Qi Guodong,Song Jin,Xiang Junlun,et al.Study on the effect of surface modification of printed circuit pad on the growth state of soldering IMC[J].Plating & Finishing,2023,(10):1-10.[doi:10.3969/j.issn.1001-3849.2023.10.001]
印制电路焊盘表面修饰对焊点IMC生长状态影响的研究
- Title:
- Study on the effect of surface modification of printed circuit pad on the growth state of soldering IMC
- Keywords:
- component soldering ; surface modification ; intermetallic compounds ; reliability ; thrust testing
- 分类号:
- TG406
- 文献标志码:
- A
- 摘要:
- 在印制电路板（ Printed Circuit Board ， PCB ）产品的二级封装环节，使用焊料将元件焊接到焊盘过程中形成的焊点互连结构成为实现产品完整机械连接及电气、热通道的重要载体。其中焊料和焊盘间的界面反应影响着焊点内部金属间化合物（ Intermetallic Compounds ， IMC ）的形成与生长，直接关系到电子元件的焊接质量与服役寿命。为此重点探究了 IMC 层经过三种焊盘金属表面修饰形成的形貌结构及热力学条件下的微观组织生长行为。通过恒温热处理分析服役过程中的 IMC 层演变规律，推力测试对比出不同焊盘基底的焊点结合强度，并确定 IMC 缺陷结构的失效源。对分析服役状态下焊点互连结构的失效机制，优化焊接工艺和提升产品质量有着重要的指导意义。
- Abstract:
- ： In the secondary packaging process of printed circuit board products ， the solder joint interconnection structure formed during the process of soldering components to pads with solder becomes an important carrier to realize complete mechanical connections ， as well as electrical and thermal channels of products. Among them ， the interface reaction between solder and pad affects the formation and growth of intermetallic compounds （ IMC ） inside the solder joint ， which is directly related to the soldering quality and service life of electronic component products. To this end ， the morphological characteristics of the IMC layer formed under the modification of three pad metals ， as well as the microstructure growth behavior under thermodynamic conditions were investigated. The evolution law of the IMC layer during the service process was analyzed through constant temperature heat treatment ， and the joint strength of the solder joints of different pad substrates was compared by thrust test ， and the failure source of the IMC defect structure was determined. It has important guiding significance for analyzing the failure mechanism of solder joint interconnection structure in service state ， optimizing welding process and improving product quality.
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备注/Memo
收稿日期： 2023-03-08 修回日期： 2023-04-24 作者简介： 齐国栋（ 1980 ―），男，本科，工程师， email ： mykbc@vip.sina.com * 通信作者： 陈苑明， email ： ymchen@uestc.edu.cn 基金项目： 珠海市科技项目（ No. ZH22017001200002PWC ）