ZHANG Yuqing,CHEN Tongcai,WANG Chunxia,et al.Effect of Additives on the Performance of Cyanide-Free Cadmium Plating[J].Plating & Finishing,2021,(8):16-20.[doi:10.3969/j.issn.1001-3849.2021.08.004]
添加剂对无氰镀镉工艺性能的影响
- Title:
- Effect of Additives on the Performance of Cyanide-Free Cadmium Plating
- 文献标志码:
- A
- 摘要:
- 本文采用电沉积方法制备了镉镀层，采用X射线衍射仪（XRD）、扫描电子显微镜（SEM）、盐雾试验箱、接触角测量仪测试了镀液添加剂对镀层结构、耐蚀性及接触角的影响，并利用赫尔槽、库仑计测试了镀液的分散能力、电流效率及沉积速率。结果表明：镀液加入维生素B衍生物后，所得镀层晶粒尺寸为44.8 nm，结晶细致均匀，耐蚀性良好。该镀液的分散能力为84%，电流密度为1 A/dm2时的电流效率为64.7%，沉积速率约为0.425 μm/min。
- Abstract:
- In this paper, the cadmium coating was prepared by electrodeposition method. X-ray diffractometer （XRD）, scanning electron microscope （SEM）, salt spray test chamber, and contact angle measuring instrument were used to test the influence of plating solution additives on the coating structure, corrosion resistance and contact angle. And use Hull cell and coulometer to test the dispersion ability, current efficiency and deposition rate of the plating solution. The results showed that the coating deposited in the plating solution containing vitamin B derivatives had the good corrosion resistance, which had a fine and uniform crystals with the grain size of 44.8 nm. The dispersion capacity of the plating solution was 84%, the current efficiency was 64.7% when the current density was 1 A/dm2, and the deposition rate was about 0.425 μm/min.
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Huang P, Chen R J. Research and application of non-cyanide cadmium plating process [J]. New Technology & New Process, 2008, 11,17-18 (in Chinese).
[3] 万冰华,杨军,王福新,等.无氰镀镉工艺开发研究与应用[J]. 电镀与精饰,2014,36(3):22-25+46.
Wan B H, Yang J, Wang F X, et al. Investigation and application on cyanide-free cadmium electroplating technology [J]. Plating & Finishing, 2014, 36(3): 22-25+46 (in Chinese).
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备注/Memo
收稿日期： 2019-11-14；修回日期： 2020-01-27
作者简介： 张玉清，Email：1303592883@qq.com
*通信作者： 陈同彩（1964—），男，硕士，高级工程师，主要研究方向为为材料科学，Email：71370740@qq.com