ZHANG Liping*,LIU Qingran,HE Xiaobing,et al.Effect of Hole Sealing-Film Forming Process on Corrosion Resistance of Electroplated Thin Nickel Layer?/html>[J].Plating & Finishing,2022,(2):56-59.[doi:10.3969/j.issn.1001-3849.2022.02.012]
封孔-成膜工艺对电镀薄镍层耐蚀性能的影响
- Title:
- Effect of Hole Sealing-Film Forming Process on Corrosion Resistance of Electroplated Thin Nickel Layer?/html>
- 分类号:
- TQ153.1
- 文献标志码:
- A
- 摘要:
- 采用成膜剂和封孔剂复配制备一种封孔 - 成膜剂。通过电位 - 时间曲线、极化曲线、电化学阻抗测试、浸泡实验以及孔隙率测试表征了该封孔 - 成膜剂对薄镍层耐蚀性能的影响。结果表明：对薄镍层经过封孔 - 成膜剂工艺处理之后的薄镍层在 3.5 wt.%NaCl 溶液中的开路电位和自腐蚀电位较正，自腐蚀电流密度较低。电化学传质电阻较大，长期浸泡过程中的腐蚀速率较低。经过该工艺处理后的薄镍层孔隙率降低，耐腐蚀性能得到大幅提高。
- Abstract:
- A sealing film-forming agent was prepared by compounding a film-forming agent and a sealing agent. The effect of the sealing film-forming agent on the corrosion resistance of thin nickel layer was characterized by potential time curve ， polarization curve ， electrochemical impedance test ， immersion test and porosity test. The results showed that the open circuit potential and self-corrosion potential of the thin nickel layer treated by hole sealing-film forming agent process were positive and the self-corrosion current density was low in 3.5 wt.% NaCl solution. The electrochemical mass transfer resistance was large ， and the corrosion rate was low during long-term immersion. The porosity of the thin nickel layer treated by this process was reduced and the corrosion resistance was greatly improved.
参考文献/References:
[1] 曹青 . 全球锂离子电池市场现状及预测 [J]. 新材料产业 , 2019, (9): 2-8.
Cao Q. Current situation and forecast of global lithium ion battery market[J]. Advanced Materials Industry, 2019, (9): 2-8 (in Chinese).
[2] 左培文 , 朱培培 , 邵丽青 . 新能源汽车动力电池产业发展特点与趋势分析 [J]. 汽车文摘 , 2022, (1): 1-7.
Zuo P W, Zhu P P, Shao L Q. The development characteristics and trend analysis of power battery industry for new energy vehicles[J]. Automotive Digest, 2022, (1): 1-7 (in Chinese).
[3] 杨俊峰 , 潘寻 . " 十四五 " 中国锂动力电池产业关键资源供需分析 [J]. 有色金属 ( 冶炼部分 ), 2021, (6): 37-41+52.
Yang J F, Pan X. Analysis on supply and demand of key resource of lithium power battery industry in china during the 14th five-year plan period[J]. Nonferrous Metals (Extractive Metallurgy), 2021, (6): 37-41+52 (in Chinese).
[4] 罗贯虹 . 镍镀层水性无铬钝化后的耐腐蚀性能研究 [J]. 科技与创新 , 2019, (17): 131-132.
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备注/Memo
收稿日期： 2021-11-03 修回日期： 2021-12-11 作者简介： 张立平 （ 1985 —），男，本科， e mail ： 756570521@qq.com