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[1]陈婧*.厚度与粗糙度对紫铜镀银层温升的影响[J].电镀与精饰,2022,(8):19-22.[doi:10.3969/j.issn.1001-3849.2022.08.004]
　CHEN Jing *.Influence of Thickness and Roughness on Temperature Rise of Silver Plated Pure Copper Materials[J].Plating & Finishing,2022,(8):19-22.[doi:10.3969/j.issn.1001-3849.2022.08.004]
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厚度与粗糙度对紫铜镀银层温升的影响

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG] 卷: 期数: 2022年8 页码: 19-22 栏目: 出版日期: 2022-08-15
Title:
Influence of Thickness and Roughness on Temperature Rise of Silver Plated Pure Copper Materials
作者:
陈婧*
（贵州交通职业技术学院汽车工程系，贵州 贵阳 550008）
Author(s):
CHEN Jing *
（Department of Automotive Engineering， Guizhou Jiaotong College， Guiyang 550008， China）
关键词:
镀银; 粗糙度; 导电率; 温升
Keywords:
silver plating ;  roughness ;  conductivity ;  temperature rise
分类号:
TQ638
DOI:
10.3969/j.issn.1001-3849.2022.08.004
文献标志码:
A
摘要:
本文对粗糙度为 1.6 μ m 紫铜材质试样进行不同厚度的镀银处理，并详细测试其银层粗糙度、厚度、结合力与导电性能。结果表明：镀银厚度越小，银层性能越优。设计银层厚度为 12 ～ 18 μ m 之间，电导率 为 93.8 ～ 94.7 IACS ，温升 65 K±0.21 K ～ 65 K±0.41 K ，满足设计要求；设计银层厚度为 30 ～ 50 μ m 之 间，电导率为 89.3 ～ 91.7 IACS ，温升 66 K±0.40 K ～ 67 K±0.47 K ，超过设计要求。
Abstract:
： The pure copper parts with 1.6 μ m roughness were treated with different silver thickness ， and the roughness ， thickness ， and adhesion of the silver layer were tested. The results showed that the smaller the thickness of silver plating was ， the better the performance of silver coating would be. When the designed thickness of silver layer ranges from 12 to 18 μ m ， the average conductivity of silver layer is 93.8 IACS to 94.7 IACS ， and the temperature rise is 65 K±0.21 K to 65 K±0.41 K ， meeting design requirement. When the designed thickness of silver layer ranges from 30 to 50 μ m ， the average conductivity of silver layer reaches 89.3 IACS to 91.7 IACS ， and the temperature rise is 66 K±0.40 K to 67 K±0.47 K ， exceeding design requirements.

参考文献/References:



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备注/Memo

收稿日期： 2020-05-13 修回日期： 2020-05-14 作者简介： 陈婧（ 1967 —），女，大学，副教授， email ： chenjingxls@163.com 厚度与粗糙度对紫铜镀银层温升的影响 陈婧 * （贵州交通职业技术学院汽车工程系，贵州 贵阳 550008 ）

更新日期/Last Update: 2022-08-14