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[1]徐 曦,邓乐萍.一起铝合金镀银起泡质量问题的研究探讨[J].电镀与精饰,2021,(4):44-47.[doi:10.3969/j.issn.1001-3849.2021.04.010]
 XU Xi,DENG Leping.Study on the Blistering Quality Problem of Aluminum Alloy Silver Plating[J].Plating & Finishing,2021,(4):44-47.[doi:10.3969/j.issn.1001-3849.2021.04.010]
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一起铝合金镀银起泡质量问题的研究探讨

参考文献/References:

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[2] 邹森, 李亚明, 杨凤梅. 电流密度对氨基磺酸镍电镀镍镀层的影响[J]. 山东化工, 2011, 40(8):55-56.
Zou S, Li Y M, Yang F M. Effection of current density on the nickel coating of nickel sulfamate [J]. Shandong Chemical Industry, 2011, 40(8):55-56 (in Chinese).
[3] 王宗雄, 储荣邦, 鲍新华. 实用氰化镀银工艺[J]. 电镀与涂饰, 2015, 34(24):1424-1438.
Wang Z X, Chu R B, Bao X H. Practical cyanide silver electroplating processes[J]. Electroplating & Finishing. 2015, 34(24):1424-1438 (in Chinese).
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Gao H H, Bu L X, Wang W. Future development and application of plating technology [J]. Plating & Finishing, 2016, 38(5): 29-33 (in Chinese).
[5] 赵健伟. 温度和电流密度对无氰镀银层微观形貌的影响[J]. 电镀与精饰, 2014, 36(7): 12-15.
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备注/Memo

收稿日期:2019-07-13;修回日期:2019-09-06
作者简介:邓曦,男,工程师,Eamil:lovebeforetime@163.com

更新日期/Last Update: 2021-04-10