LIANG Yuxuan*,ZHANG Xiaodong,HUANG Linquan,et al.Study on Fine Circuits Etching of Copper-Plated Silver Nanowire Conductive Film[J].Plating & Finishing,2022,(8):61-64.[doi:10.3969/j.issn.1001-3849.2022.08.011]
镀铜银纳米线导电薄膜精细电路蚀刻的研究
- Title:
- Study on Fine Circuits Etching of Copper-Plated Silver Nanowire Conductive Film
- Keywords:
- silver nanowire ; copper plated ; etching ; photoelectric performance ; process control
- 分类号:
- TN873.93
- 文献标志码:
- A
- 摘要:
- 采用黄光湿法蚀刻工艺，调整过氧化氢和乙酸的比例，研究了不同蚀刻液配方对镀铜银纳米线导电薄膜的蚀刻效果及蚀刻时间对图案化镀铜银纳米线导电薄膜沟道的影响。结果表明，最佳蚀刻配方为去离子水 90 g 、过氧化氢 2 g 、乙酸 7 g ，最佳蚀刻时间为 150 s 。采用此蚀刻液配方蚀刻镀铜银纳米线导电薄膜，蚀刻前后光电性能无变化。
- Abstract:
- ： The yellow light wet etching process was used to study the effect of different etching solution formulations on the conductive film of copper-plated silver nanowires and the etching time on the patterned copper-plated silver nanowire conductive film channel by adjusting the ratio of hydrogen peroxide and acetic acid. The results shows that the best etching solution formulation is 90 g deionized water ， 2 g hydrogen peroxide ， 7 g acetic acid ， and the best etching time is 150 s. Using this etching solution to etch the copper-plated silver nanowire conductive film ， there is no change in the photoelectric performance before and after etching.
参考文献/References:
[1] Langley D, Giusti G, Mayousse C, et al. Flexible transparent conductive materials based on silver nanowire networks: a review[J]. Nanotechnology, 2013, 24(45): 452001.
[2] Sun Y, Xia Y. Large-scale synthesis of uniform silver nanowires through a soft, self-seeding, polyol process[J]. Advanced Materials, 2002, 14(11): 833-837.
[3] Mol Menamparambath M, Muhammed Ajmal C, Hee Kim K, et al. Silver nanowires decorated with silver nanoparticles for low-haze flexible transparent conductive films[J]. Scientific Reports, 2015, 5(1): 16371.
[4] 文亚男 , 陈际达 , 鄢婷 , 等 . 改进单纯形优化用于电解蚀刻制备印制电路板精细线路 [J]. 电镀与涂饰 , 2019, 38(15): 787-791.
[5] 张洪文 . 用于精细印制电路的无粗糙化铜箔技术 [J]. 覆铜板资讯 , 2007(02): 39-42.
[6] Mao Y, Zhu M, Wang W, et al. Well-defined silver conductive pattern fabricated on polyester fabric by screen printing a dopamine surface modifier followed by electroless plating[J]. Soft Matter, 2018, 14(7): 1260-1269.
[7] 周群飞 , 饶桥兵 , 曹忠 , 等 . 采用全银浆图案印刷制程实现触控屏功能的制作方法 : 201610443378.8 [P]. 2017-12-29.
[8] 王红松 . 浅谈化学蚀刻技术的发展及意义 [J]. 化工管理 , 2020(4): 8-9.
[9] 杨为正 . 丝网印刷与金属蚀刻技术 [J]. 网印工业 , 2019, 11(4): 15-19.
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备注/Memo
收稿日期： 2020-06-23 修回日期： 2020-07-01 作者简介： 梁雨轩（ 1992 —），女，研究生，工程师，主要研究方向：新能源、新材料， email ： 1258497971@qq.com?/html>