LI Xiang*,LI Peiying.Study on Electroless Tin Plating on Copper Electronic Products[J].Plating & Finishing,2020,(3):39-42.[doi:10.3969/j.issn.1001-3849.2020.03.008]
铜质电子产品表面化学镀锡研究
- Title:
- Study on Electroless Tin Plating on Copper Electronic Products
- Keywords:
- electroless tin plating; deposition time; thickness of tin coating; microstructure; corrosion resistance
- 文献标志码:
- A
- 摘要:
- 以电子产品常用的T2紫铜作为基体进行化学镀锡。通过改变沉积时间，制备了厚度为0.5~4.2 μm的锡镀层。采用扫描电镜分析了锡镀层的微观形貌，采用电化学工作站测试了锡镀层的和紫铜的交流阻抗谱，对耐腐蚀性能进行比较。结果表明：紫铜表面化学镀锡后，其耐腐蚀性能得到改善。沉积时间对锡镀层的微观形貌和耐腐蚀性能有一定影响；随着沉积时间从3 min延长至70 min，锡镀层的微观形貌发生变化，耐腐蚀性能经历了先变好后变差的过程；沉积时间为55 min时制备的锡镀层中主要含有Sn、Cu和C元素，含量分别为89.48%、3.72%、6.80%，各元素均匀分布，其耐腐蚀性能最好。
- Abstract:
- Electroless tin plating experiment was carried out on T2 red copper which was commonly used in electronic products. Tin coatings with a thickness of 0.5-4.2 μm were prepared by changing deposition time. Scanning electron microscope was used to analyze the microstructure of tin coating and electrochemical workstation was used to test the corrosion resistance of tin coating. The corrosion resistance of tin coating was compared with that of red copper. The results showed that the corrosion resistance of red copper was improved after electroless tin plating, while deposition time has an effect on the microstructure and corrosion resistance of tin coating. With the prolonging of deposition time from 3 min to 70 min, the microstructure of tin coating was changed, and the corrosion resistance of tin coating experienced a process of getting better to getting worse. When the deposition time was 55 min, the tin coating was mainly composed of Sn, Cu and C and possessed the best corrosion resistance. The content of Sn, Cu and C was 89.48%、3.72%、6.80%, respectively. These elements were evenly distributed in the coating.
参考文献/References:
[1] 李俊华, 费锡明, 徐芳. 2种有机添加剂对锡电沉积的影响[J]. 应用化学, 2006, 23(9):1042-1046.
[2] 郭忠诚, 徐瑞东. 铜基上化学镀锡[J]. 电镀与环保, 2000, 20(5):22-23.
[3] Atsuo S, Kanbayashi Y, Takano Y, et al. Effects of additives on the deposition rate of autocatalytic electroless tin plating[J]. Journal of the Surface Finishing Society of Japan, 1995, 46(7): 667-669.
[4] 肖忠良, 曾鹏, 周朝花, 等. 化学镀锡中光亮剂PPS、咪唑和HD在Sn表面的吸附作用实验与模拟研究[J]. 表面技术, 2018, 47(12):270-276.
[5] 程骄. PCB上镀锡工艺研究及其电化学过程探讨[D]. 武汉:湖北工业大学, 2010.
[6] 陈健, 陈玉鑫, 黄涛, 等. 不同铬含量耐候钢在高湿热模拟环境中的耐腐蚀性能[J]. 机械工程材料, 2019, 43(4):53-58.
相似文献/References:
[1]贾启华,许晓娟*.沉积时间对镁合金化学镀镍的影响[J].电镀与精饰,2019,(12):1.[doi:10.3969/j.issn.1001-3849.2019.12.001]
JIA Qihua,XU Xiaojuan*.Effect of Deposition Time on Direct Electroless Plating of Magnesium Alloys[J].Plating & Finishing,2019,(3):1.[doi:10.3969/j.issn.1001-3849.2019.12.001]
[2]王 英,毕亚军*,王正一,等.超声波功率对紫铜化学镀锡结构和性能的影响[J].电镀与精饰,2021,(11):17.[doi:10.3969/j.issn.1001-3849.2021.11.004]
WANG Ying,BI Yajun*,WANG Zhengyi,et al.Influence of Ultrasonic Power on Structure and Properties of Electroless Tin Plating on Red Copper[J].Plating & Finishing,2021,(3):17.[doi:10.3969/j.issn.1001-3849.2021.11.004]
[3]赵晓霞,陈立强,田宏波.doi: 10.3969/j.issn.1001-3849.2025.01.002硅异质结太阳能电池中化学镀锡工艺的研究[J].电镀与精饰,2025,(01):9.
Zhao XiaoxiaChen LiqiangTian Hongbo.Research on chemical tin precipitation process in heterojunction solar cells[J].Plating & Finishing,2025,(3):9.
备注/Memo
收稿日期： 2019-11-09；修回日期： 2019-12-11
通信作者：李祥，henan_1363@163.com
基金项目：河南省科技厅项目（9412015Y1363）