Wang Qingfu,Wang Lina*,Fan Binfeng,et al.Study on the interaction between thiazole and aminourea derivatives and chloride ions in the electrodeposition of copper[J].Plating & Finishing,2025,(01):1-8.
doi: 10.3969/j.issn.1001-3849.2025.01.001噻唑及氨基脲衍生物与氯离子作用于电沉积铜的研究
- Title:
- Study on the interaction between thiazole and aminourea derivatives and chloride ions in the electrodeposition of copper
- Keywords:
- additives; electrolytic copper foil; Cl; combined action; crystal structure
- 分类号:
- TQ153.2
- 文献标志码:
- A
- 摘要:
- 本文利用自制的电镀装置对三种新型未知添加剂（NT、DT和HP-200）在铜电沉积过程中与Cl?的作用及对铜箔性能的影响进行了探究。结果表明，NT和DT与Cl?之间存在着相互作用，而HP-200与Cl?几乎无相互作用。在电沉积过程中促进铜箔表面的平整性方面，DT最佳，HP-200次之，NT最差。DT对铜箔物性指标呈现出低浓度抑制、高浓度促进的影响，整体具有提高铜箔物性指标的效果，可使高温抗拉强度达到456.76 MPa，同时延伸率可达到5.43%。
- Abstract:
- The interaction between three novel unknown additives (NT, DT, and HP-200) and Cl? during copper electrodeposition, as well as their impact on the properties of copper foil were explored using self-made electroplating equipment. The results show that there is an interaction between NT and DT with Cl ?, while HP-200 has almost no interaction with Cl?. In terms of promoting the flatness of the copper foil surface during the electrodeposition process, DT is the best, followed by HP-200, and NT is the worst. DT exhibits a low concentration inhibition and high concentration promotion effect on the physical properties of copper foil, and has an overall effect on improving the physical properties of copper foil. It can achieve a high-temperature tensile strength of 456.76 MPa and a high-temperature elongation of 5.43%
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