Wang Hao,Cao Xiaozhou*,Xue Xiangxin.Research progress on electrodeposition of tin and tin alloys coatings in eutectic solvents[J].Plating & Finishing,2023,(1):56-61.[doi:10.3969/j.issn.1001-3849.2023.01.009]
低共熔溶剂中电沉积锡及锡合金镀层的研究进展
- Title:
- Research progress on electrodeposition of tin and tin alloys coatings in eutectic solvents
- Keywords:
- electrodeposition ; deep eutectic solvent ; choline chloride ; tin ; coating
- 分类号:
- TQ153.11
- 文献标志码:
- A
- 摘要:
- 低共熔溶剂作为一种新型绿色电镀液，有着电化学窗口宽、电导率高等优异的电化学性能。近年来常作为电沉积制备锡及锡合金的备选镀液，在电镀领域有着广泛的应用前景。本文综述了以氯化胆碱基低共熔溶剂为电镀液，采用电沉积法制备金属锡及锡二元、三元合金镀层的最新研究进展，介绍了温度、浓度、添加剂等因素对电沉积制备锡及锡合金镀层的影响，并对现存问题进行了讨论。
- Abstract:
- ： As a new type of green electroplating solution ， eutectic solvent has excellent electrochemical performance such as wide electrochemical window and high conductivity. In recent years ， it is often used as an alternative plating solution for the preparation of tin and tin alloys by electrodeposition ， and has a wide range of application prospects in the field of electroplating. The latest research progress in the preparation of metal tin and tin binary and ternary alloy coatings using the choline chloride-based eutectic solvent as the electroplating solution was reviewed in this article. The effects of temperature ， concentration ， additives and other factors on the preparation of tin and tin alloy coatings by electrodeposition were introduced ， and the existing problems were discussed.
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备注/Memo
收稿日期： 2021-04-09 修回日期： 2021-05-22 作者简介： 王昊（ 1995 ―），男，硕士研究生， email ： wh15940639747@163.com * 通信作者： 曹晓舟， email ； caoxz@smm.neu.edu.cn 基金项目： 国家自然科学基金资助项目（ 51204043 ）