Wu Minghui,Wang Zhenwen,Shi Yunguang,et al.Study on influencing factors of blackening resistance of tinplate[J].Plating & Finishing,2023,(5):80-84.[doi:10.3969/j.issn.1001-3849.2023.05.011]
镀锡板耐黑变性能影响因素研究
- Title:
- Study on influencing factors of blackening resistance of tinplate
- Keywords:
- tinplate ; blackening resistance ; alloy layer
- 分类号:
- TG174
- 文献标志码:
- A
- 摘要:
- 利用扫描电镜、光学轮廓仪等设备研究了基板形貌、锡层厚度、合金层厚度对镀锡板耐黑变性能的影响。结果表明，基板形貌对镀锡板耐黑变性能影响最大，而基板形貌主要受钢板的轧制工艺影响，当平整机采用 3.5+3.5 μ m 配辊， 1.1% 延伸率轧制后所制得的镀锡板，拥有较好的耐黑变性能，黑变发生率由常规配辊的 45% 降低到 6% ；当镀锡量由 5.0 g·m -2 提升至 6.1 g·m -2 时， 耐黑变性能没有明显变化；合金层厚度对于镀锡板耐黑变性能有一定影响，其由 0.41 g·m -2 提升至 1.23 g·m -2 时，黑变发生率由 6.7% 降低至 1.2% 。
- Abstract:
- ： The effects of substrate morphology ， tin layer thickness and alloy layer thickness on the blackening resistance of tinplate were studied by scanning electron microscope ， optical profiler and other equipment. The results show that the substrate morphology of tinplate has the greatest influence on the black stain resistance of tinplate ， while morphology of tinplate is mainly affected by the rolling process of steel plat. When the tinplate is made of 3.5+3.5 μ m roll matching and 1.1% elongation ， the tinplate has good blackeninng resistance ， the occurrence rate of black stain resistance of tinplate is reduced from 45% of conventional roll matching to 6%.When the tin plating amount increased from 5.0 g·m -2 to 6.1 g·m -2 ， the black stain resistance has no obvious change. The thickness of alloy layer has certain influence on the blackening resistance of tinplate ， when it increased from 0.41 g·m -2 to 1.23 g·m -2 ， the occurrence rate of black stain resistance of tinplate decreased from 6.7% to 1.2%.
参考文献/References:
[1] 沈鹏杰 , 万一群 , 齐韦 , 等 . 基板表面形貌对镀锡板点锈的影响 [J]. 电镀与涂饰 , 2021, 40(23): 1793-1797.
[2] 李宁 , 黎德育 . 罐用镀锡板的发展 [J]. 材料保护 , 2000, 33(5): 16-18.
[3] 柳长福 . 镀锡板在食品饮料包装中的竞争优势 [J]. 钢铁研究 , 2007, 5(4): 48-50.
[4] 彭俊 , 李兵虎 . 奶粉罐用镀锡板花架烫伤缺陷研究 [J]. 宝钢技术 , 2016(2): 43-47.
[5] 兰剑 , 唐超 , 陈成增 . 基板粗糙度对镀锡产品性能的影响研究 [J]. 有色矿冶 , 2014, 30(4): 48-50.
[6] 阳燕林 . 镀锡基板表面形貌控制技术及对镀层孔隙率影响的研究 [D]. 上海 : 华东理工大学机械与动力工程学院 , 2016.
[7] 包信方 . 原板粗糙度对镀锡板耐蚀性的影响 [J]. 材料保护 , 2014, 47(2): 5-7..
[8] 刘伟 , 万一群 , 齐韦 , 等 . 软熔工艺对低锡量镀锡板耐蚀性的影响 [J]. 电镀与涂饰 , 2021, 40(21): 1622-1626.
[9] 宋浩 , 方圆 , 吴志国 , 等 . 感应软熔工艺参数对 K 板 ATC 的影响研究 [J]. 电镀与精饰 , 2020, 42(6): 34-37.
[10] 齐国超 , 于晓中 , 安成强 , 等 . 感应软熔工艺参数对镀锡板耐蚀性的影响 [J]. 材料与冶金学报 , 2005, 4(3): 233-236.
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备注/Memo
收稿日期： 2022-08-23 修回日期： 2023-02-15 作者简介： 吴明辉（ 1989 —），男，硕士研究生，工程师， email ： wuminghui0429@163.com 镀锡板耐黑变性能影响因素研究?/html>