[1]杨惠良*.硫酸盐镀液中紫铜电沉积Ni-Co/WC复合镀层的工艺条件优化[J].电镀与精饰,2021,(6):30-34.[doi:10.3969/j.issn.1001-3849.2021.06.007]
　YANG Huiliang*.Optimization of Process Conditions for Electrodeposition of Ni-Co/WC Composite Coatings on Red Copper from Sulfate Bath[J].Plating & Finishing,2021,(6):30-34.[doi:10.3969/j.issn.1001-3849.2021.06.007]
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硫酸盐镀液中紫铜电沉积Ni-Co/WC复合镀层的工艺条件优化()

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG]

卷:
期数:
2021年6
页码:
30-34
栏目:
出版日期:
2021-06-08

文章信息/Info

Title:
Optimization of Process Conditions for Electrodeposition of Ni-Co/WC Composite Coatings on Red Copper from Sulfate Bath
作者:
杨惠良*
德州学院，山东 德州 253000
Author(s):
YANG Huiliang*
Dezhou University， Dezhou 253000， China
关键词:
Ni-Co/WC复合镀层; 电沉积; 硫酸盐镀液; 硬度
Keywords:
Ni-Co/WC composite coating electrodeposition sulfate bath hardness
DOI:
10.3969/j.issn.1001-3849.2021.06.007
文献标志码:
A
摘要:
在硫酸盐镀液中加入纳米WC颗粒，通过电沉积在紫铜表面制备了Ni-Co/WC复合镀层。采用单因素分析法考察了镀液中纳米颗粒浓度、温度、阴极电流密度和搅拌速度对复合镀层硬度的影响，确定了电沉积Ni-Co/WC复合镀层的最佳工艺条件为：镀液中纳米颗粒浓度11 g/L、温度60 ℃、阴极电流密度5 A/dm2、搅拌速度450 r/min。在最佳工艺条件下电沉积的Ni-Co/WC复合镀层硬度达到467.2 HV，显著高于紫铜的硬度（116.7 HV），也高于对照的Ni-Co合金镀层硬度（416.0 HV）。最佳条件下制备的Ni-Co/WC复合镀层能起到表面强化的作用，为解决紫铜硬度较低的问题提供了借鉴。
Abstract:
Ni-Co/WC composite coatings were electrodeposited on red copper from a sulfate bath containing nano-WC particles. The effects of the concentration of nanoparticles in the bath, temperature, cathode current density and stirring rate on the hardness of composite coatings were investigated by single factor analysis, and the optimal process conditions for electrodeposition of Ni-Co/WC composite coatings were determined as follows: the concentration of nanoparticles in the bath was 11 g/L, temperature was 60 ℃, cathode current density was 5 A/dm2, stirring rate was 450 r/min. The hardness of Ni-Co/WC composite coating electrodeposited under the optimal process conditions reached 467.2 HV, which was significantly higher than that of red copper （116.7 HV） and also higher than that of contrastive Ni-Co alloy coating （416.0 HV）. The Ni-Co/WC composite coating prepared under the best conditions can play a role of surface strengthening and provide a reference for solving the problem of low hardness of red copper.

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备注/Memo

备注/Memo:
收稿日期： 2020-05-02；修回日期： 2020-06-25
作者简介： 杨惠良（1965－）， 本科， 高级讲师， email: dezhou253000@163.com
基金项目： 山东省科技厅项目（19GGX107112）
更新日期/Last Update: 2021-06-10