Zhang Dongming,He Wei,Chen Yuanming*.Effect of nitrogen-heterocycle organic additiveson microstructure and properties of plating cobalt on surface of coil inductor Song Jin1, Li Chaomou1, Qi Guodong1, Pi Yiming2,3, Wang Cheng4, He Kehan4,[J].Plating & Finishing,2025,(03):34-38.
doi: 10.3969/j.issn.1001-3849.2025.03.005含氮杂环有机添加剂对线圈电感表面沉积钴层
- Title:
- Effect of nitrogen-heterocycle organic additiveson microstructure and properties of plating cobalt on surface of coil inductor Song Jin1, Li Chaomou1, Qi Guodong1, Pi Yiming2,3, Wang Cheng4, He Kehan4,
- Keywords:
- cobalt electrodeposition; micromorphology; nitrogen-heterocycle organic additives; copper coil inductor
- 分类号:
- TQ153.1
- 文献标志码:
- A
- 摘要:
- 钴作为关键导体材料在集成电路中实现电路互连起着重要地位。本文采用量子化学计算、电化学测试和电沉积方法研究了咪唑、吡嗪、水杨醛肟3种含氮杂环的有机添加剂特性及其对电沉积钴的影响,采用扫描电子显微镜和接触角测试仪分析镀层形貌和表面润湿性。结果表明,3种含氮杂环有机添加剂通过在电极表面发生吸附对钴的电沉积起到抑制作用,其中吡嗪的抑制效果最强,单独使用3种含氮杂环有机添加剂的镀液体系下都未能获得致密平整的钴镀层。在铜线圈电感表面电沉积钴,可形成磁芯,有助于提升电感的电感值,在1 MHz时最高达到2.55 μH。
- Abstract:
- Cobalt as conductor material plays a significant role in realizing inter connection of integrated circuits. In this work, quantum chemistry calculation, electrochemical measurement and electrodeposition are employed to investigate the properties of nitrogen-heterocycle organic additives including imidazole, pyrazide and salicylaldoxime and their effects on electrochemical behavior in cobalt deposition. The morphology and surface wettability of deposits were analyzed by scanning electron microscope (SEM) and contact angle tester. The results showed that three kinds of nitrogen-heterocycle organic additives inhibited cobalt deposition via adsorption behavior on the electrode surface and pyrazide exhibited the best performance of inhibition, but dense and smooth deposits could not be obtained in the bath system with three additives alone. The formed magnetic cores of copper coil inductor leaded to remarkable performance improvements in the inductance value and the maximum reached 2.55 μH at 1 MHz
参考文献/References:
[1].Huang S M, Liu C W, Dow W P. Effect of convection-dependentadsorption of additives on microvia filling in an acidic copper plating solution[J]. Journal of The Electrochemical Society, 2012. 159(3): D135-D141.
[2].Huang Q, Lyons T W, Sides W D, Electrodeposition of cobalt for interconnect application: Effect of dimethylglyoxime[J]. Journal of The Electrochemical Society, 2016. 163(13): D715-D721.
[3].倪修任, 陈苑明, 王翀, 等. 表面活性剂对电沉积钴析氢的影响研究. 电镀与精饰, 2019. 41(4): 1-5.
[4].Ibrahim M A M, Al Radadi R M, Noncrystalline cobalt coatings on copper substrates by electrodeposition from complexing acidic glycine baths[J]. Materials Chemistry and Physics, 2015. 151: 222-232.
[5].Lai Z, Wang S, Wang C, et al, Computational analysis and experimental evidence of two typical levelers for acid copper electroplating[J]. Electrochimica Acta, 2018. 273: 318-326.
[6].Wang C, Zhang J, Yang P, et al, Electrochemical behaviors of Janus Green B in through-hole copper electroplating: An insight by experiment and density functional theory calculation using Safranine T as a comparison. Electrochimica Acta, 2013. 92: 356-364.
[7].王志登. 甲磺酸电镀锡添加剂设计优选及作用研究[D]. 哈尔滨: 哈尔滨工业大学, 2016.
[8].Davis J, Vaughan D, Cardosi M F, The preparation of a novel polymer film based on salicylaldoxime and its influence on aqueous copper electrochemistry[J]. Analytical Letters, 1994. 27(10): 1931-1943.
[9].彭佳, 程骄, 王翀, 等. PCB电镀铜添加剂作用机理研究进展. 电镀与精饰, 2016. 38(12): 15-22.
[10].Torkhov N A, Kokolov A A, Babak L I. Influence of the surface morphology of the microwave microstrip line on its transmission performance[J]. Semiconductors, 2020, 54(11): 1472-1477.
[11].赵岩, 仪器结构件用2A12铝合金表面Ni-P化学镀层的形貌与硬度. 电镀与环保, 2018. 38(5): 26-29.
[12].吴勐, 沈喜训, 徐群杰, 等. 超声辅助电沉积制备Ni-SiO2纳米复合镀层及耐蚀性能研究. 电镀与精饰, 2017. 39(1): 11-14,23.
[13].He X, Chen Y, Wang S, et al, Enhancing inductance of spiral copper inductor with BaFe12O19/poly (phenylene oxide) composite as an embedded magnetic core[J]. Composites Part B: Engineering, 2018, 138: 232-242.
相似文献/References:
[1]王槐乾,姜宏伟,王方标,等.工艺参数对磁控溅射TiN膜结构的影响[J].电镀与精饰,2019,(12):20.[doi:10.3969/j.issn.1001-3849.2019.12.005]
WANG Huaiqian,JIANG Hongwei,WANG Fangbiao,et al.The Effect of Process Parameters on the Structure of Magnetron Sputtering TiN Films[J].Plating & Finishing,2019,(03):20.[doi:10.3969/j.issn.1001-3849.2019.12.005]
[2]李 祥*,李培英.铜质电子产品表面化学镀锡研究[J].电镀与精饰,2020,(3):39.[doi:10.3969/j.issn.1001-3849.2020.03.008]
LI Xiang*,LI Peiying.Study on Electroless Tin Plating on Copper Electronic Products[J].Plating & Finishing,2020,(03):39.[doi:10.3969/j.issn.1001-3849.2020.03.008]
[3]王 羽,刘励昀,杜荣斌*,等.添加剂MPS、DDAC、Cl-对铜箔电沉积的影响[J].电镀与精饰,2021,(5):1.[doi:10.3969/j.issn.1001-3849.2021.05.001]
WANG Yu,LIU Liyun,DU Rongbin*,et al.Effects of Additives MPS, DDAC and Cl- on the Copper Foil[J].Plating & Finishing,2021,(03):1.[doi:10.3969/j.issn.1001-3849.2021.05.001]
[4]王朝琳*,宋斌,刘娟,等.直升机桨叶包片胶接前激光毛化处理的有效性研究[J].电镀与精饰,2021,(12):29.[doi:10.3969/j.issn.1001-3849.2021.12.006]
WANG Chaolin*,SONG Bin,LIU Juan,et al.The Effectiveness of Laser Texturing Technology in Surface Treatment of the Bonding Quality of Helicopter Slurry Pack[J].Plating & Finishing,2021,(03):29.[doi:10.3969/j.issn.1001-3849.2021.12.006]
[5]朱云龙,孙 芳*,姜宏伟,等.磁控溅射法制备纳米Cu薄膜及其微结构的研究[J].电镀与精饰,2022,(3):29.[doi:10.3969/j.issn.1001-3849.2022.03.006]
ZHU Yunlong,SUN Fang*,JIANG Hongwei,et al.Preparation and Microstructure of Cu Thin Films by Magnetron Sputtering[J].Plating & Finishing,2022,(03):29.[doi:10.3969/j.issn.1001-3849.2022.03.006]
[6]朱云龙,孙 芳*,姜宏伟.磁控溅射法制备Cu/ITO薄膜及其耐蚀性能研究[J].电镀与精饰,2023,(2):86.[doi:10.3969/j.issn.1001-3849.2023.02.014]
Zhu Yunlong,Sun Fang*,Jiang Hongwei.Preparation and corrosion resistance performance of magnetron sputtered Cu/ITO films[J].Plating & Finishing,2023,(03):86.[doi:10.3969/j.issn.1001-3849.2023.02.014]
[7]李旭勇,李 琼,魏 娜,等.无氰镉钛镀液中钛离子浓度对镀层性能的影响[J].电镀与精饰,2023,(12):15.[doi:doi : 10.3969/j.issn.1001-3849.2023.12.003]
Li Xuyong,Li Qiong,Wei Na,et al.Effect of titanium ion concentration in cyanide-cadmium-free titanium plating solutions on coating properties[J].Plating & Finishing,2023,(03):15.[doi:doi : 10.3969/j.issn.1001-3849.2023.12.003]
[8]李积鹏,姚 莹*,刘小华,等.无铬耐指纹热镀铝锌钢板黑斑缺陷研究[J].电镀与精饰,2024,(2):87.[doi:10.3969/j.issn.1001-3849.2024.02.012]
Li Jipeng,Yao Ying*,Liu Xiaohua,et al.Study on black spot defect of chromium-free fingerprint-resistant hot-dip aluminized zinc steel plate[J].Plating & Finishing,2024,(03):87.[doi:10.3969/j.issn.1001-3849.2024.02.012]
[9]张锦园,张 杰,白忠波,等.硫酸钛-钨酸钠复合添加剂对电解铜箔后处理形貌及抗剥离强度的影响[J].电镀与精饰,2024,(5):101.[doi:10.3969/j.issn.1001-3849.2024.05.014]
Zhang Jinyuan,Zhang Jie,Bai Zhongbo,et al.Effect of titanium sulfate and sodium tungstate composite additive on morphology and performance of electrolytic copper foil posttreatment?/html>[J].Plating & Finishing,2024,(03):101.[doi:10.3969/j.issn.1001-3849.2024.05.014]