Wang Mingming,Xu Zixuan,Wang Shouhao,et al.Study on wetting properties of electrodeposited nickel coating[J].Plating & Finishing,2023,(7):26-32.[doi:10.3969/j.issn.1001-3849.2023.07.004]
电化学镀镍层的润湿性能研究
- Title:
-
Study on wetting properties of electrodeposited nickel coating
- Keywords:
- electrodeposition ; surface morphology ; wetting angle ; shear strength ; fracture morphology
- 分类号:
- TQ153
- 文献标志码:
- A
- 摘要:
- 为了在微电子器件内凸点下金属化层设计中广泛应用镍基镀层,需要具备良好的润湿性和结合强度。本研究采用电化学表面沉积技术,在金属铜基板上制备了具有不同表面形貌的镍基镀层,并建立了电流密度与镀层表面形貌、均匀性之间的关系。通过系统研究不同镍基镀层上锡基焊球的润湿角和焊点抗剪切强度,发现在电流密度为 2.00 A/dm 2 时制备的镀层表现出最佳表面性能,焊点抗剪切强度可达 92.6 MPa 。此时,镀层表面呈现金字塔状的镍颗粒,润湿角为 75 ° 。
- Abstract:
- : Nickel-based coatings are extensively employed in the design of metallized layers for microelectronic devices , which require excellent wettability and bonding strength. In this study , nickel coatings with different surface morphologies were prepared on copper substrates using electroplating technology. The relationship between current density and surface morphology and uniformity of nickel-based coatings was established. Furthermore , the wetting angle and shear strength of solder joints on different nickel-based coatings were systematically investigated. The findings indicate that the coating prepared at a current density of 2.00 A/dm 2 exhibits superior surface performance , with a maximum shear strength of 92.6 MPa and pyramid-shaped nickel particles on the coating surface. Additionally , the wetting angle of this coating is 75 °.
参考文献/References:
[1] 高丽茵 , 李财富 , 刘志权 , 等 . 先进电子封装中焊点可靠性的研究进展 [J]. 机械工程学报 , 2022, 58(2): 185-202.
[2] 周梓博 , 翟强 . 微电子 3D 封装技术发展 [J]. 电子世界 , 2021, (17): 25-26.
[3] 任春岭 , 鲁凯 , 丁荣峥 . 倒装焊技术及应用 [J]. 电子与封装 , 2009, 9(3): 15-20.
[4] 张小欢 , 冯拉俊 , 卢曼 . 镁合金表面化学镀镍磷工艺优化与镀层性能研究 [J]. 材料保护 , 2022, 55(6): 86-91.
[5] 张群 . 倒装焊及相关问题的研究 [D]. 中国科学院上海冶金研究所 , 2001.
[6] 孙垂康 , 贾卫平 , 周绍安 , 等 . 超声辅助脉冲电沉积 Ni-TiN 复合镀层的结合力和耐蚀性 [J]. 材料保护 , 2021, 54(4): 80-85.
[7] 苑博旭 , 马春阳 , 张思栋 . 超声 - 射流电沉积 Ni/Co-TiN 纳米镀层的工艺参数优化及性能研究 [J]. 材料保护 , 2022, 55(5): 92-98.
[8] Zhen Y, Liu X, Yi T. Fabrication of super-hydrophobic nickel film on copper substrate with improved corrosion inhibition by electrodeposition process[J]. Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2018, 56(6): 205-212.
[9] Zhou J, Zhao G, Li J, et al. Electroplating of non-fluorinated superhydrophobic Ni/WC/WS composite coatings with high abrasive resistance[J]. Applied Surface Science, 2019, 487: 1329-1340.
[10] Abbasi-Amandi A, Ahmadi N P, Ojaghi-Ilkhchi M, et al. Physical and electrochemical behavior of black nickel coatings in presence of KNO 3 and imidazole additives[J]. Journal of Electroanalytical Chemistry, 2021, 893(9): 115310.
[11] Portela D G, Nepel T, Costa J M, et al. Two-stages electrodeposition for the synthesis of anticorrosive Ni-W-Co coating from a deactivated nickel bath[J]. Materials Science and Engineering B, 2020, 260: 114611.
[12] Zhang H G, Zhang N, Fang F Z. Synergistic effect of surfactant and saccharin on dispersion and crystal refinement for electrodeposition of nanocrystalline nickel/graphene oxide composite[J]. Surface and Coatings Technology, 2020 (402): 126292.
[13] Xu M, Shen L, Jiang W, et al. Fabrication of Ni-SiC super hydrophilic surface by magnetic field-assisted scanning electrodeposition[J]. Journal of Alloys and Compounds, 2019 (799): 224-231.
[14] 陈敏娜 , 丁士进 , 张卫 , 等 . 直流和脉冲电镀镍层的形貌和结构比较研究 [C]// 2007 年上海市电子电镀学术年会论文集 . 上海 , 2007.
[15] Katsich C, Badisch E, Roy M, et al. Erosive wear of hardfaced Fe – Cr – C alloys at elevated temperature[J]. Wear, 2009, 267(11): 1856-1864
[16] Yue B W, Zhu G M, Wang Y W, et al. Research on wettability of nickel coating changes induced in the electrodeposition process[J]. Journal of Electroanalytical Chemistry, 2022 (910): 116146.
[17] Saad S, Boumerzoug Z, Helbert A L, et al. Effect of TiO 2 -nanoparticles on Ni electrodeposition on copper wire[J]. Metals-Open Access Metallurgy Journal, 2020, 10(3): 406-413.
[18] Xu Q, Lin H, Liu H. Effect of coating thickness on wetting behavior of nickel-coated alumina by molten aluminum[J]. Journal of Materials Engineering and Performance, 2022, (8): 1-9.
[19] 李正兵 , 李海涛 , 郭义乐 , 等 . Co 颗粒含量对 SnBi/Cu 接头微观组织与性能 [J]. 材料工程 , 2022, 50(7): 7-11.
[20] Kim J H, Lee Y C, Lee S M, et al. Effect of surface finishes on electromigration reliability in eutectic Sn-58Bi solder joints[J]. Microelectronic Engineering, 2014, 120(5): 77-84.
[21] Lee S M, Yoon J W, Jung S B. Interfacial reaction and mechanical properties between low melting temperature Sn-58Bi solder and various surface finishes during reflow reactions[J]. Journal of Materials Science, 2015, 26(3): 1649-1660.
相似文献/References:
[1]刘冬冬,韩 冰,陈 燕,等.GCr15轴承内圈磁粒研磨光整实验[J].电镀与精饰,2019,(7):1.[doi:10.3969/j.issn.1001-3849.2019.07.001]
LIU Dongdong,HAN Bing,CHEN Yan,et al.Experimental Study on GCr15 Bearing Inner Ring Magnetite Grinding and Finishing[J].Plating & Finishing,2019,(7):1.[doi:10.3969/j.issn.1001-3849.2019.07.001]
[2]姚知深,牛宗伟*,刘 斌,等.超声振动对65钢电解磷化膜表面形貌与耐蚀性的影响[J].电镀与精饰,2019,(9):24.[doi:10.3969/j.issn.1001-3849.2019.09.005]
YAO Zhishen,NIU Zongwei*,LIU Bin,et al.Effect of Ultrasonic Vibration on Surface Morphology and Corrosion Resistance of 65 Steel Electrolytic Phosphating Film[J].Plating & Finishing,2019,(7):24.[doi:10.3969/j.issn.1001-3849.2019.09.005]
[3]赵 杨,陈 燕*,程 淼,等.电磁场作用下球形磁极辅助研磨弯管内表面研究[J].电镀与精饰,2020,(1):22.[doi:10.3969/j.issn.1001-3849.2020.01.005]
ZHAO Yang,CHEN Yan*,CHENG Miao,et al.Study on the Inner Surface Finishing of Bend Pipe by Electromagnetic Fields Drive Spherical Magnetic Pole[J].Plating & Finishing,2020,(7):22.[doi:10.3969/j.issn.1001-3849.2020.01.005]
[4]肖长江*,陈贻光,栗晓龙.镀膜金刚石与铜基结合剂间把持力提高方法探讨[J].电镀与精饰,2020,(2):15.[doi:10.3969/j.issn.1001-3849.2020.02.004]
XIAO Changjiang*,CHEN Yiguang,LI Xiaolong.Discussion on Improving the Holding Force Between Coated-Diamond and Cu-Matrix Binder[J].Plating & Finishing,2020,(7):15.[doi:10.3969/j.issn.1001-3849.2020.02.004]
[5]王 杰,陈 燕*,吕旖旎,等.开槽仿形磁极在轴承内圈滚道光整中的应用[J].电镀与精饰,2020,(5):32.[doi:10.3969/j.issn.1001-3849.2020.05.0050]
WANG Jie,CHEN Yan*,LV Yini,et al.Application of Slotted Profiling Magnetic Pole in Bearing Inner Ring Groove Finishing[J].Plating & Finishing,2020,(7):32.[doi:10.3969/j.issn.1001-3849.2020.05.0050]
[6]张雪娜,冯贝贝,索文华,等.电沉积法制备Ni-GO复合镀层的工艺及力学性能研究[J].电镀与精饰,2020,(8):1.[doi:10.3969/j.issn.1001-3849.2020.08.0010]
ZHANG Xuena,FENG Beibei,SUO Wenhua,et al.Study on the Process and Mechanical Properties of Ni-GO Composite Coating Prepared by Electrodeposition[J].Plating & Finishing,2020,(7):1.[doi:10.3969/j.issn.1001-3849.2020.08.0010]
[7]叶 萍*,周 倩,董 良.屏蔽罩超声辅助电镀Ni-Co/SiO2复合镀层的耐蚀性研究[J].电镀与精饰,2021,(2):28.[doi:10.3969/j.issn.1001-3849.2021.02.0060]
YE Ping*,ZHOU Qian,DONG Liang.叶 萍1*,周 倩2,董 良3[J].Plating & Finishing,2021,(7):28.[doi:10.3969/j.issn.1001-3849.2021.02.0060]
[8]赵 明,郭国才*,宫尚霞,等.不同还原剂条件下的化学镀银研究[J].电镀与精饰,2022,(9):53.[doi:10.3969/j.issn.1001-3849.2022.09.010]
ZHAO Ming,GUO Guocai*,GONG Shangxia,et al.Study on Electroless Plating of Silver with Different Reductants[J].Plating & Finishing,2022,(7):53.[doi:10.3969/j.issn.1001-3849.2022.09.010]
[9]叶成茁,丁运虎*,毛祖国,等.光纤腐蚀传感器Fe-C薄膜电沉积工艺研究[J].电镀与精饰,2023,(2):49.[doi:10.3969/j.issn.1001-3849.2023.02.008]
Ye Chengzhuo,Ding Yunhu*,Mao Zuguo,et al.Electrodeposition process of Fe-C film for fiber optic corrosion sensor[J].Plating & Finishing,2023,(7):49.[doi:10.3969/j.issn.1001-3849.2023.02.008]
[10]万一群,齐韦*,沈鹏杰,等.基板表面形貌对镀锡板润湿能力影响的研究[J].电镀与精饰,2023,(4):38.[doi:10.3969/j.issn.1001-3849.2023.04.007]
Wan Yiqun,Qi Wei*,Shen Pengjie,et al.Study on blackplate surface morphology effect on wettability for tinplate[J].Plating & Finishing,2023,(7):38.[doi:10.3969/j.issn.1001-3849.2023.04.007]
备注/Memo
收稿日期: 2022-08-15 修回日期: 2022-09-08 作者简介: 王明明( 1980 ―),男,高级工程师, e-mail : 306984241@qq.com * 通信作者: 刘俐, e-mail : l.liu@whut.edu.cn 基金项目: 国家自然科学基金项目(编号: 62004144 , 61904127 )