ZHAO Boru,SUN Zhi,ZHAO Jianwei*,et al.Study on Chemical Blackening Post-Treatment for Electroplated Silver Layer[J].Plating & Finishing,2019,(6):23-28.[doi:10.3969/j.issn.1001-3849.2019.06.005]
电镀银化学黑化后处理工艺研究
- Title:
- Study on Chemical Blackening Post-Treatment for Electroplated Silver Layer
- 文献标志码:
- A
- 摘要:
- 本文研究了黑化时间、黑化温度和黑化剂浓度对银镀层黑化性能的影响，确定了一种电镀银化学黑化工艺。该工艺包括以下两步：第一步将银镀件于室温下在0.2 mmol/L的Na2S醇溶液中预黑化15 min，第二步在0.2 mol/L的C12H25SH溶液中黑化15 min。进一步利用扫描电子显微镜、X射线衍射仪、交流阻抗等方法对镀银黑化层进行了表征。结果表明，经黑化后银镀层表面形成一层均匀的、薄的钝化膜；硫化银粒子分布均匀，平均粒径约为65.9 nm，其自腐蚀电位为-130 mV，且黑化后仍保持一定的导电性。
- Abstract:
- The influence of soaking time, temperature and concentration of blackening agent on the property of the passivated silver coating layer was studied in this paper. The rationalized process and optimized working conditions were determined. The blacking treatment includes two sequential steps. Firstly, the silver plating layer is soaked in 0.2 mmol/L Na2S alcohol solution for 15 min at a room temperature. Then, the sample is transferred into 0.2 mol/L C12H25SH alcohol solution for another 15 min. The passivated silver-layer with uniform black color was studied intensively by using scanning electron microscopy (SEM), X-ray diffraction (XRD) and AC impedance (AC). The results showed that the thin passivated layer was homogeneous in the microscopic scale, composed of uniform silver sulfide particles with about 65.9 nm diameter. The self-corrosion potential of the sample was －130 mV and the sample still remained in good conductivity.
参考文献/References:
[1] 刘仁志. 电子电镀技术[M]. 北京:化学工业出版社, 2008.
[2] 杨长江, 梁成浩, 张旭. 银抗变色工艺研究进展[J]. 电镀与涂饰, 2009, 28(6): 71-75.
[3] 张丽丽, 王振尧, 韩薇. 银在硫化钠溶液中的变色行为[J]. 装备环境工程, 2008, 5(5): 33-37.
[4] 张丽丽, 王振尧, 韩薇. 银的变色及抗变色研究[J]. 装备环境工程, 2007, 4(1): 4-10.
[5] 郭丽娟. 金属的化学黑化[J]. 五金科技, 1997, 3: 22-23.
[6] 朱海刚, 朱建林. 电镀银黑化工艺研究[J]. 电镀与涂饰, 2010, 29(7): 12-13.
[7] 周霞. 镀银层黑化工艺研究[C]// 中国四川, 电镀、涂料涂装学术年会. 2007.
[8] 赵健伟, 于化忠, 王永强, 等. 巯基乙胺自组装膜表面润湿性的变化[J]. 高等学校化学学报, 1998, 19(3): 464-468.
[9] 赵健伟. 温度和电流密度对无氰镀银层微观形貌的影响[J]. 电镀与精饰, 2014, 36(7): 12-19.
[10] 高昀荞, 赵健伟. 部分有机物对ZHL-02碱性无氰镀银工艺的影响[J]. 电镀与涂饰, 2015, 34(7): 359-364.
[11] 渡辺辙, 陈祝平, 杨光. 纳米电镀[M]. 北京:化学工业出版社, 2007.
[12] Mccafferty E. Validation of corrosion rates measured by the Tafel extrapolation method[J]. Corrosion Science, 2005, 47(12): 3202-3215.
[13] 王凤平, 康万利. 腐蚀电化学原理、方法及应用[M]. 北京:化学工业出版社, 2008.
[14] 曹辉, 巩位, 王晋伟, 等. 格尔木地区达克罗涂层钢筋的电化学腐蚀研究[J]. 混凝土, 2018, 4: 57-61.
[15] 崔晓莉, 江志裕. 交流阻抗谱的表示及应用[J]. 上海师范大学学报(自然科学版), 2001, 30(4): 53-61.
[16] 欧阳维真, 王蕾, 许淳淳. 带锈铁器在海水介质中腐蚀行为的电化学阻抗研究[J]. 桂林理工大学学报, 2008, 28(3): 389-392.
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备注/Memo
收稿日期： 2019-04-16；修回日期： 2019-05-16
通讯作者： 赵健伟，男，汉族，教授，博士生导师，研究方向：电化学，Email：jwzhao@mail.zjxu.edu.cn； 陈智栋：男，汉族，教授，博士生导师；研究方向：应用电化学,Email:zdchen@cczu.edu.cn