ZHANG Mi,QIAN Xun,SU Yongqing*,et al.Research on Copper Salt Sensitization-Activation Method of Electroless Plating on Ceramics[J].Plating & Finishing,2021,(9):6-12.[doi:10.3969/j.issn.1001-3849.2021.09.002]
陶瓷化学镀中铜盐敏化活化方法的研究
- Title:
- Research on Copper Salt Sensitization-Activation Method of Electroless Plating on Ceramics
- 文献标志码:
- A
- 摘要:
- 本文针对陶瓷化学镀中活化过程采用贵金属钯盐或银盐的现状,研究了采用铜盐进行敏化和活化的方法,以节省贵金属降低生产成本。实验结果表明,经前处理后的陶瓷放入0.25 g·L-1的稀CuSO4溶液中,室温下浸泡处理1 min.,用自来水和蒸馏水清洗后,再放入24 g·L-1 CuSO4·5H2O溶液中室温下浸泡15 min.,随后放入pH为8~9的NaOH溶液中,浸泡20 min.,即完成敏化。将敏化后的陶瓷放入含18 g·L-1 NaOH和50 mL·L-1 HCHO溶液中,在65 ℃浸泡40 min,完成活化。活化后的陶瓷可进行传统的化学镀铜,铜镀层均匀,致密,有很好的晶体结构,与基体有良好的结合力。
- Abstract:
- In this paper, according to the current situation of using precious metal palladium salt or silver salt in the activation process of ceramic electroless plating, the method of using copper salt for sensitization and activation was studied, in order to save precious metal and reduce production cost. The results showed that the pretreated ceramics was immersed in 0.25 g·L-1 CuSO4 solution for 1 min at room temperature. After cleaning with tap water and distilled water, the pretreated ceramics was immersed in 24 g·L-1 CuSO4·5H2O solution for 15 min at room temperature. Then the ceramics were immersed in pH 8 ~ 9 NaOH solution for 20 min, and the sensitization was completed. The sensitized ceramics was put into the solution containing 18 g·L-1 NaOH and 50 mL·L-1 HCHO, and soaked at 65 ℃ for 40 min to complete the activation. The activated ceramics could be electroless plated with copper by traditional method. The copper coating was uniform, dense, with good crystal structure and good adhesion to the substrate.
参考文献/References:
[1] 郑强, 蔡苇, 陈飞, 等. 氧化铝陶瓷基板化学镀铜工艺优化[J]. 表面技术, 2017, 46(4): 212-216.
Zheng Q, Cai W, Chen F, et al. Process optimization of electroless copper plating on alumina ceramic substrate[J]. Surface Technology, 2017, 46(4): 212-216 (in Chinese).
[2] Lv M, Liu J G, Wang S H, et al. Higher-resolution selective metallization on alumina substrate by laser direct writing and electroless plating[J]. Applied Surface Science, 2016, 366: 227-232.
[3] Kim K, Jin S, Kwon O J. Effect of Pd precursor status on sonochemical surface activation in Cu electroless deposition[J]. Applied Surface Science, 2016, 364: 45-50.
[4] 高万旭, 叶健, 李全良. ABS塑料化学镀铜研究[J]. 精细化工, 2019, 50(3): 36-38.
Gao W X, Ye J, Li Q L. Research on electroless copper plating of ABS plastic[J]. Fine Chemicals, 2019, 50(3): 36-38 (in Chinese).
[5] Liu B S, Zhang F M, Yang X Y. Formation and performance of ohmic contact electrodes on BaTiO3-based thermistors by localized electroless Cu-plating[J]. Thin Solid Films, 2010, 519(1): 373-377.
[6] Ma H F, Liu Z B, Wu L, et al. Study of a pre-treatment process for electroless copper plating on ceramics[J]. Thin Solid Films, 2011, 519(22): 7860-7863.
[7] Tseng C, Lin Y, Liu T, et al. The pH-sensitive Pd nanoparticles as ink for ink-jet printing technology and electroless Cu metallic patterns on indium-doped tin oxide substrate[J]. Thin Solid Films, 2013, 536: 81-87.
[8] Su W, Yao L B, Yang F, et al. Electroless plating of copper on surface-modified glass substrate[J]. Applied Surface Science, 2011, 257(8): 8067-8071.
[9] Fatema U K, Gotoh Y. Highly adhesive metal plating on zylon fiber via iodine pretreatment[J]. Applied Surface Science, 2011, 258(2): 883-889.
[10] Lu Y X, Liang Q, Xue L L. Palla-dium-free catalytic electroless copper deposition on bamboo fabric: preparation, morphology and electro-magnetic properties[J]. Applied Surface Science, 2012, 258(10): 4782-4787.
[11] Nasrabadi H B, Sajjadi S A, Zebarjad S M. An optimization analysis on electroless deposition of Al2O3/Cu core-shell nanostructures[J]. Applied Surface Science, 2012, 261: 166-173.
[12] Wang Y, Bian C, Jing X L. Adhesion improvement of electroless copper plating on phenolic resin matrix composite through a tin-free sensitization process[J]. Applied Surface Science, 2013, 271: 303-310.
[13] Tian Q H, Guo X Y. Electroless copper plating on microcellular polyurethane foam[J]. Transactions of Nonferrous Metals Society of China, 2010, 20(suppl1): 283-287.
[14] Chen Y C, Liu R L, Chen X, et al. Microwave-assisted activation for electroless nickel plating on PMMA microspheres[J]. Applied Surface Science, 2011, 257(15): 6734-6740.
[15] Liu Y K, Feng Y J, Tian Y. Electroless nickel plating on the surface of carbon fibers[J]. Journal of Harbin Institute of Technology (New Seriers), 2009, 16(5): 601-607.
[16] Wang H, Jia J F, Song H Z, et al. The preparation of Cu-coated Al2O3 composite powders by electroless plating[J]. Ceramics International, 2011, 37(7): 2181-2184.
[17] 王宏. Al2O3陶瓷制品化学镀铜与表面处理工艺[J]. 电镀与涂饰, 2010, 29(3): 24-25.
Wang H. Electroless copper plating and surface treatment for Al2O3 ceramics[J]. Electroplating and Finishing, 2010, 29(3): 24-25 (in Chinese).
[18] 钟小婧, 秦明礼, 李慧, 等. AlN陶瓷表面化学镀镍工艺[J]. 真空电子技术, 2011(8): 14-17.
Zhong X J, Qin M L, Li H, et al. The technology research of electroless nickel plating on AlN ceramic surface[J]. Vacuum Electronics, 2011(8):14-17 (in Chinese).
[19] 袁军平, 林伟河, 陆丽仪, 等. 表面粗化对氧化锆精密陶瓷化学镀镍的影响[J]. 腐蚀与防护, 2017, 38(4): 268-272.
Yuan J P, Lin W H, Lu L Y, et al. Effect of surface roughening on chemical nickel-plating on zirconia precision ceramic[J]. Corrosion and Protection, 2017, 38(4): 268-272 (in Chinese).
[20] 杨志锋. 一款化学镀铜用的活化浓缩液的配制及应用研究[J]. 电镀涂覆, 2019, 4: 40-42.
Yang Z F. Preparation and utilization palladium colloid concentrate for electroless copper deposition[J]. Electroplating and Coating, 2019, 4: 40-42 (in Chinese).
[21] 宋秀峰, 傅仁利, 何洪, 等. 氧化铝陶瓷基板化学镀铜金属化及镀层结构[J]. 电子元件与材料, 2007, 26(2): 40-42.
Song X F, Fu R L, He H, et al. Metalliza-tion and structure of copper layer on Al2O3 ceramic by electroless copper plating[J]. Electronic Components and Materials, 2007, 26(2): 40-42 (in Chinese).
[22] 袁李俊, 廖鸿, 卢泽龙, 等. 非贵金属活化氧化铝陶瓷基板化学镀铜研究[J]. 热加工工艺, 2015, 44(4): 148-151.
Yuan L J, Liao H, Lu Z L, et al. Study on non-noble metal activation for electroless plating on alumina ceramic substrate[J]. Hot Working Technology, 2015, 44 (4): 148-151 (in Chinese).
[23] 陈智栋, 于清路, 王文昌, 等. 铝基板表面氧化铝层分子自组装活化法镀铜[J]. 电子元件与材料, 2008, 27(12): 36-39.
Chen Z D, Yu Q L, Wang W C, et al. Technology of electroless copper plating on alumina of aluminum substrate surface[J]. Electronic Components and Materials, 2008, 27(12): 36-39 (in Chinese).
[24] 宁洪龙, 耿志挺, 马莒生, 等. 陶瓷基板化学镀铜预处理的研究[J]. 稀有金属材料与工程, 2004, 33(3): 321-323.
Ning H L, Geng Z T, Ma J S, et al. Research of electroplating Cu on pretreatment ceramic substrates[J]. Rare Metal Materials and Engineering, 2004, 33(3): 321-323 (in Chinese).
[25] 郭登峰, 王文昌, 光崎尚利, 等. 铝基氧化铝表面化学镀铜工艺研究[J]. 电镀与精饰, 2009, 31(10): 1-4.
Guo D F, Wang W C, Mitsuzaki N, et al. Study on electroless copper plating technology of alumina layer on aluminum substrate[J]. Plating and Finishing, 2009, 31(10): 1-4 (in Chinese).
[26] 朱东, 储荣邦. 在陶瓷上镀耐高温耐高真空的厚铜层工艺[J]. 电镀与涂饰, 2014, 33(1): 15-16.
Zhu D, Chu R B. Heat and high-vacuum resistant thick copper plating process on ceramic[J]. Electroplating and Finishing, 2014, 33(1): 15-16 (in Chinese).
[27] 朱焱, 孔小雁, 江茜, 等. 表面活性剂在陶瓷化学镀铜工艺中的作用[J]. 中国表面工程, 2012, 25(1): 76-82.
Zhu Y, Kong X Y, Jiang Q, et al. The role of surfactant in the electroless copper plating on ceram-ics[J]. China Surface Engineering, 2012, 25(1): 76-82 (in Chinese).
[28] 钱逊. 非金属化学镀的敏化活化新方法[D]. 昆明: 云南师范大学化学化工学院, 2018.
[29] 张允成, 胡如南, 向荣. 电镀手册(上册 第二版)[M]. 北京: 国防工业出版社, 1997 .
相似文献/References:
[1]蒲 帅*,张 进,黎 帅.化学镀不溶性颗粒分散性的研究进展[J].电镀与精饰,2019,(8):29.[doi:10.3969/j.issn.1001-3849.2019.08.007]
PU Shuai*,ZHANG Jin,LI Shuai.Research Progress on the Dispersion of Insoluble Particles of Electroless Plating[J].Plating & Finishing,2019,(9):29.[doi:10.3969/j.issn.1001-3849.2019.08.007]
[2]赵 涛,张德忠,毛祖国.氯化钯实验评价化学镀镍溶液稳定性的方法与优化[J].电镀与精饰,2019,(10):43.[doi:10.3969/j.issn.1001-3849.2019.10.010]
ZHAO Tao,ZHANG Dezhong,MAO Zuguo.Method and Optimization of Palladium Chloride Test for Evaluating the Stability of Electroless Nickel Plating Solution[J].Plating & Finishing,2019,(9):43.[doi:10.3969/j.issn.1001-3849.2019.10.010]
[3]李 燕,金 文,吕依月,等.螺旋藻基化学镀镍的工艺研究[J].电镀与精饰,2019,(11):22.[doi:10.3969/j.issn.1001-3849.2019.11.006]
LI Yan,JIN Wen,LV Yiyue,et al.Study on Electroless Nickel Plating on Spirulina[J].Plating & Finishing,2019,(9):22.[doi:10.3969/j.issn.1001-3849.2019.11.006]
[4]贾启华,许晓娟*.沉积时间对镁合金化学镀镍的影响[J].电镀与精饰,2019,(12):1.[doi:10.3969/j.issn.1001-3849.2019.12.001]
JIA Qihua,XU Xiaojuan*.Effect of Deposition Time on Direct Electroless Plating of Magnesium Alloys[J].Plating & Finishing,2019,(9):1.[doi:10.3969/j.issn.1001-3849.2019.12.001]
[5]贾启华.超声波辅助化学镀工艺及性能研究[J].电镀与精饰,2020,(3):24.[doi:10.3969/j.issn.1001-3849.2020.03.005]
JIA Qihua.Study on Ultrasound-assisted Electroless Plating Technology and Properties[J].Plating & Finishing,2020,(9):24.[doi:10.3969/j.issn.1001-3849.2020.03.005]
[6]闫 申*,刘 菲.化学镀时间对Ni-Co-P合金镀层性能的影响[J].电镀与精饰,2020,(6):18.[doi:10.3969/j.issn.1001-3849.2020.06.0040]
YAN Shen*,LIU Fei.Effect of Electroless Plating Time on Properties of Ni-Co-P Alloy Coating[J].Plating & Finishing,2020,(9):18.[doi:10.3969/j.issn.1001-3849.2020.06.0040]
[7]谭宇硕*,容旭巍,韩 瀚,等.45钢杆件化学镀Ni-Co-P及Ni-W-P镀层的性能比较[J].电镀与精饰,2020,(9):1.
TAN Yushuo*,RONG Xuwei,HAN Han.Comparison of Properties of Ni-Co-P Coating and Ni-W-P Coating Prepared by Electroless Plating on Surface of 45 Steel Rod-Shaped Parts[J].Plating & Finishing,2020,(9):1.
[8]韩二锋*,姚斌.硝酸镧浓度对汽车模具导柱化学镀Ni-P/PTFE复合镀层性能的影响[J].电镀与精饰,2020,(11):10.[doi:10.3969/j.issn.1001-3849.2020.11.0030]
HAN Erfeng*,YAO Bin.Effect of Concentration of Lanthanum Nitrate on the Properties of Ni-P/PTFE Composite Coatings Prepared by Electroless Plating on Guide Pillar of Automobile Mould[J].Plating & Finishing,2020,(9):10.[doi:10.3969/j.issn.1001-3849.2020.11.0030]
[9]李鹏飞*,颜武岳.电厂冷却水管化学镀Ni-Co-P/PTFE复合镀层及其防垢耐蚀性能[J].电镀与精饰,2021,(1):18.[doi:10.3969/j.issn.1001-3849.2021.01.0040]
LI Pengfei*,YAN Wuyue.Electroless Plating of Ni-Co-P/PTFE Composite Coating on Power Plant Cooling Water Pipe and Its Anti-fouling Performance and Corrosion Resistance[J].Plating & Finishing,2021,(9):18.[doi:10.3969/j.issn.1001-3849.2021.01.0040]
[10]孔 琳,刘品潇*,孔 斌,等.A3钢表面化学镀Ni-P/Ni-Mo-P双层镀层[J].电镀与精饰,2021,(1):25.[doi:10.3969/j.issn.1001-3849.2021.01.0050]
KONG Lin,LIU Pinxiao*,KONG Bin.Electroless Plating of Ni-P/Ni-Mo-P Bilayered Coating on A3 Steel[J].Plating & Finishing,2021,(9):25.[doi:10.3969/j.issn.1001-3849.2021.01.0050]
备注/Memo
收稿日期: 2020-12-04;修回日期: 2021-02-09
作者简介: 张咪(1994—),女,硕士研究生,email:1059823763@qq.com
通信作者: 苏永庆,email:947364529@qq.com
基金项目: 国家自然科学