XIANG Qian,WANG Wenchang*,ZHANG Ran,et al.Effect of Nickel Ion Concentration on Electroless Plating of Ni-Mo-P Alloy in Deep Eutectic Solvent[J].Plating & Finishing,2022,(12):17-24.[doi:10.3969/j.issn.1001-3849.2022.12.003]
镍离子浓度对低共熔溶剂中化学镀Ni-Mo-P合金镀层的影响
- Title:
- Effect of Nickel Ion Concentration on Electroless Plating of Ni-Mo-P Alloy in Deep Eutectic Solvent
- 关键词:
- 低共熔溶剂; 化学镀; Ni-Mo-P 合金; 镍离子浓度; 耐蚀性
- Keywords:
- deep eutectic solvent ; electroless plating ; Ni-Mo-P alloy ; nickel ion concentration ; corrosion resistance
- 分类号:
- TB37
- 文献标志码:
- A
- 摘要:
- 低共熔溶剂具有易降解、电化学窗口宽、合成简单及较低的成本等优点，被认为是最理想的绿色溶剂。以氯化胆碱 - 乙二醇（摩尔比为 1 ∶ 2 ）为原料制备低共熔溶剂，以硫酸镍、钼酸钠为主盐，次磷酸钠为还原剂，在低共熔溶剂中化学镀 Ni-Mo-P 合金。考察了硫酸镍浓度的变化对化学镀 Ni-Mo-P 合金镀层的化学及物理性能影响。研究结果表明，当硫酸镍的浓度为 15.0 g·L -1 时，沉积速率达到 0.10?m·h -1 ，镀层平整致密，镀层中 Mo 元素含量达到最大值 19.20 wt.% ，该浓度下制备的镀层性能最佳。
- Abstract:
- ： The deep eutectic solvents have the advantages of easy degradation ， wide electrochemical window ， simple synthesis and low cost ， and are considered to be the most ideal green solvents. In this paper ， the deep eutectic solvent was prepared with choline chloride and ethylene glycol （ mole ratio 1 ∶ 2 ） as raw material. The main salt was nickel sulfate and sodium molybdate ， reducing agent was sodium hypophosphate. Ni-Mo-P alloy was electroless plated in the deep eutectic solvent. The influence of the change of nickel sulfate concentration on the chemical and physical properties of electroless Ni-Mo-P alloy coatings was investigated. The results show that when the concentration of nickel sulfate is 15.0 g·L -1 ， the deposition rate reaches 0.10 ?m·h -1 ， the coating is flat and compact ， and Mo content in the coating reaches a maximum of 19.20 wt.% ， the corrosion resistance of the coating prepared is the best.
参考文献/References:
[1] Ouchi T, Shimano N, Homma T, et al. CoNiP electroless deposition process for fabricating ferromagnetic nanodot arrays[J]. Electrochimica Acta, 2011, 56(26): 9575-9580.
[2] Shacham-Diamand Y, Osaka T, Okinaka A, et al. 30 years of electroless plating for semiconductor and polymer micro-systems[J]. Microelectronic Engineering, 2015, 132: 35-45.
[3] Ohno I, Wakabayashi O, Haruyama S, et al. Anodic oxidation of reductants in electroless plating[J]. Journal of the Electrochemical Society, 1985, 132(10): 2323-2330.
[4] Anik T, Touhami M E, Himm K, et al. Influence of pH solution on electroless copper plating using sodium hypophosphite as reducing agent[J]. Intemational Journal of Electrochemical Science, 2012, 7: 2009-2018.
[5] Wu F B, Tien S K, Chen W Y, et al. Microstructure evaluation and strengthening mechanism of Ni-P-W alloy comings[J]. Surface and Coating Technology, 2004, 177: 312-316.
[6] Jung M Y, Nam C S, Lee B S, et al. Study on the effect of the thiourea on nano-mechanical properties and microstructures of the electroformed thin Ni-P foil[J]. Korean J Met Mater, 2020, 58 (1): 1-6.
[7] M’hanni N, Galai M, Anik T, et al. In?uence of additives selected calix[4]arenes on electroless copper plating using hypophosphite as reducing agent[J]. Surface Coatings Technology, 2017, 310: 8-16.
[8] Elhaloui T, Anik K, Touhami M E, et al. Investigation of ammonium acetate effect on electroless Ni-P deposits[J]. Mater Environ Sci, 2015, 6 (7): 2028-2036.
[9] Zhang D, Okajima T, Lu D, et al. Electroless deposition of platinum nanoparticles in room-temperature ionic liquids[J]. Langmuir, 2013, 29(38): 11931-11940.
[10] Uraz C. Effect of room temperature ionic liquids for electroless nickel plating on acrylonitrile butadiene styrene plastic[J]. Medziagotyra, 2019, 3(25): 276-280.
[11] Abbott A P, Capper G, Davies D L, et al. Novel solvent properties of choline chloride/urea mixtures [J]. Chemical Communications, 2003(1): 70-71.
[12] 高琼 , 昝灵兴 , 丁杰 , 等 . 离子液体 1- 乙基 -3- 甲基咪唑四氟硼酸盐对化学镀铜的影响 [J]. 电镀与精饰 , 2012, 34(5): 1-4.
[13] 王钰蓉 , 周阳 , 王文昌 , 等 . 氯化胆碱溶液中铜置换银机理及动力学研究 [J]. 电镀与精饰 , 2013, 35(10): 5-9.
[14] Rimsza J M, Corrales L R. Adsorption complexes of cop-per and copper oxide in the deep eutectic solvent 2:1 urea-choline chloride[J]. Computational and Theoretical Chemistry, 2012, 987: 57-61.
[15] Tian G C, Li L I, Hua Y X, et al. Application of ionic liquids in hydro-metallurgy of nonferrous metals[J]. Nonferrous Metals Society, 2010, 20(3): 513-520.
[16] Azizi N, Batebi E, Bagherpour S, et a1. Natural deep eutectic salt promoted regioselective reduction of epoxides and carbonyl compounds[J]. RSC Adv, 2012, 2(6): 2289-2293.
[17] Durand E, Lecomte J, Villeneuve P, et a1. Deep eutectic solvents: Synthesis, application, and focus on lipase-catalyzed reactions[J]. European Journal of Lipid Science and Technology, 2013, 115(4): 379-385.
[18] Bi W, Tian M, Row K H, et a1. Evaluation of alcohol-based deep eutectic solvent in extraction and determination of flavonoids with response surface methodology optimization[J]. Journal of Chromatography A, 2013, 1285: 22-30.
[19] De Maria P D, Maugeri Z. Ionic liquids in bio-transformations: From proof of concept to emerging deep- eutectic-solvents[J]. Current Opinion in Chemical Biology, 2011, 15(2): 220-225.
[20] 王明 , 张庆芳 , 等 . 硫酸镍对 Ni-W-P 化学镀层性能的影响 [J]. 电镀与环保 , 2016, 36(6): 25-27.
[21] 邱学军 . 氯化胆碱 - 尿素低共熔溶剂中电解制备微细铜粉以及铜离子稳定形态的研究 [D]. 昆明 : 昆明理工大学 , 2017.
[22] Abbott A P, Frisch G, Haptle J, et al. Anodic dissolution of metals in ionic liquids[J]. Progress in Natural Science: Materials International, 2015, 25(6): 595-602.
[23] 李苗 , 陈必清 , 何敏 , 等 . 氯化胆碱 - 尿素低共熔离子液体的粘度和电导率 [J]. 湖北大学学报 ( 自然科学版 ),2018, 40(1): 96-102.
[24] Abbott A P, Harris R C, Ryder K S, et al. Application of hole theory to define ionic liquids by their transport properties[J]. The Journal of Physical Chemistry, 2007, 111(18): 4910-4913.
[25] Abbott A P. Application of hole theory to the viscosity of ionic and molecular liquids[J]. ChemPhysChem, 2004, 5(8): 1242-1246.
[26] 吴玉程 , 解挺 , 郑玉春 , 等 . 化学沉积 Ni-Mo-P 合金 [J]. 材料保护 , 1997(1): 17-19.
[27] Costovici S, Manea A C, Visan T, et al. et al. Investigation of Ni-Mo and Co-Mo alloys electrodeposition involving choline chloride based ionic liquids[J]. Electrochimica Acta, 2016(207): 97-111.
[28] 赵旭山 . Ni-SiC 复合沉积电极过程动力学及镀层电化学腐蚀行为研究 [D]. 长沙 : 中南大学 , 2008.
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备注/Memo
收稿日期： 2022-08-29 修回日期： 2022-10-27 作者简介： 向倩（ 1996 —），女，研究生，研究方向：表面处理， email ： 1774276254@qq.com * 通信作者： 王文昌， email ： King717@qq.com ；陈智栋， email ： zdchen@cczu.edu.cn 基金项目： 江苏省高校自然科学基金项目 （ 20KJB150029 ）