[1]敖天近,曹俊斌,赵健伟.doi: 10.3969/j.issn.1001-3849.2026.01.002无氰预镀银工艺研究[J].电镀与精饰,2026,(01):8-17.
　AO Tianjin,CAO Junbin,ZHAO Jianwei.Study on cyanide-free pre-plating silver process[J].Plating & Finishing,2026,(01):8-17.
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doi: 10.3969/j.issn.1001-3849.2026.01.002无氰预镀银工艺研究()

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2026年01
页码:
8-17
栏目:
出版日期:
2026-01-31

文章信息/Info

Title:
Study on cyanide-free pre-plating silver process
作者:
敖天近; 曹俊斌; 赵健伟
(嘉兴大学 材料与纺织工程学院,浙江 嘉兴 314001)
Author(s):
AO Tianjin;  CAO Junbin;  ZHAO Jianwei
(College of Materials and Textile Engineering, Jiaxing University, Jiaxing 314001, China)
关键词:
无氰镀银; 预镀工艺; 工艺参数; 微观结构
Keywords:
cyanide-free silver plating;  pre-plating process;  process parameters;  microstructure
分类号:
TQ153.2
文献标志码:
A
摘要:
预镀银工艺作为镀银工艺中的关键前处理步骤，对保证镀银层的稳定性和可靠性至关重要，这在无氰镀银工艺中更为凸显。基于预镀银工艺在实际应用中的重要作用，本研究提供了一种低银含量的预镀工艺，针对含银量低至1.0?g/L的无氰预镀银工艺进行了系统研究。通过电化学方法系统分析了低浓度条件下银离子的电沉积行为，发现其沉积过程呈电化学不可逆性，以瞬时成核机制为主。通过优化实验，确定了可获得优异电镀效果的工艺条件范围：镀液温度介于23～38 ℃，电流密度在0.5～1.0?A/dm2范围内。在推荐的预镀银工艺参数范围内，选取了若干具有代表性的条件，制备了一系列镀层样品，并对镀层性能进行了表征。结果表明，在此条件范围内镀液电流效率普遍在30%～50%，最高可达83%，分散能力为37%～80%。所得镀层硬度为80～100 HV，光泽度194～430 GU，紫外反射率60%～80%，镀层结合力能够满足工业生产需求。X射线衍射结果显示(111)晶面为择优取向，扫描电子显微镜测试观察到14.0～20.0?nm的致密颗粒结构。推荐的最佳工作范围为：镀液温度30～35 ℃，电流密度0.5～1.0?A/dm2。该研究不仅为低银含量无氰预镀银工艺提供了可靠的理论依据和工艺窗口，也为低银无氰镀银工艺提供了重要参考价值。
Abstract:
Pre-silver plating, as a critical pre‐treatment step in silver plating processes, is essential for ensuring the stability and reliability of the silver coating, particularly in cyanide‐free silver plating where its importance is even more pronounced. Based on the important role of the preliminary silver plating process in practical applications, this study provides a preliminary plating process with low silver content. An in-depth study was conducted on the cyanide-free pre‐silver plating process with an ultra‐low silver content of only 1.0?g/L. Through electrochemical methods, the electrodeposition behavior of low‐concentration silver ions was systematically analyzed, revealing an electrochemically irreversible process dominated by instantaneous nucleation. Optimization experiments identified the optimal process parameter range for excellent plating performance: bath temperature between 23 and 38 ℃, with current density maintained at 0.5～1.0?A/dm2. Within this recommended pre-plating silver parameter range, a series of coating samples were prepared under representative conditions, and their properties were characterized. The results indicate that, under these conditions, the current efficiency of the plating solution typically ranges from 30% to 50%, with a maximum achievable value of up to 83%, and a throwing power of 37%～80%. The obtained coatings demonstrated a hardness of 80～100 HV, glossiness of 194～430 GU, and UV reflectivity of 60%～80%. The adhesion of the coating can meet the industrial production requirements. XRD analysis revealed a preferential (111) crystal orientation, while SEM observations confirmed a dense granular structure with particle sizes ranging from 14.0?to 20.0?nm. The recommended optimal operating range is as follows: plating solution temperature 30～35 ℃, current density 0.5～1.0?A/dm2. This study not only provides a reliable theoretical basis and process window for low-silver cyanide‐free pre‐plating silver technology but also offers significant reference value for the development of low-silver cyanide-free silver plating processes

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更新日期/Last Update: 2026-01-16