Li Wenchang,Sheng Shizhan,Wu Jinhong,et al.Effect of surfactant on deposition behavior and properties of electroless Ni-W-P coatings[J].Plating & Finishing,2024,(1):1-8.[doi:doi ： 10.3969/j.issn.1001-3849.2024.01.001]
表面活性剂对Ni-W-P化学镀层沉积行为及性能的影响
- Title:
- Effect of surfactant on deposition behavior and properties of electroless Ni-W-P coatings
- Keywords:
- Ni-W-P electroless coating ; surfactant ; porosity ; corrosion resistance ; contact angle ; deposition potential
- 分类号:
- 174.441
- 文献标志码:
- A
- 摘要:
- Ni-W-P 化学镀层因具有良好的耐蚀、耐磨性能而成为重要的“代铬”镀层。表面活性剂可以增强镀液对基体润湿能力，加快界面处 H 2 逸出速率，减少镀层针孔数量或氢缺陷，从而提高镀层质量。本论文探究了十二烷基磺酸钠（ SDS ）、十六烷基三甲基溴化铵（ CTAB ）以及聚乙二醇 -200 （ PEG-200 ）三种典型表面活性剂对 Ni-W-P 镀层沉积行为及性能的影响。借助扫描电子显微镜、 X 射线衍射以及电化学方法对 Ni-W-P 镀层的表面微观形貌、物相、气孔率和耐蚀性能进行了表征，并通过接触角、沉积电位阐述了表面活性剂在化学镀 Ni-W-P 过程中的作用机理。研究结果表明，表面活性剂可改善镀层表面质量以及颗粒尺寸均匀性，并显著降低镀层内部针孔数量，优先顺序为 PEG-200 > SDS > CTAB 。 XRD 衍射结果显示，表面活性剂可提高镀层内合金元素 W 和 P 含量，有利于形成耐蚀性能良好的 Ni-W-P 非晶镀层。此外，三种表面活性剂均能改善镀液对基体的润湿能力，其中 PEG-200 对基体的润湿角最小（ 65 ° ），说明 PEG-200 对于提高界面处 H 2 逸出速度，降低化学镀过程中电位波动效果更为明显。论文研究结果可以为制备内部缺陷较少、耐蚀性能优良的 Ni-W-P 化学镀层提供一定的理论基础。
- Abstract:
- ： Electroless Ni-W-P coating has been deemed as an important chromium substitute because of its good corrosion resistance and wear resistance. Surfactants can enhance the wettability of plating solution on the substrate ， accelerate the H 2 escaping from the interface ， and reduce the pinholes or hydrogen defects inside the coating ， so as to improve the coating quality. The effects of three surfactants ， such as sodium dodecyl sulfonate （ SDS ）， cetyltrimethyl ammonium bromide （ CTAB ） and polyethylene glycol -200 （ PEG-200 ）， on the deposition behaviors and properties of Ni-W-P coatings were investigated. The surface morphology ， component ， porosity and corrosion resistance of Ni-W-P coatings were characterized by scanning electron microscope ， X-ray diffraction and electrochemical methods. The roles of surfactants on the electroless Ni-W-P coating were explored by measuring the contact angles between plating/substrate and deposition potential during Ni-W-P electroless process. The results show that surfactants can improve the surface quality and particle uniformity of coatings ， and the action order of surfactants is PEG-200> SDS> CTAB. XRD results show that surfactants can increase the content of W and P ， leading to the formation of Ni-W-P amorphous coating with good corrosion resistance. In addition ， all the three surfactants can improve the wetting ability of plating solution on the substrate ， especially for PEG-200 with a smallest wetting angle of 65° ， indicating that PEG-200 is more effective for improving the H 2 escape rate from the interface and reducing the potential fluctuation during electroless plating. The results obtained here provide a theoretical basis for the preparation of electroless Ni-W-P coatings with fewer internal defects and good corrosion resistance.
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备注/Memo
收稿日期： 2023-05-21 修回日期： 2023-07-04 作者简介： 李文畅（ 1998 ―），男，硕士研究生， email ： 631457340@qq.com * 通信作者： 王慧华， email ： hhwang@suda.edu.cn 基金项目： 国家自然科学基金资助项目（ U1908224 ）