[1]李富军,方舒,何欢,等.添加剂对无氰电镀Cu-Zn合金镀层性能的影响[J].电镀与精饰,2019,(8):14-19.[doi:10.3969/j.issn.1001-3849.2019.08.004]
　LI Fujun,FANG Shu,HE Huan,et al.Effect of Additives on the Properties of Cyanide-Free Electroplating Cu-Zn Alloy Coatings[J].Plating & Finishing,2019,(8):14-19.[doi:10.3969/j.issn.1001-3849.2019.08.004]
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添加剂对无氰电镀Cu-Zn合金镀层性能的影响()

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2019年8
页码:
14-19
栏目:
出版日期:
2019-08-15

文章信息/Info

Title:
Effect of Additives on the Properties of Cyanide-Free Electroplating Cu-Zn Alloy Coatings
作者:
李富军1; 方舒1; 何欢2; 刘定富1*
1.贵州大学化学与化工学院，贵州 贵阳 550025； 2.云南锡业锡材有限公司，云南 昆明 650501
Author(s):
LI Fujun1;  FANG Shu1;  HE Huan2;  LIU Dingfu1*
1.School of Chemistry and Chemical Engineering, Guizhou University, Guiyang 550025, China;2.Yunnan Tin Industry Tin Co. Ltd., Kunming 650501, China
关键词:
光亮剂; 表面活性剂; 无氰电镀; 光泽度
Keywords:
brightener;  surface active agent;  cyanide-free electroplating;  gloss
DOI:
10.3969/j.issn.1001-3849.2019.08.004
文献标志码:
A
摘要:
采用单因素实验考察了光亮剂二氧化硒、2-巯基苯并咪唑、苯骈三氮唑聚以及表面活性剂OP-10、十二烷基硫酸钠、十二烷基苯磺酸钠、吐温80添加剂对无氰电镀Cu-Zn合金镀层光泽度的影响。通过采用正交试验研究了添加剂对镀层的光亮度、结合力、外观形貌及镀液性能的影响，得到较优的添加剂量为：8 mg/L二氧化硒、1.5 mg/L 2-巯基苯并咪唑、90 mg/L十二烷基苯磺酸钠、50 mg/L吐温80；加入较优的复配添加剂后镀层的光泽度为248 Gs，结合力、镀液性能优良以及外观形貌平整、细致。镀液基础配方：30 g/L硫酸铜、9 g/L硫酸锌、90 g/L酒石酸钾钠、35 g/L草酸钾、15 g/L乳酸、20 g/L碳酸钾，工艺条件：pH 12.4、温度40 ℃、电流密度4 A/dm2、施镀5 min。
Abstract:
The single factor experiments were used to investigate the effects of brighteners selenium dioxide, 2-mercaptobenzimidazole, benzotriazole polymerization and surfactant OP-10, lauryl sodium sulfate, SDBS, Tween 80 additive on the gloss of cyanide-free Cu-Zn alloy coatings. The effects of additives on the luminance, adhesion, appearance and bath properties of the coatings were studied by orthogonal tests. The optimal additive amount was as follows: 8 mg/L selenium dioxide, 1.5 mg/L 2-methyl-phenyl-benzidine, 90 mg/L SDBS, 50mg/L Tween 80. After the addition of better additives, the gloss of the coatings was 248 Gs, and the coatings had binding force, excellent bath performance, smooth and fine appearance. The basic formula of the plating solution was as follows: 30 g/L copper sulfate, 9 g/L zinc sulfate, 90 g/L potassium sodium tartrate, 35 g/L potassium oxalate, 15 g/L lactic acid, 20 g/L potassium carbonate, and the process conditions were as follows: pH 12.5, temperature of 40 ℃, the current density of 4 A/dm2, and the plating time of 5 min.

参考文献/References:

[1] 屠振密. 电镀合金原理与工艺[M]. 北京: 国防工业出版社, 1993.
[2] 屠振密, 李宁, 安茂忠, 等. 电镀合金实用技术[M]. 北京: 国防工业出版社, 2007.
[3] 邹忠利, 李宁, 王殿龙, 等. 钢铁基体无氰碱性镀铜的研究进展[J]. 电镀与环保, 2008, 02: 9-13.
[4] 韦公远. 几种仿金电镀工艺[J]. 企业技术开发, 1999, 11: 28-29.
[5] Thomson D W. Gold alloy plating compositions and method[P]. US Patent 4179344, 1979.
[6] Abbott C N. Zinc-copper alloy electroplating baths[P]. US Patent 3930965, 1976.
[7] 于锦, 贾冠英, 李文军. 无氰仿金镀研究[J]. 沈阳工业大学学报, 2001, 23(2): 176-178.
[8] 方舒, 何欢, 叶涛, 等. 辅助络合剂对无氰电镀Cu-Zn合金的影响[J]. 电镀与精饰, 2019, 41（6）:18-22.
[9] 张允诚, 胡如南, 向荣. 电镀手册[M]. 北京: 国防工业出版社, 2007.
[10] 毕晨, 刘定富, 曾庆雨. 丁儿酰亚胺体系无氰镀银添加剂的研究[J]. 电镀与涂饰, 2016, 35（3）: 131-132.

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备注/Memo

备注/Memo:
收稿日期： 2018-12-24；修回日期： 2019-02-14
通信作者： 刘定富，email: liuxiao8989@163.com
基金项目： 2017年贵州大学研究生创新基金（研理工2017003）
更新日期/Last Update: 2019-08-10