XIANG Jing,RUAN Haibo*,WANG Chong,et al.Study on Competitive Adsorption Mechanism of Additives and Its Application of Though Holes Plating[J].Plating & Finishing,2022,(11):85-90.[doi:10.3969/j.issn.1001-3849.2022.11.015]
添加剂竞争吸附机理研究及通孔电镀应用
- Title:
- Study on Competitive Adsorption Mechanism of Additives and Its Application of Though Holes Plating
- Keywords:
- electroplated copper ; aspect ratio of through-hole ; throwing power ; additive ; multi-physics coupling technology
- 分类号:
- TQ153.14
- 文献标志码:
- A
- 摘要:
- 本文研究了电镀添加剂聚二硫二丙烷磺酸钠（ SPS ）、 3- 巯基 -1- 丙烷磺酸钠（ MPS ）和整平剂（ L ）对通孔电镀的均镀能力（ TP ）影响。借助多物理场耦合方法，计算出不同厚径比通孔内外的流场和电场分布，结合电化学测试手段和通孔电镀实验，研究不同厚径比通孔电镀 TP 与电镀添加剂体系的相对关系。结果表明， 厚径比越大，孔内外的对流差距越大；对于低厚径比（ 1 ∶ 5 ）通孔， MPS 得到的 TP 最大（ 2.85 ）；对于高厚径比（ 6 ∶ 1 ）通孔，整平剂得到的 TP 最大（ 0.9 ）。
- Abstract:
- ： The purpose of this article is to study the effects of sodium polydithiodipropane sulfonate （ SPS ）， sodium 3-mercapto-1-propane sulfonate （ MPS ） and leveling agent （ L ） on the throwing power （ TP ） of through-hole （ TH ） plating. The flow field and electric field distribution of the through-hole are calculated by multi-physics coupling technology. The relative relationship between TP of TH plating and plating additive system with different aspect ratios （ ARs ） was explored by electrochemical analysis technology and TH plating test. The results showed that the larger AR causes the larger convection difference between the inside and outside of the TH. For the low ARs （ 1 ∶ 5 ）， MPS caused the largest TP （ 2.85 ） . For the high ARs （ 6 ∶ 1 ）， L brought the largest TP （ 0.9 ） .
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备注/Memo
收稿日期： 2020-03-03 修回日期： 2022-07-08 作者简介： 向静（ 1990 —），女，讲师，博士， email ： 20190017@cqwu.edu.cn * 通信作者： 阮海波 email ： rhbcqu@aliyun.com 基金项目： 重庆市教育委员会科学技术研究项目（ KJQN202101321 和 JQN202101306 ）；重庆市自然科学基金（ 2022NSCQ-MSX2217 ）；中国电子科技集团公司第九研究所揭榜挂帅项目（编号： 2022SK-014 ）；重庆文理学院人才引进项目（ R2019FDQ12 和 R2016DQ11 ）?/html>