Song Yifeng,Wang Yueding,Yue Chongxiang*,et al.Effect of surface films on surface tension of tinplate and shrinkage hole during printing?/html>[J].Plating & Finishing,2023,(12):8-14.[doi:doi ： 10.3969/j.issn.1001-3849.2023.12.002]
表面膜层对镀锡板表面张力及印铁缩孔的影响
- Title:
- Effect of surface films on surface tension of tinplate and shrinkage hole during printing?/html>
- Keywords:
- tinplate ; shrinkage hole ; passivation film ; oxide film ; surface tension
- 分类号:
- TQ153.13
- 文献标志码:
- A
- 摘要:
- 针对镀锡板与涂料的表面张力不匹配所导致的缩孔问题，采用达因笔检测镀锡板表面张力，并进行印铁测试，以观察缩孔情况，还通过热重分析与 X 射线光电子能谱研究了镀锡板表面油膜、钝化膜与氧化膜在印铁环境中的变化。结果表明：油膜对镀锡板表面张力与印铁缩孔有一定影响，当涂油量由 2 mg/m 2 增加至 6 mg/m 2 时，表面张力由 29 mN/m 降低至 27 mN/m ，出现印铁缩孔；钝化膜在 3~7 mg/m 2 范围内对镀锡板表面张力与印铁缩孔无直接影响；氧化膜对镀锡板表面张力与印铁缩孔有明显影响，当氧化膜量增加到 1.99 mC/cm 2 时，表面张力降至 27 mN/m ，出现印铁缩孔。预烘烤可使表面 DOS 油提前挥发，且能使氧化膜中不稳定的 SnO 转化为稳定的 SnO 2 ，有利于避免印铁缩孔问题。
- Abstract:
- ： In order to solve shrinkage hole caused by surface tension mismatch between tinplate and coating ， the surface tension of tinplate was tested by Dyne pen and the phenomena of shrinkage hole was observed by printing test. The changes of oil film ， passivation film and oxide film on tinplate surface under printing environmental condition were studied by thermogravimetric analysis and X-ray photoelectron spectroscopy （ XPS ） . The results showed that the oil film had effect on the surface tension of the tinplate and shrinkage hole during printing. As the oil content increased from 2 mg/m 2 to 6 mg/m 2 ， the surface tension dropped from 29 mN/m to 27 mN/m and shrinkage hole appeared during printing. The passivation film with the content range between 3 mg/m 2 and 7 mg/m 2 has no direct impact on the surface tension and the shrinkage hole during printing. The oxide film has obvious influence on the surface tension and the shrinkage hole during printing. When the oxide film content reached 1.99 mC/cm 2 ， the surface tension reduced to 27 mN/m and the shrinkage hole appeared during printing. DOS oil on tinplate surface could be volatilized in advance and unstable SnO be converted into stable SnO 2 in oxide film by pre-baking ， which is conductive to avoid shrinkage hole during printing.
参考文献/References:
[1] 孙学亮 , 黄勇军 , 梅华兴 , 等 . 镀锡板生产中电镀工艺发展综述 [J]. 电镀与涂饰 , 2015, 34(7): 409-411.
[2] 金旭芳 , 赵鹏飞 , 吴小兵 , 等 . 我国电镀锡板生产工艺技术现状及发展趋势 [J]. 轧钢 , 2013, 30(3): 41-42.
[3] 黄久贵 , 李宁 , 蒋丽敏 , 等 . 镀锡板耐蚀性研究及进展 [J]. 电镀与环保 , 2003, 23(6): 5-9.
[4] 宋浩 , 王刚 , 方圆 , 等 . 不同因素对涂覆镀锡板耐蚀性的影响 [J]. 电镀与涂饰 , 2023, 42(5): 69-73.
[5] 张力 . 不同拉伸变形量下镀锡板 / 涂层体系的腐蚀行为研究 [D]. 天津 : 天津大学材料科学与工程学院 , 2018.
[6] 王洺浩 . 镀锡板表面钝化膜的厚度分布及其组成与性能的研究 [D]. 哈尔滨 : 哈尔滨工业大学化学与化工学院 , 2018.
[7] 宋浩 , 杨鸿建 , 吴明辉 , 等 . 镀锡板硫化斑分析及控制工艺研究 [J]. 电镀与精饰 , 2022, 44(12): 54-59.
[8] 吴磊 , 陈海飞 . 镀锡板缩孔缺陷原因分析及控制 [J]. 梅山科技 , 2014 (5): 47-49.
[9] 晏人芸 . 镀锡板涂饰缺陷原因分析及对策 [J]. 宝钢技术 , 2014 (2): 48-56.
[10] 万一群 , 齐韦 , 沈鹏杰 , 等 . 基板表面形貌对镀锡板润湿能力影响的研究 [J]. 电镀与精饰 , 2023, 45(4): 38-44.
[11] 李旭东 . 钝化工艺对镀锡板表面润湿性的影响 [J]. 电镀与涂饰 , 2019, 38(1): 29-31.
[12] Ginés M, Benítez G, Egli W, et al. Tinplate wettability by organic coatings [C]//15th IAS Rolling Conference. San Nicolas: [s.n.], 2004: 411-419.
[13] Melvin C, Jewell E, Miedema J, et al. Identifying interlayer surface adhesion failure mechanisms in tinplate packaging steels[J]. Packaging Technology and Science, 2019, 32(7): 345-355.
[14] 兰剑 , 李建中 . DOS 油对镀锡板表面涂饰性的影响 [J]. 电镀与涂饰 , 2020, 39(21): 1491-1494.
[15] 兰剑 , 李建中 . 钝化膜结构对镀锡板表面润湿性的影响 [J]. 电镀与涂饰 , 2020, 39(23): 1648-1653.
[16] 王志登 , 王洺浩 , 李宁 . 预烘烤对镀锡板表面膜层和润湿性的影响 [J]. 表面技术 , 2020, 49(12): 156-161.
[17] 国际锡研究所 . 镀锡板指南 [M]. 周其良译 . 北京 : 冶金出版社 , 1989: 93-95.
[18] 王章薇 , 宋鹏宇 , 游波 . 改性聚酯涂层的制备及在食品包装材料中的应用 [J]. 包装工程 , 2022, 43(9): 1-9.
[19] 赵亚溥 . 表面与界面物理力学 [M]. 北京 : 科学出版社 , 2012.
[20] 万一群 , 齐韦 , 吴明辉 , 等 . 软熔和钝化工艺参数对镀锡板印铁涂布缩孔的影响 [J]. 电镀与涂饰 , 2023, 42(11): 58-65.
相似文献/References:
[1]许姣姣*.镀锡板铬酸钝化工艺研究[J].电镀与精饰,2021,(7):56.[doi:10.3969/j.issn.1001-3849.2021.07.011]
XU Jiaojiao*.Process Research of Chromic acid Passivation on the Tinplate[J].Plating & Finishing,2021,(12):56.[doi:10.3969/j.issn.1001-3849.2021.07.011]
[2]宋 浩 *,方 圆,石云光,等.镀锡板边部漆膜附着力影响因素研究[J].电镀与精饰,2022,(11):47.[doi:10.3969/j.issn.1001-3849.2022.11.009]
SONG Hao *,FANG Yuan,SHI Yunguang,et al.Study of Influence Factors on the Edge Lacquer Adhesion of Tinplate[J].Plating & Finishing,2022,(12):47.[doi:10.3969/j.issn.1001-3849.2022.11.009]
[3]周桂海*,王德智,胡宏卫.电感耦合等离子原子发射法测定镀锡板中钝化锆[J].电镀与精饰,2022,(11):95.[doi:10.3969/j.issn.1001-3849.2022.11.017]
ZHOU Guihai*,WANG Dezhi,HU Hongwei.Determination of Passivated Zirconium of Tin Plate by Inductively Coupled Plasma Atomic Emission Spectrometry[J].Plating & Finishing,2022,(12):95.[doi:10.3969/j.issn.1001-3849.2022.11.017]
[4]宋浩,杨鸿建,吴明辉*,等.镀锡板硫化斑分析及控制工艺研究[J].电镀与精饰,2022,(12):54.[doi:10.3969/j.issn.1001-3849.2022.12.008]
SONG Hao,YANG Hongjian,WU Minghui*,et al.Analysis and Control Technology of Sulfide Staining on Tinplate[J].Plating & Finishing,2022,(12):54.[doi:10.3969/j.issn.1001-3849.2022.12.008]
[5]万一群,齐韦*,沈鹏杰,等.基板表面形貌对镀锡板润湿能力影响的研究[J].电镀与精饰,2023,(4):38.[doi:10.3969/j.issn.1001-3849.2023.04.007]
Wan Yiqun,Qi Wei*,Shen Pengjie,et al.Study on blackplate surface morphology effect on wettability for tinplate[J].Plating & Finishing,2023,(12):38.[doi:10.3969/j.issn.1001-3849.2023.04.007]
[6]吴明辉,王振文,石云光,等.镀锡板耐黑变性能影响因素研究[J].电镀与精饰,2023,(5):80.[doi:10.3969/j.issn.1001-3849.2023.05.011]
Wu Minghui,Wang Zhenwen,Shi Yunguang,et al.Study on influencing factors of blackening resistance of tinplate[J].Plating & Finishing,2023,(12):80.[doi:10.3969/j.issn.1001-3849.2023.05.011]
[7]孙 宇*,陈艺敏,石云光,等. 气雾阀用镀锡板表面黑点缺陷分析 [J].电镀与精饰,2023,(12):110.[doi:doi ： 10.3969/j.issn.1001-3849.2023.12.016]
Sun Yu*,Chen Yimin,Shi Yunguang,et al.Black point defect analysis of tinplate for aerosol valve[J].Plating & Finishing,2023,(12):110.[doi:doi ： 10.3969/j.issn.1001-3849.2023.12.016]
[8]陈艺敏 *,孙 宇,常树林,等.不同工艺条件对低锡量镀锡板耐蚀性的影响莫志英?/span>[J].电镀与精饰,2024,(1):34.[doi:10.3969/j.issn.1001-3849.2024.01.006]
Chen Yimin*,Sun Yu,Chang Shulin,et al.Effect of different process conditions on the corrosion resistance of low tin content tinplate[J].Plating & Finishing,2024,(12):34.[doi:10.3969/j.issn.1001-3849.2024.01.006]
备注/Memo
收稿日期： 2023-10-07 修回日期： 2023-10-26 作者简介： 宋乙峰（ 1986 —），男，硕士，高级工程师， email ： yifengsong@126.com * 通信作者： 岳重祥（ 1982 —），男，博士，正高级工程师， email ： chongxiang39@163.com?/html>