HAN Li,LI Mingjian,YANG Xiaodong,et al.Application of New Cyanide-Free Silver Plating Process in Xindongbei Electric Group[J].Plating & Finishing,2021,(8):26-29.[doi:10.3969/j.issn.1001-3849.2021.08.006]
无氰镀银新工艺在新东北电气集团的应用
- Title:
- Application of New Cyanide-Free Silver Plating Process in Xindongbei Electric Group
- 文献标志码:
- A
- 摘要:
- 针对传统电镀银所使用的氰化物工艺，为解决剧毒氰化物对人类健康、环境造成的危害问题，设计开发了一种新型无氰镀银工艺来代替氰化镀银工艺，研究了双配位体系无氰镀银溶液、无氰浸锌溶液性能及所得镀银层性能影响。结果表明：采用双配位体系络合剂可以提高无氰镀银溶液稳定性，使各项性能达到氰化镀银指标；采用新型无氰浸锌溶液可以提高铸铝件镀银结合力；该工艺的实际应用，避免了氰化物的危害、降低了生产成本、有利于操作人员的身体健康和生命安全，属于绿色生产工艺，符合国家产业政策，极具推广价值。
- Abstract:
- Aiming at the cyanide process used in traditional silver electroplating, in order to solve the hazards of highly toxic cyanide to human health and the environment, as well as the problems in the use of cyanide electroplating solution and the recovery and treatment of waste liquid, a new type has been designed and developed. The cyanide-free silver plating process replaces the cyanide silver plating process, and the performance of the cyanide-free silver plating process on the coating has been studied. The results show that the performance of the new cyanide-free silver plating process reaches the cyanide silver plating index and is beneficial to the health and life safety of the operators.
参考文献/References:
[1] 张庆, 成旦红, 郭国才, 等. 无氰镀银技术发展及研究现状[J]. 电镀与精饰, 2007, 29(5):12-16.
Zhang Q, Cheng D H, Guo G C, et al. Development and research status of cyanide-free silver planting technology[J]. Electroplating and Finishing, 2007,29(5):12-16 (in Chinese).
[2] 王春霞, 杜楠, 赵晴. 无氰镀银研究进展[J]. 电镀与精饰,2006, 28(6): 18-21.
Wang C X, Du N, Zhao Q. Research progress of cyanide-free silver plating [J]. Electroplating and Finishing, 2006,28(6):18-21 (in Chinese).
[3] 黄晓梅, 李宁, 蒋丽敏,等. 铝及铝合金电镀的浸锌工艺[J]. 电镀与环保, 2005, 25(2): l-4.
Huang X M, Li N, Jing L M, et al. Aluminum and aluminum alloy by zinc dip process[J]. Electroplating and Environmental, 2005, 25(2): l-4 (in Chinese).
相似文献/References:
[1]程 娜,孙 志,赵健伟.无氰镀银镀层的XRD研究[J].电镀与精饰,2018,(12):41.[doi:10.3969/j.issn.1001?3849.2018.12.010]
CHENG Na,SUN Zhi,ZHAO Jianwei.XRD Study on Cyanide-free Silver Plating Coating[J].Plating & Finishing,2018,(8):41.[doi:10.3969/j.issn.1001?3849.2018.12.010]
[2]赵健伟*,于晓辉,袁桂云,等.无氰镀银液的浓度对成核机理、镀液和镀层性能的影响[J].电镀与精饰,2022,(12):1.[doi:10.3969/j.issn.1001-3849.2022.12.001]
ZHAO Jianwei*,YU Xiaohui,YUAN Guiyun,et al.Effect of the Concentration of Non-Cyanide Silver Plating Solution on the Electroplating Mechanism Bath and Coating Performance[J].Plating & Finishing,2022,(8):1.[doi:10.3969/j.issn.1001-3849.2022.12.001]
[3]史天静,俞巧珍,王成,等.无氰镀银后处理工艺对镀层表面状态的影响[J].电镀与精饰,2023,(4):13.[doi:10.3969/j.issn.1001-3849.2023.04.003]
Shi Tianjing,Yu Qiaozhen,Wang Cheng,et al.Effect of the post-treatment in cyanide-free silver plating on the surface condition of the plated layer[J].Plating & Finishing,2023,(8):13.[doi:10.3969/j.issn.1001-3849.2023.04.003]
[4]房成玲,何 为,齐国栋,等.无氰镀银技术的研究进展[J].电镀与精饰,2023,(8):59.[doi:10.3969/j.issn.1001-3849.2023.08.010]
Fang Chengling,He Wei,Qi Guodong,et al.Research progress of cyanide free silver plating technology[J].Plating & Finishing,2023,(8):59.[doi:10.3969/j.issn.1001-3849.2023.08.010]
[5]刘星岑,李寒松,高维泽*,等.doi: 10.3969/j.issn.1001-3849.2025.02.004电流密度对混合无氰镀银体系镀层性能的影响[J].电镀与精饰,2025,(02):23.
Liu Xingcen,Li Hansong,Gao Weize*,et al.Effect of current density on properties of mixed cyanide-free silver plating system[J].Plating & Finishing,2025,(8):23.
备注/Memo
收稿日期： 2021-04-28；修回日期： 2021-06-10
作者简介： 韩力（1971-），男，大学本科，高级工程师，hanli200907@126.com