Fan Binfeng,Cheng Runrun*,Wang Qingfu,et al.Effect of additive HP in combination additives on the organizational properties of electrolytic copper foils[J].Plating & Finishing,2024,(10):28-33.
添加剂HP在复合添加剂中对电解铜箔组织性能的影响
- Title:
- Effect of additive HP in combination additives on the organizational properties of electrolytic copper foils
- Keywords:
- electrolytic copper foil; sodium alcohol sulfopropane sulfonate; sodium polydithiodipropane sulfonate; tensile strength
- 分类号:
- TQ153.1+4
- 文献标志码:
- A
- 摘要:
- 电解铜箔具有工艺简单、导电导热等力学性能较好的特点，目前已经成为了现代电子行业重要的基础原材料。本研究采用直流电沉积法，以一定量的醇硫基丙烷磺酸钠（HP）、聚乙二醇（PEG）、聚二硫二丙烷磺酸钠（SPS）、糖精钠（BSI）和胶原蛋白作为复合添加剂，研究了不同HP浓度对铜箔表面微观形貌、抗拉强度以及其他物理性能的影响。结果表明：HP在合适的浓度范围内，可以在组合添加剂中与其他添加剂发生协同作用提高（200）和（220）晶面的择优取向，从而有效地细化晶粒，降低粗糙度。当HP在组合添加剂中的浓度为6 mg·L?1时，制备的铜箔其抗拉强度和延伸率分别达到了634.1 MPa和4.1%。
- Abstract:
- Electrolytic copper foil has the characteristics of simple process, good mechanical properties such as conductivity and thermal conductivity, which has become an important basic raw material for the modern electronics industry. In this study, the effects of different HP concentrations on the surface micro-morphology, tensile strength and other physical properties of copper foils were investigated using DC electrodeposition with a certain amount of sodium alcohol thiopropane sulfonate (HP), polyethylene glycol (PEG), sodium polydithiodipropane sulfonate (SPS), sodium saccharin (BSI) and collagen as the composite additives. The results showed that HP can synergize with other additives in the combined additives in a suitable concentration range to improve the optimal orientation of the (200) and (220) grain surfaces, thus effectively refining the grains and reducing the roughness. The tensile strength and elongation of the prepared copper foils reached 634.1 MPa and 4.1%, respectively, when the concentration of HP in the combined additives was 6 mg·L ?1
参考文献/References:
[1].Zhang R, Yang S, Qin S P, et al. Effects of DPS on surface roughness and mechanical properties of electrodeposited copper foils[J]. Crystal Research and Technology, 2023, 58(10): 2200260-2200268.
[2].Sun Y, Pan J F, Liu L L, et al. Improvement of performance stability of electrolytic copper foils by bi-component additives[J]. Journal of Applied Electrochemistry, 2022, 52(8): 1219-1230.
[3].朱若林, 代泽宇, 宋言, 等. 胶原蛋白对高抗拉锂电铜箔性能的影响[J]. 电镀与涂饰, 2022, 41(1): 47-50.
[4].Liu L L, Bu Y Q, Sun Y, et al. Trace bis-(3-sulfopropyl)-disulfide enhanced electrodeposited copper foils[J]. Journal of Materials Science & Technology, 2021, 74: 237-245.
[5].张妍嘉, 凌惠琴, 杭弢, 等. 聚二硫二丙烷磺酸钠对电沉积纳米孪晶铜的影响[J]. 电镀与精饰, 2023, 45(8): 1-6.
[6].吴依彩, 毛子杰, 王翀, 等. 高端电子制造中电镀铜添加剂作用机制研究进展[J]. 中国科学: 化学, 2021, 51(11): 474-1488.
[7].Yang S, Wang W C, Zhang R, et al. Effect of sodium alcohol thiyl propane sulfonateon electrolysis of high performance copper foil for lithium ion batteries[J]. Journal of Electrochemistry, 2022, 28(6): 2104501-2104512.
[8].Liao J, Wang L J, Song N, et al. Preparation, micro-structure and characterization of high strength and low profile lithium copper foil with SPS and HP additives[J]. Materials Science and Engineering B, 2024, 299: 116969-116976.
[9].向静, 阮海波, 王翀, 等. 添加剂竞争吸附机理研究及通孔电镀应用[J]. 电镀与精饰, 2022, 44(11): 85-90.
[10].Yu W Y, Lin C Y, Li Q Y, et al. A novel strategy to electrodeposit high quality copper foils using composite additive and pulse superimposed on direct current[J]. Journal of Applied Electrochemistry, 2020, 51(3): 489-501.
[11].张雪薇, 李超, 罗胜年. 晶粒取向和晶界对双晶铜变形的影响[J]. 实验力学, 2019, 34(3): 406-412.
[12].Zhang J L, Chen H B, Fan B F, et al. Study on the relationship between crystal plane orientation and strength of electrolytic copper foil[J]. Journal of Alloys and Compounds, 2021, 884: 161044-161045.
[13].朱若林, 宋言, 代泽宇, 等. 骨胶和聚二硫二丙烷磺酸钠对厚电解铜箔性能的影响[J]. 电镀与涂饰, 2021, 40(13): 1027-1030.
[14].朱若林, 代泽宇, 宋言, 等. 含硫有机添加剂对电解铜箔组织性能的影响[J]. 铜业工程, 2021(5): 1-4.
[15].Xiao Y, Sun W C, Bai Z B, et al. Effect of additives on microstructure and properties of the coarsened layer of very low profile (HVLP) copper foil[J]. Journal of Applied Electrochemistry, 2023, 53: 2331-2346.
[16].Yu W Y, Lin C Y, Li Q Y, et al. A novel strategy to electrodeposit high-quality copper foils using composite additive and pulse superimposed on direct current[J]. Journal of Applied Electrochemistry, 2021, 51(3): 489-501.
[17].杜荣斌, 刘励昀, 吴夏, 等. 添加剂N, N-二乙基硫脲,PEG,Cl-对高抗拉电解铜箔电结晶行为的影响[J]. 材料保护, 2021, 54(4): 7-14.
[18].孙桢, 黄剑, 宋宁, 等. 氯离子与有机添加剂协同作用对铜箔组织性能的影响[J]. 有色金属科学与工程, 2024(2): 220-227.
[19].王海振, 胡旭日. 酸性镀铜添加剂对生产锂离子电池用双面光电解铜箔的影响[J]. 电镀与涂饰, 2019, 38(8): 335-337.
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