CHEN Jing *.Influence of Thickness and Roughness on Temperature Rise of Silver Plated Pure Copper Materials[J].Plating & Finishing,2022,(8):19-22.[doi:10.3969/j.issn.1001-3849.2022.08.004]
厚度与粗糙度对紫铜镀银层温升的影响
- Title:
- Influence of Thickness and Roughness on Temperature Rise of Silver Plated Pure Copper Materials
- Keywords:
- silver plating ; roughness ; conductivity ; temperature rise
- 分类号:
- TQ638
- 文献标志码:
- A
- 摘要:
- 本文对粗糙度为 1.6 μ m 紫铜材质试样进行不同厚度的镀银处理，并详细测试其银层粗糙度、厚度、结合力与导电性能。结果表明：镀银厚度越小，银层性能越优。设计银层厚度为 12 ～ 18 μ m 之间，电导率 为 93.8 ～ 94.7 IACS ，温升 65 K±0.21 K ～ 65 K±0.41 K ，满足设计要求；设计银层厚度为 30 ～ 50 μ m 之 间，电导率为 89.3 ～ 91.7 IACS ，温升 66 K±0.40 K ～ 67 K±0.47 K ，超过设计要求。
- Abstract:
- ： The pure copper parts with 1.6 μ m roughness were treated with different silver thickness ， and the roughness ， thickness ， and adhesion of the silver layer were tested. The results showed that the smaller the thickness of silver plating was ， the better the performance of silver coating would be. When the designed thickness of silver layer ranges from 12 to 18 μ m ， the average conductivity of silver layer is 93.8 IACS to 94.7 IACS ， and the temperature rise is 65 K±0.21 K to 65 K±0.41 K ， meeting design requirement. When the designed thickness of silver layer ranges from 30 to 50 μ m ， the average conductivity of silver layer reaches 89.3 IACS to 91.7 IACS ， and the temperature rise is 66 K±0.40 K to 67 K±0.47 K ， exceeding design requirements.
参考文献/References:
[1] 凌颖 , 赵莉华 , 林显 , 等 . 高压隔离开关电触头性能改善探讨 [J]. 高压电器 , 2010, 46(8): 101-105.
[2] 李宝增 , 张柳丽 , 林生军 , 等 . 脉冲电镀银层组织与性能 [J]. 电镀与精饰 , 2014, 36(8): 8-11.
[3] 路亚娟 , 张红军 , 雪金海 , 等 . 铝合金镀银电镀生产线设计的几点建议 [J]. 电镀与涂饰 , 2016 (13): 693-696.
[4] 赵建伟 . 温度和电流密度对无氰镀银层微观形貌的影响 [J]. 电镀与精饰 , 2014 (7): 12-15, 19.
[5] 焦承东 , 李宾 . 粗糙度对镀银层导电性能的影响 [J]. 电镀与精饰 , 2018, 41 (2): 16-18.
[6] 焦承东 , 李宾 , 田兴强 . 铝合金基材表面粗糙度对镀银层导电性的影响 [J]. 电镀与精饰 , 2018, 38 (4): 1090-1093.
[7] 许军 , 李坤 . 电接触的接触电阻研究 [J]. 电工材料 , 2011 (1): 10-12.
[8] 柏小平 , 李国伟 , 翁桅 , 等 . 电触头表面状态对接触电阻的影响和改善方法 [J]. 电工材料 , 2013 (1): 10-15.
[9] 胡星福 , 高华云 , 毛江宏 . 触头表面粗糙度对接触电阻影响的探讨 [J]. 电工材料 , 2004 (1): 14-16.
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备注/Memo
收稿日期： 2020-05-13 修回日期： 2020-05-14 作者简介： 陈婧（ 1967 —），女，大学，副教授， email ： chenjingxls@163.com 厚度与粗糙度对紫铜镀银层温升的影响 陈婧 * （贵州交通职业技术学院汽车工程系，贵州 贵阳 550008 ）