[1]段 钰,陈耀东,刘宁华.doi: 10.3969/j.issn.1001-3849.2026.04.014六价铬电镀工艺及镀液杂质离子的去除研究[J].电镀与精饰,2026,(04):92-99.
　DUAN Yu,CHEN Yaodong,LIU Ninghua.Research on process and removal of impurity ions in hexavalent chromium plating[J].Plating & Finishing,2026,(04):92-99.
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doi: 10.3969/j.issn.1001-3849.2026.04.014六价铬电镀工艺及镀液杂质离子的去除研究()

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2026年04
页码:
92-99
栏目:
出版日期:
2026-04-30

文章信息/Info

Title:
Research on process and removal of impurity ions in hexavalent chromium plating
作者:
段 钰; 陈耀东; 刘宁华
(广州三孚新材料科技股份有限公司,广东 广州,510665)
Author(s):
DUAN Yu;  CHEN Yaodong;  LIU Ninghua
(Guangzhou Sanfu New Material Technology Co., Ltd., Guangzhou 510665, China)
关键词:
六价铬电镀; 电流密度; 稀土元素; 金属杂质离子
Keywords:
hexavalent chromium plating;  current density;  rare earth elements;  metal impurity ions
分类号:
TQ153.1 TG176
文献标志码:
A
摘要:
针对六价铬电镀中镀液稳定性差的问题，本文研究了镀液组分、电流密度、杂质离子等多个关键因素对铬镀层质量的影响。首先通过调整镀液中硫酸浓度确定了最佳硫酸含量，然后通过调整电流密度，获得了不同条件下的硬铬镀层，分析了电流密度对镀层性能的影响，确定了最佳电流密度。加入各种浓度的氯化铈，表征了其对镀铬的影响，最后通过引入金属杂质离子并测试其对镀层的影响，提出了控制镀液中杂质离子含量的方法，以确保镀液的稳定性和镀层的高质量。镀液最佳工艺参数组分为：硫酸2 mL/L、氧化铈0.1 g/L；镀层硬度，电流效率以及镀层的覆盖面积都随着金属杂质离子的增加而变差，通过ICP-MS准确检测出了镀液中的金属杂质离子，并利用隔膜电解装置对杂质金属离子进行了有效的去除。研究结果为优化六价铬电镀工艺提供了理论依据，为六价铬镀液的除杂提供了科学方法和实践指导。
Abstract:
In order to solve the problem of poor stability of plating solution in hexavalent chromium plating, the influence of multiple key factors, such as plating solution composition, current density, and impurity ions, on the quality of chromium coatings were investigated in the hexavalent chromium electroplating process. Firstly, the optimal sulfuric acid concentration was determined by adjusting the sulfuric acid content in the plating solution. Then, hard chromium coatings were obtained under different conditions by adjusting the current density. The influence of current density on the properties of the coatings was analyzed to determine the optimal current density. Various concentrations of cerium chloride were added to characterize its effect on chromium plating. Finally, by introducing metal impurity ions and testing their effect on the coating, a method for controlling the impurity ion content in the plating solution was proposed to ensure the stability of the plating solution and the high quality of the coating. The optimal process parameters of the plating solution are composed of 2 mL/L sulfuric acid and 0.1 g/L cerium oxide. The hardness, current efficiency, and coverage area of the coating all deteriorate with increasing metal impurity ions. Metallic impurity ions in the plating solution were accurately detected by ICP-MS and effectively removed using a diaphragm electrolysis device. The research results provide a theoretical basis for optimizing the hexavalent chromium electroplating process and scientific methods and practical guidance for impurity removal in hexavalent chromium plating solutions

参考文献/References:

[1].刘俊莲, 华三, 江冰. 电镀硬铬技术发展综述及操作要点[J]. 电镀与涂饰, 2013, 32(7): 14-20.
[2].张升达, 王如星. 微裂纹高效镀硬铬工艺研究[J]. 材料保护. 2002, 2(9): 34-37.
[3].李昌树. 高效六价铬镀铬工艺研究[D]. 沈阳: 沈阳理工大学, 2008.
[4].BAYRAMOGLU M, ONAT B, GEREN N. Statistical optimization of process parameters to obtain maximum thickness and brightness in chromium plating[J]. Journal of Materials Processing Technology. 2008, 203(1-3): 277-286.
[5].王忠诚, 隋培玲, 吕翠峰, 等. 提高内燃机气门杆部镀硬铬附着力的工艺方法研究[J]. 电镀与精饰, 2023, 45(7): 90-100.
[6].焦贵生, 杜庆新, 李小翻, 等. 提高电镀硬铬镀层与基体金属结合力的方法[J]. 电镀与精饰, 2023, 45(9): 69-73.
[7].付隔清, 石峰, 芦文国. 某型主起活塞杆电镀硬铬技术研究[J]. 新技术新工艺, 2024, 434(2): 46-49.
[8].LANGER C, WENDLAND W, HONOLD K, et al. Corrosion analysis of decorative microporous chromium plating systems in concentrated aqueous electrolytes[J]. Engineering failure analysis, 2018, 9(1): 255-274.
[9].关山, 张琦, 胡如南. 电镀铬的最新发展[J]. 材料保护, 2000(3): 1-3.
[10].李贵兵, 李秀均, 胡葆福, 等. 温度和电流密度对高速镀铬钢板性能的影响[J]. 电镀与涂饰, 2013(8): 12-15.
[11].覃奇贤, 刘淑兰. 电镀液的电流效率及其测定方法[J]. 电镀与精饰, 2008, 30(4): 27-29.
[12].王悦鼎, 周雪荣, 李秀军, 等. 含氟硅酸的镀液成分对镀铬板性能的影响[J]. 电镀与涂饰, 2022, 41(11): 777-783.
[13].鄂义峰, 丁扬栋, 方芳. 高铁含量镀铬液中硫酸根的测定[J]. 锦州医学院学报 2006, 27(2): 41-42.
[14].奚兵. 浅谈镀铬液中硫酸的质量浓度[J]. 电镀与精饰, 2009, 31(1): 26-27.
[15].王楠, 孙杰, 孙慧艳. 硫酸铈对三价铬钝化膜耐腐蚀性的影响研究[J]. 表面技术, 2016, 45(11): 113-117.
[16].赵琳. 稀土元素在电镀中的应用[J]. 电镀与环保, 2012, 32(6): 1-2.
[17].冯拉俊, 雷阿利. 稀土添加剂对镀铬质量的影响[J]. 中国稀土学报, 2004, 22(5): 656-659.
[18].钱达人. 稀土添加剂在电沉积铬层中的应用[J]. 材料保护, 1991(3): 24-27.
[19].BAYATLI, A, KOCABAS, et al. Effect of organic catalyst addition on pitting evolution at hard chromium plating[J]. Journal of Materials Engineering and Performance, 2023, 32(5): 2319-2329.
[20].李新梅. 高效复合镀铬添加剂的研究[D]. 西安: 西安理工大学, 2002.
[21].刘建祥. 有机磺酸盐添加剂对电镀硬铬性能的影响[J]. 电镀与精饰, 2021, 43(6): 6-9.
[22].赵黎云, 钟丽萍, 黄逢春. 电镀铬添加剂的发展与展望[J]. 电镀与精饰, 2001, 23(5): 9-12.
[23].陈国义, 胡学龙. 镀铬电解液中杂质的影响及其去除[J]. 电镀与精饰, 1997, 19(4): 25-28.

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备注/Memo

备注/Memo:
电镀添加剂作为电镀工艺中不可或缺的微量成分，也一直是人们最主要的研究方向之一。从最初的硫酸，有机磺酸盐等到后来的甲基二磺酸钠以及稀土化合物，随着添加剂研究的深入，镀层质量也越来越好。其中阴离子型微量元素是镀液中不可或缺的部分。虽然硫酸根可以用氟离子、氟硼酸等代替，但实际使用中绝大部分镀液主要使用的还是硫酸根，其添加量直接决定着镀层的状态，合理控制硫酸根含量对镀液的稳定有着非常大的作 用[12-14]。甲基二磺酸钠等有机物加入镀液中，可以大大提高镀液的各项性能，包括电流效率，镀层平整度等。阳离子型微量元素在镀液中起着锦上添花的作用，像稀土元素独有的4f层电子结构和化学性能使得稀土元素具有独特功能[15-18]。因此，在六价铬镀液中加入稀土化合物，研究其对镀层的影响对镀铬工艺的发展有着积极的意义[19-22]。
更新日期/Last Update: 2026-04-15