参考文献/References:
[1].李桂华, 丁秀云, 刘雪松, 等. 黄金首饰硬度及其强化机制[J]. 黄金, 2023, 44(11): 100-104.
[2].李桂华, 刘海彬, 孙冰, 等. “5G金”首饰成分、硬度和工艺探析[J]. 黄金, 2023, 44(5): 92-95.
[3].杜中文. 首饰用千足硬金综述[J]. 超硬材料工程, 2010, 22(2): 54-57.
[4].钟祥涛, 王慧. 首饰用千足硬金制造工艺探讨[J]. 超硬材料工程, 2013, 25(2): 53-55.
[5].黄晟, 王俊勃, 雒千, 等. 硬质足金生产工艺概述[J]. 轻工科技, 2021, 37(12): 33-35.
[6].张荣红, 裴景成, 兰艳頔. 千足黄金首饰的硬化工艺探讨[J]. 黄金, 2011, 32(10): 7-9.
[7].吴浩, 甘章华, 劳文杰, 等. 金属退火硬化现象及机理的研究进展[J]. 金属热处理, 2021, 46(9): 1-6.
[8].周新铭, 李曲波. 金的微量元素合金化[J]. 贵金属, 1994(2): 1-9.
[9].高亚伟, 杨佩, 杜媛媛, 等. 足金首饰的硬化机制与维氏硬度试验[J]. 贵金属, 2018, 39(增1): 177-184.
[10].刁习静, 沈美冬, 周军, 等. 黄金电铸饰品技术发展及检测[C]//国土资源部珠宝玉石首饰管理中心(NGTC), 中国珠宝玉石首饰行业协会. 2011中国珠宝首饰学术交流会论文集. 国家珠宝玉石质量监督检验中心: 2011: 335-340.
[11].郑利珊, 姜琴. 添加剂对无氰氯金酸体系电沉积金层性能的影响[J]. 电镀与精饰, 2024, 46(11): 23-29.
[12].郑利珊. 一种环保黄金首饰电铸工艺及电铸层性能的研究[D]. 武汉: 中国地质大学, 2019.
[13].王姗姗, 祝要民, 任凤章, 等. 电流密度对银纳米晶镀层微观结构及显微硬度的影响[J]. 电镀与涂饰, 2011, 30(4): 5-8.
[14].贺颖, 徐子暄, 丁运虎, 等. 合金共沉积多尺度机理与功能镀层调控进展[J/OL]. 表面技术, 1-17[2025-05-23]. http://kns.cnki.net/kcms/detail/50.1083.TG.20250512.1637.006.html.
[15].李荻. 电化学原理(第3版)[M]. 北京: 北京航空航天大学出版社: 2008: 295.
[16].方景礼. 电镀添加剂理论与应用[M]. 北京: 国防工业出版社. 2006: 5-9.
[17].肖文涛, 王为. 2,2-联吡啶光亮剂对5,5-二甲基乙内酰脲无氰镀银性能的影响[J]. 材料保护, 2010, 43(4): 98-100.
[18].Vais R D, Sattarahmady N, Heli H. Green electrodeposition of gold nanostructures by diverse size, shape, and electrochemical activity[J]. Gold Bulletin, 2016, 115: 38-46.
[19].林航. 有机添加剂对铜电沉积机理影响研究[D]. 漳州: 闽南师范大学, 2013.
[20].刘正伟. 硬金镀层的研究进展[J]. 电镀与精饰, 2011, 33(7): 13-17, 46.
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