ZHAO Jianwei*,YU Xiaohui,YUAN Guiyun,et al.Effect of the Concentration of Non-Cyanide Silver Plating Solution on the Electroplating Mechanism Bath and Coating Performance[J].Plating & Finishing,2022,(12):1-10.[doi:10.3969/j.issn.1001-3849.2022.12.001]
无氰镀银液的浓度对成核机理、镀液和镀层性能的影响
- Title:
- Effect of the Concentration of Non-Cyanide Silver Plating Solution on the Electroplating Mechanism Bath and Coating Performance
- Keywords:
- cyanide-free silver plating ; bath concentration ; bath performance ; coating properties ; nucleation mechanism
- 分类号:
- TQ153.1
- 文献标志码:
- A
- 摘要:
- 电镀过程中会因水分蒸发或母液补加使镀液浓度发生变化，因此系统研究镀液浓度变化对电镀工艺的影响具有重要的指导意义。本文采用循环伏安法（ CV ）和计时电流法（ CA ）考察了在不同浓度的无氰镀银液（含银量为 7.1~19.1 g·L - 1 ）下银的结晶成核机理；利用景深扩展体视显微镜和原子力显微镜（ AFM ）观察镀液浓度变化对镀层微观形貌的影响。镀液性能测试表明，镀液电流效率接近于 100% ，分散能力在 80% 左右，置换反应发生时间则随着浓度的降低而延长。镀层性能测试包括白度、硬度和光泽度，其中硬度随着浓度变化差别不明显，白度和光泽度随着浓度的降低总体呈下降趋势。通过对不同镀液浓度下的温度窗口和电流密度窗口的研究，确定了该工艺的理想工作范围。
- Abstract:
- ： During the electroplating process ， the concentration of the plating solution may change due to the water evaporation or the replenishment of the mother liquor. Therefore ， the study of the concentration effect on the electroplating process is of great guiding significance. In this paper ， cyclic voltammetry （ CV ） and chronoamperometry （ CA ） were used to investigate the nucleation mechanism of silver deposition at different concentrations of the cyanide-free silver plating solutions （ The Ag content ranges from 7.1 to 19.1 g·L - 1 ） . The microstructure of the coating was characterized by a stereomicroscope with extended depth of focus and an atomic force microscope （ AFM ） as well. The performance test of the bath showed that the current efficiency was close to 100% ， the dispersing power was about 80% ， and the time of replacement reaction was prolonged with the decrease of the concentration. The comparison of the coating properties at different concentrations includes whiteness ， hardness and glossiness. It showed that hardness varied little with the solution concentration ， whereas whiteness and glossiness decrease with decreasing the concentration. With systematical study of the bath solution at different temperature and current density ， an ideal working condition of the process was determined.
参考文献/References:
[1] Bomparola R, Caporali S, Lavacchi A, et al. Silver electrodeposition from air and water-stable ionic liquid: An environmentally friendly alternative to cyanide baths[J]. Surface and Coatings Technology, 2007, 201(24): 9485-90.
[2] Su Y T, Cheng D H, Li K J, et al. Study on the thiosulfate cyanide-free silver pulse plating process[J]. Plat Finish, 2005, 27(2): 14-8.
[3] Masaki S, Inoue H, Honma, H J M F. Mirror-bright silver plating from a cyanide-free bath[J]. Metal Finishing, 1998, 96(1): 16-22.
[4] Ren F Z, Yin L T, Wang S S, et al. Cyanide-free silver electroplating process in thiosulfate bath and microstructure analysis of Ag coatings [J]. Transactions of Nonferrous Metals Society of China, 2013, 23(12): 3822-3828.
[5] 卢俊峰 , 安茂忠 , 郑环宇 , 等 . 5,5- 二甲基乙内酰脲无氰镀银工艺的研究 [J]. 电镀与环保 , 2007, 27(1): 9-11.
[6] Gonnissen D, Simons W, Hubin A. Study of the initial stages of silver electrocrystallisation from silver thiosulphate complexes Part II. Analysis of current transients[J]. Journal of Electroanalytical Chemistry, 1997, 435(1): 149-155.
[7] Liu A, Ren X, Zhang J, et al. A composite additive used for an excellent new cyanide-free silver plating bath[J]. New Journal of Chemistry, 2015, 39(4): 2409-2412.
[8] Jayakrishnan S, Natarajan S R, Vasu K I. Alkaline noncyanide bath for electrodeposition of silver[J]. Metal Finishing, 1996, 94(5): 12-15.
[9] 高昀荞 , 赵健伟 . 部分有机物对 ZHL-02 碱性无氰镀银工艺的影响 [J]. 电镀与涂饰 , 2015, 34(7): 359-364.
[10] 杨培霞 , 赵彦彪 , 杨潇薇 , 等 . 无氰镀银溶液组成对镀层外观影响的研究 [J]. 电镀与精饰 , 2011, 33(11): 33-35.
[11] 肖文涛 , 王为 . 2,2- 联吡啶光亮剂对 5,5- 二甲基乙内酰脲无氰镀银性能的影响 [J]. 材料保护 , 2010, 43(4): 98-100.
[12] 杨晨 , 刘定富 . DMH 对丁二酰亚胺无氰镀银的影响 [J]. 电镀与精饰 , 2015, 3: 28-31.
[13] Rudoy V M, Ostanin N I, Ostanina T N, et al. Application of polarization measurements for the calculation of the current efficiency[J]. Russian Journal of Non-Ferrous Metals, 2019, 60(6): 632-638.
[14] Lai Z, Wang C, Chen Q, et al. Cyanide-free silver immersion deposition involving 3-mercapto-1-propanesulfonic acid for copper finishing[J]. Materials Chemistry and Physics, 2020, 244: 122671.
[15] Liu A, Ren X, An M. A composite additive used for a new cyanide-free silver plating bath (II): An insight by electrochemical measurements and quantum chemical calculation[J]. New Journal of Chemistry, 2017, 41(19): 11104-11112.
[16] Márquez K, Staikov G, Schultze J W. Silver deposition on silicon and glassy carbon. A comparative study in cyanide medium[J]. Electrochimica Acta, 2003, 48(7): 875-882.
[17] 胡进 , 吴慧敏 , 冯祥明 , 等 . 光亮剂对银电沉积行为的影响 [J]. 电化学 , 2002, 1: 78-85.
[18] 张庆 , 成旦红 , 郭国才 , 等 . 无氰镀银技术发展及研究现状 [J]. 电镀与精饰 , 2007, 29(5): 12-16.
[19] 刘安敏 , 安茂忠 , 任雪峰 , 等 . 无氰光亮电镀银工艺的研究 [C]. //2014( 重庆 ) 国际表面工程论坛暨第十二届全国表面工程·电镀与精饰年会论文集 . 2014: 234-243.
[20] Jia X F, Du C J. Study on cyanide-free silver electroplating process with DMDMH and MET as coordination agents[J]. Surface Technology, 2010, 39(4): 59-61+72.
[21] Leisner P, Zanella C, Belov I, et al. Control of silver throwing power by pulse reverse electroplating[J]. Transactions of the IMF, 2017, 95(1): 25-30.
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备注/Memo
收稿日期： 2021-09-22 修回日期： 2021-11-02 作者简介： 赵健伟（ 1972 —），男，教授，博士生导师。研究方向：电化学与电化学工程， email ： jwzhao@zjxu.edu.cn ； * 通信作者： 程娜（ 1987 —），女，博士，讲师。研究方向：物理化学， email ： nacheng@mail.zjxu.edu.cn 基金项目： 嘉兴市科技计划项目（项目号 2020AD10017 、 2020AY10008 ）?/html>