SONG Hao,YANG Hongjian,WU Minghui*,et al.Analysis and Control Technology of Sulfide Staining on Tinplate[J].Plating & Finishing,2022,(12):54-60.[doi:10.3969/j.issn.1001-3849.2022.12.008]
镀锡板硫化斑分析及控制工艺研究
- Title:
- Analysis and Control Technology of Sulfide Staining on Tinplate
- Keywords:
- tinplate ; lacquer adhesion ; passivation charge density ; sulfide staining ; surface morphology
- 分类号:
- TG174
- 文献标志码:
- A
- 摘要:
- 针对镀锡板罐抗硫性能检测时在罐身与罐盖接缝位置出现硫化斑问题，通过扫描电子显微镜、白光干涉仪、电化学工作站、附着力测试仪，研究了硫化斑形成的原因及钝化膜、表面形貌、漆膜附着力与抗硫性能的关系。研究结果表明：镀锡板钝化电荷密度、钝化膜含量、漆膜附着力和表面形貌是影响镀锡板抗硫性能的关键因素。钝化电荷密度 0.3 A?/span> dm -2 时镀锡板边部与中部的附着力和抗硫性能均能达到 1 级，平整机工作辊为 1.3 μ m+0.4 μ m 时，镀锡板表面最大轮廓高度小于漆膜厚度 3 μ m ，压力变形不会导致漆膜破损引发硫化腐蚀，成品罐抗硫性能合格率达到 100% 。
- Abstract:
- ： To the problem of sulfide staining at the joint position between can body and lid during the sulfide staining resistance test of tinplate cans ， the causes of sulfide staining and the relationship between the passivation film ， surface morphology ， lacquer adhesion and sulfide staining resistance were studied by the scanning electron microscope ， white light interferometer ， electrochemical workstation and adhesion tester. The results show that the passivation charge density ， content of passivation film ， lacquer adhesion and surface morphology are the key factors affecting the sulfide staining resistance of tinplate . When the passivation charge density is 0.3 As. dm -2 ， the adhesion and sulfide staining resistance of the edge and the middle position can reach grade 1. When the working roll of the leveling machine is 1.3 μ m+0.4 μ m ， the maximum contour height of the tinplate surface is less than 3 μ m of the lacquer film thickness ， the pressure change will not cause the lacquer film to be damaged and sulfide staining occurs ， and the qualified rate of sulfide staining resistance of the tinplate cans is up to 100%.
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备注/Memo
收稿日期： 2022-06-05 修回日期： 2022-10-09 作者简介： 宋浩（ 1988 —），男，研究生（硕士），工程师， email ： songhao19880405@163.com * 通信作者： 吴明辉（ 1989 —），男，研究生（硕士），工程师， email ： wuminghui0429@163.com