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[1]代超熠,唐先忠,何 为,等.电解铜箔添加剂的研究进展[J].电镀与精饰,2024,(2):79-86.[doi:10.3969/j.issn.1001-3849.2024.02.011]
 Tang Yao,hen Yuanming *.Research progress of electrolytic copper foil additives[J].Plating & Finishing,2024,(2):79-86.[doi:10.3969/j.issn.1001-3849.2024.02.011]
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电解铜箔添加剂的研究进展

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备注/Memo

收稿日期: 2023-03-29 修回日期: 2023-04-10 作者简介: 代超熠( 1998 —),男,在读硕士生,研究方向:印制电路电镀铜方向, email : chaoyi_dai@163.com * 通信作者: 陈苑明( 1985 —),男,博士,副教授, email : ymchen@uestc.edu.cn 基金项目: 国家自然科学基金项目( No.61974020 );珠海市创新团队项目( No.ZH0405190005PWC ) ;珠海市产学研合 作项目( No.2220004002990 )

更新日期/Last Update: 2024-02-05