, 2002, 30（2）: 24-26 （in Chinese）.
[4] 刘海萍, 毕四富, 王春雨, 等. 温度对化学镀镍磷合金基体上置换镀金过程的影响[J]. 稀有金属材料与工程, 2017, 46（7）: 2012-2016.
Liu H P, Bi S F, Wang C Y, et al. Effect of temperature on the immersion gold process based on electroless Ni-P alloy substrate[J]. Rare Metal Materials and Engineering. 2017, 46（7）: 2012-2016 （in Chinese）.
[5] 陈润伟, 黄辉祥, 刘彬云. 化学镍钯金制程的优势及在国内的发展应用状况[J]. 印制电路信息, 2018, 26: 354-360.
Chen R W, Huang H X, Liu B Y. The advantages & development application status in domestic of ENEPIG/ENIPIG process[J]. Printed Circuit Information, 2018, 26: 354-360 （in Chinese）.
[6] 王喜然, 郭东海, 张齐飞, 等. 工艺条件对碳钢表面化学镀Ni-P质量的影响[J]. 表面技术, 2009, 38（5）: 74-76.
Wang X R, Guo D H, Zhang Q F, et al. Effect of process conditions of electroless Ni-P plating on coating quality of carbon steel[J]. Surface Technology, 2009, 38（5）: 74-76 （in Chinese）.
[7] 金永中, 杨奎, 曾宪光, 等. 温度对化学镀Ni-P合金层形貌、硬度及耐蚀性的影响[J]. 表面技术, 2015, 44（4）: 23-26+31.
Jin Y Z, Yang K, Zeng X G, et al. Influence of plating temperature on the morphology, hardness and corrosion resistance of electroless Ni-P alloy plating[J]. Surface Technology, 2015, 44（4）: 23-26+31 （in Chinese）.
[8] 赖福东, 陈世荣, 曹权根, 等. 印制线路板化学镀镍钯磷合金[J]. 电镀与涂饰, 2015, 34（20）: 1150-1154+1151.
Lai F D, Chen S R, Cao Q G, et al. Electroless nickel-palladium-phosphorus ahoy plating for printed circuit board[J]. Electroplating & Finishing, 2015, 34（20）: 1150-1154+1151 （in Chinese）.
[9] 朱冬生, 胡韩莹, 王长宏, 等. 化学镀镍金及其温度的影响[J]. 电镀与涂饰, 2008, 27（6）: 25-28.
Zhu D S, Hu H Y, Wang C H, et al. Electroless nickel/immersion gold and the effect of temperature on it[J]. Electroplating & Finishing, 2008, 27（6）: 25-28 （in Chinese）.
[10] 李伟, 王钰蓉, 王文昌, 等. 化学镀钯工艺及镀层性能研究[J]. 电镀与精饰, 2015, 37（12）: 9-14.
Li W, Wang Y R, Wang W C, et al. Palladium plating electroless and performance[J]. Plating & Finishing, 2015, 37（12）: 9-14 （in Chinese）.
[11] 王喜然, 张英伟, 胡新刚, 等. 施镀温度对化学镀Fe-Zn 合金性能的影响[J]. 电镀与涂饰, 2011, 30（5）: 17-20.
Wang X R, Zhang Y W, Hu X G, et al. Influence of plating temperature on properties of electroless Fe-Zn alloy[J]. Electroplating & Finishing, 2011, 30（5）: 17-20 （in Chinese）.

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备注/Memo

收稿日期： 2020-04-05；修回日期： 2020-05-19
通讯作者： 刘光明，Email：gemLiu@126.com
基金项目： 吉安市重大科技专项[2019]55号；国家自然科学

更新日期/Last Update: 2020-12-10