YANG Jiaqiang,JIN Lei,YANG Fangzu*,et al.Overview of Cyanide-free Gold Plating Progresses[J].Plating & Finishing,2019,(12):35-43.[doi:10.3969/j.issn.1001-3849.2019.12.008]
无氰镀金进展概述
- Title:
- Overview of Cyanide-free Gold Plating Progresses
- Keywords:
- cyanide-free; gold plating; overview; Au(III) gold plating
- 文献标志码:
- A
- 摘要:
- 氰化物镀金是目前广泛工业应用的工艺。本文介绍了一价金和三价金无氰镀金工艺研究进展，综述了无氰镀金体系的组成、操作条件、金沉积机制及优缺点，展望了无氰镀金工艺的发展方向。
- Abstract:
- Cyanide gold plating process is widely used in industrial applications at present. In this paper, research progresses of cyanide-free monovalent and trivalent gold plating are introduced. Composition, operating condition, gold deposition mechanism, advantage and disadvantage of cyanide-free gold plating system are summarized. The development of cyanide-free gold plating is discussed.
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备注/Memo
收稿日期： 2019-05-21；修回日期： 2019-07-09
通信作者： 杨防祖，email：fzyang@xmu.edu.cn
基金项目： 国家自然科学基金（21972118）、创新群体项目（21621091）