Niu Liu,Dong Yuan *,Chen Yuping,et al.Analysis of bubbling phenomenon after thermal shock of cyanide-free silver plating of aluminum alloy[J].Plating & Finishing,2025,(02):89-93.
doi: 10.3969/j.issn.1001-3849.2025.02.013铝合金无氰镀银热震鼓泡原因分析
- Title:
- Analysis of bubbling phenomenon after thermal shock of cyanide-free silver plating of aluminum alloy
- 分类号:
- TQ153.1
- 文献标志码:
- A
- 摘要:
- 电镀无氰化是电镀行业未来发展的重要目标。目前无氰电镀在镀层结合力、致密度、纯度等方面一般低于氰化物电镀工艺。铝合金无氰镀银试片在热震后经常出现鼓泡现象，许多电镀从业人员分析认为是浸锌工艺造成的。经过多次改进工艺参数的实验并结合鼓泡样品的SEM观察和分析，铝合金无氰镀银鼓泡现象的原因应是热震时水与铝合金基体表面发生反应，生成氢气顶起镀层造成的。
- Abstract:
- Cyanide-free electroplating is an important goal of electroplating industry in the future. At present, cyanide-free electroplating is lower than cyanide electroplating process in terms of coating adhesion, density and purity. Non-cyanide silver plating test sheet of aluminum alloy often appears bubbling after thermal shock. Many electroplating practitioners believe that it is caused by zinc dipping process. In this experiment, after several process improvement methods, SEM observation and analysis were used to speculate that the reason for the bubble phenomenon of cyanide-free silver plating of aluminum alloy was caused by the reaction between water and the surface of aluminum alloy matrix during thermal shock, resulting in hydrogen jacking up the coating
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